Radio frequency identification tag having a printed antenna and method

• US 6,018,299 A
• Filed: 06/23/1998
• Issued: 01/25/2000
• Est. Priority Date: 06/09/1998
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Eberhardt, Noel H.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US09/103,226
• Time in Patent Office: 581 Days
• Field of Search: 340/572.7, 340/572.8, 343/789, 343/906, 343/700 MS, 29/825, 29/829, 29/846, 29/847, 29/729, 29/739, 29/740, 29/760, 257/673, 156/250, 428/901, 361/748, 361/760, 361/761, 361/765, 361/767, 361/777, 361/779
• US Class Current: 340/572.7
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: B65D 5/4233 Cards, coupons, labels or the like formed separately from the container or lid
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15157 Top view
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: Y02A 90/10 Information and communication technologies [ICT] supporting adaptation to climate change, e.g. for weather forecasting or climate simulation
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths

Abstract

A radio frequency identification tag (14) includes a radio frequency identification tag circuit chip (12) coupled to an antenna (10) including a conductive pattern (22) printed onto a substrate (16). The substrate may form a portion of an article, a package, a package container, a ticket, a waybill, a label and/or an identification badge. The conductive pattern includes a first coupling region (28) and a second coupling region (30) arranged for coupling to the radio frequency identification tag circuit chip. The first coupling region and the second coupling region are precisely located and isolated from one another via an aperture (31) formed in the substrate.

Claims

1. A radio frequency identification tag comprising:

a radio frequency identification tag circuit chip secured to an antenna, the antenna including a first antenna element and a second antenna element formed on a surface of a substrate, the first antenna element isolated from the second antenna element by an aperture formed in the substrate.

2. The radio frequency identification tag of claim 1, the first antenna element including a first coupling region and the second antenna element including a second coupling region, and the aperture isolating the first coupling region and the second coupling region.

3. The radio frequency identification tag of claim 2, the first coupling region and the second coupling region arranged for coupling to the radio frequency identification tag circuit chip.

4. The radio frequency identification tag of claim 1, the aperture formed relative to a substrate reference.

5. The radio frequency identification tag of claim 4, the substrate reference comprising an edge of the substrate.

6. The radio frequency identification tag of claim 1, the antenna being a conductive pattern printed on the surface of the substrate.

7. The radio frequency identification tag of claim 1, a conductive adhesive coupling the radio frequency identification tag circuit chip to the antenna.

8. A radio frequency identification tag comprising:

a radio frequency identification tag circuit chip secured to an antenna, the antenna including a first antenna element and a second antenna element formed on a surface of a substrate, the first antenna element isolated from the second antenna element by an indentation extending through the surface and the substrate, the antenna extending into the indentation and contacting side walls thereof.

9. The radio frequency identification tag of claim 8, wherein the first antenna element has a first coupling region and the second antenna element has a second coupling region, the first coupling region and the second coupling region disposed on at least a portion of the indentation.

10. The radio frequency identification tag of claim 9, the first coupling region and the second coupling region arranged for coupling to the radio frequency identification tag circuit chip.

11. The radio frequency identification tag of claim 8, the indentation formed relative to a substrate reference.

12. The radio frequency identification tag of claim 11, the substrate reference comprising at least an edge of the substrate.

13. The radio frequency identification tag of claim 8, the antenna being a conductive pattern printed on the surface.

14. The radio frequency identification tag of claim 8, a conductive adhesive coupling the radio frequency identification tag circuit chip to the antenna.

15. A radio frequency identification tag comprising:

a radio frequency identification tag circuit chip secured to an antenna, the antenna including a first antenna element and a second antenna element formed on a surface of a substrate, the first antenna element isolated from the second antenna element by an aperture formed in the substrate, and a recess formed in the substrate adjacent the aperture.

16. The radio frequency identification tag of claim 15, the first antenna element including a first coupling region and the second antenna element including a second coupling region, and the aperture isolating the first coupling region and the second coupling region.

17. The radio frequency identification tag of claim 16, the first coupling region and the second coupling region extending into the recess.

18. The radio frequency identification tag of claim 17, the first coupling region and the second coupling region arranged for coupling to the radio frequency identification tag circuit chip.

19. The radio frequency identification tag of claim 15, the aperture formed relative to a substrate reference.

20. The radio frequency identification tag of claim 19, the substrate reference comprising at least one edge of the substrate.

21. The radio frequency identification tag of claim 15, the antenna being a conductive pattern printed on a surface of the substrate.

22. The radio frequency identification tag of claim 15, a conductive adhesive coupling the radio frequency identification tag circuit chip to the antenna.

23. The radio frequency identification tag of claim 15, the radio frequency identification tag circuit chip being disposed in the recess and below the surface.

