Process for making electroformed stents

• US 6,019,784 A
• Filed: 04/03/1997
• Issued: 02/01/2000
• Est. Priority Date: 04/04/1996
• Status: Expired due to Term

• Current Assignee: Ben Z. Roitberg
• Original Assignee: Electroformed Stents, Inc.
• Inventors: Hines, Richard A.
• Primary Examiner(s): BRITTINGHAM, DEBRA
• Application Number:
  US08/819,757
• Time in Patent Office: 1,034 Days
• Field of Search: 623/1, 623/11, 623/12, 600/36, 606/194, 606/195, 606/198
• US Class Current: 128/898
• CPC Class Codes: A61F 2/91 made from perforated sheet material or tubes, e.g. perforated by laser cuts or etched holes
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/08 Perforated or foraminous objects, e.g. sieves C25D1/10 takes precedence
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/48 After-treatment of electroplated surfaces

Abstract

This invention is directed to an expandable stent useful for implantation into an artery or the like. The stents are made using electroforming techniques in which an electrically-conductive mandrel is coated with a suitable resist material, after which the resist is exposed to an appropriate light pattern and frequency so as to form a stent pattern in the resist. The mandrel is then electroplated with a suitable stent material. The mandrel is etched away once a sufficient layer of stent material is deposited, leaving a completed stent.

Claims

1. A process for producing a stent by electroforming comprising the steps of:

coating a mandrel with a resist;

exposing portions of said resist to a light pattern so as to form a stent pattern on said mandrel in said resist;

plating metal onto said mandrel in said stent pattern so as to form a stent; and

dissolving said mandrel.

2. A process as claimed in claim 1 wherein said resist is photosensitive and comprising the additional step of:

developing said resist subsequent to the step of exposing portions of said resist.

3. A process as claimed in claim 2 wherein said plating metal is an alloy comprising from about 95 to about 100 percent of a metal selected from the group consisting of gold, platinum, and nickel.

4. A process as claimed in claim 2 wherein said plating metal is an alloy comprising metal selected from the group consisting of gold, platinum, nickel, iron, silver, rhodium, and palladium.

5. A process as claimed in claim 2 in which said mandrel is a metal selected from the group consisting of copper and aluminum.

6. A process as claimed in claim 2 in which said mandrel is an angioplasty balloon.

7. A process as claimed in claim 2 wherein said plating metal is a first metal, further comprising the step of plating a second metal onto said stent subsequent to the step of removing said mandrel.

8. The product of the process as claimed in claim 2.

9. A process as claimed in claim 2 wherein the step of exposing portions of said resist to a light pattern consists of conducting light produced by light-emitting diodes through optical fibers so as to expose said stent image in said photoresist and wherein said optical fibers have output ends which are constrained in a ring configuration, said ring defining a center, and which output ends are positioned so as to focus light at the center of said ring.

10. The product of the process as claimed in claim 9.

11. A process as claimed in claim 1 wherein the step of exposing portions of said resist to a light pattern consists of selectively removing resist with a laser to form said stent pattern.

12. A process for producing a stent by electroforming comprising the steps of:

coating an electrically-conductive mandrel, which mandrel has an exterior surface, with a resist material which is photosensitive onto said exterior surface;

exposing portions of said resist material to a light pattern so as to form a stent pattern on said mandrel in said resist;

developing said resist material so as to expose a stent pattern on said exterior surface of said mandrel;

plating metal onto said mandrel in a stent pattern to form a stent; and

dissolving said mandrel.

13. A process as claimed in claim 12 wherein said plating metal is an alloy comprising from about 95 to about 100 percent of a metal selected from the group consisting of gold, platinum, and nickel.

14. A process as claimed in claim 12 wherein said plating metal is an alloy comprising metal selected from the group consisting of gold, platinum, nickel, iron, silver, rhodium, and palladium.

15. A process as claimed in claim 14 wherein the step of exposing portions of said resist to a light pattern consists of conducting light produced by light-emitting diodes through optical fibers so as to expose said stent image in said resist and wherein said optical fibers have output ends which are constrained in a ring configuration, said ring defining a center, and which output ends are positioned so as to focus light at the center of said ring.

16. The product of the process as claimed in claim 14.