24. An antenna for a radio frequency identification tag comprising:

a conductive pattern printed on a surface of a substrate and an aperture formed in the substrate separating the conductive pattern into a first antenna element and a second antenna element.

25. The antenna of claim 24, the first antenna element including a first coupling region and the second antenna element including a second coupling region, the first coupling region and the second coupling region defined by the aperture.

26. The antenna of claim 24, wherein the substrate forms a portion of an article of manufacture selected from the group consisting of:

a package, a package container, an envelope, a ticket, a waybill, a label, and an identification badge.

27. The antenna of claim 24, the aperture formed relative to a substrate reference.

28. The antenna of claim 27, the substrate reference comprising an edge of the substrate.

29. An antenna for a radio frequency identification tag comprising:

a conductive pattern disposed on a surface of a substrate and on a portion of an indentation in the substrate, said indentation extending through the surface and partially into the substrate and separating the conductive pattern into a first antenna element and a second antenna element.

30. The antenna of claim 29, the first antenna element including a first coupling region and the second antenna element including a second coupling region, the first coupling region and the second coupling region defined by the indentation.

31. The antenna of claim 29, the antenna forming a portion of one of an article, a package, a package container, an envelope, a ticket, a waybill, a label, and an identification badge.

32. The antenna of claim 29, the indentation formed relative to a substrate reference.

33. The antenna of claim 32, the substrate reference comprising an edge of the substrate.

34. An antenna for a radio frequency identification tag comprising:

a conductive pattern printed on a surface of a substrate, an aperture formed in the substrate separating the conductive pattern into a first antenna element and a second antenna element and a recess formed in the substrate and adjacent the aperture.

35. The antenna of claim 34, the first antenna element including a first coupling region and the second antenna element including a second coupling region, the first coupling region and the second coupling region defined by the aperture.

36. The antenna of claim 34, the antenna forming a portion of one of an article, a package, a package container, an envelope, a ticket, a waybill, a label, and an identification badge.

37. The antenna of claim 34, the aperture formed relative to a substrate reference.

38. The antenna of claim 37, the substrate reference comprising an edge of the substrate.

39. A method for making a radio frequency identification tag, the method comprising the steps of:

providing a substrate having a surface;

printing a conductive pattern on the surface;

forming an aperture in the substrate relative to a substrate reference, the aperture separating the conductive pattern into a first antenna element and a second antenna element; and

electrically coupling a radio frequency identification tag circuit chip to the first antenna element and the second antenna element.

40. The method of claim 39, wherein the step of printing a conductive pattern comprises, printing a first antenna element and a second antenna element joined by a first coupling region and a second coupling region, and the step of forming an aperture comprises forming an aperture separating the first coupling region and the second coupling region.

41. The method of claim 40, the radio frequency identification tag circuit chip being coupled to the first coupling region and the second coupling region.

42. The method of claim 39, the step of forming an aperture comprising:

locating the substrate within a fixture, and

punching the aperture in the substrate.

43. A method for making a radio frequency identification tag, the method comprising the steps of:

providing a substrate having a surface;

printing a conductive pattern on the surface;

forming an indentation in the substrate relative to a substrate reference, the indentation separating the conductive pattern into a first antenna element and a second antenna element; and

electrically coupling a radio frequency identification tag circuit chip to the first antenna element and the second antenna element.

44. The method of claim 43, wherein the step of printing a conductive pattern comprises, printing a first antenna element and a second antenna element joined by a first coupling region and a second coupling region, and the step of forming an indentation comprises forming an indentation separating the first coupling region and the second coupling region.

45. The method of claim 44, the radio frequency identification tag circuit chip being coupled to the first coupling region and the second coupling region.

46. The method of claim 43, the step of forming an indentation comprising severing the surface and partially compressing the substrate.

47. The method of claim 46, the step of forming an indentation comprising locating the substrate within a fixture.

48. A method for making a radio frequency identification tag, the method comprising the steps of:

providing a substrate having a surface;

printing a conductive pattern on the surface;

forming an aperture in the substrate relative to a substrate reference, the aperture separating the conductive pattern into a first antenna element and a second antenna element;

forming a recess in the substrate adjacent the aperture; and

disposing a radio frequency identification tag circuit chip in the recess and electrically coupling the radio frequency identification tag circuit chip to the first antenna element and the second antenna element.

49. The method of claim 48, wherein the step of printing a conductive pattern comprises, printing a first antenna element and a second antenna element joined by a first coupling region and a second coupling region, and the step of forming an aperture comprises forming an aperture separating the first coupling region and the second coupling region.

50. The method of claim 49, the radio frequency identification tag circuit chip being coupled to the first coupling region and the second coupling region.

51. The method of claim 48, the step of forming an aperture comprising:

locating the substrate within a fixture, and

punching the aperture in the substrate.