Production of electrodes for electrochemical sensing
First Claim
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1. A method for producing a microelectrode, which comprises depositing an electrically-conducting layer on a non-conducting polymeric plastic substrate by thick film printing;
- applying on the conducting layer an electrically-insulating layer of photoimageable dielectric material; and
forming in the insulating layer, before or after application of the insulating layer onto the conducting layer, an array of apertures that expose the conducting layer, the apertures being formed by image-wise exposing the electrically-insulating layer of dielectric material to render parts of the insulating layer removable, followed by developing with a developer solution to remove said parts to form the array of apertures.
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Abstract
A method for the production of electrodes, especially microelectrodes, in which the (micro) electrode consists essentially of an electrically-insulating material through which apertures are formed to reveal the electrically-conducting material, is characterized in that aperture as formed by the use of a light-hardened (photopolymerizing) resist or light-softened (photoinduced breaking of bonds) resist.
294 Citations
9 Claims
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1. A method for producing a microelectrode, which comprises depositing an electrically-conducting layer on a non-conducting polymeric plastic substrate by thick film printing;
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applying on the conducting layer an electrically-insulating layer of photoimageable dielectric material; and forming in the insulating layer, before or after application of the insulating layer onto the conducting layer, an array of apertures that expose the conducting layer, the apertures being formed by image-wise exposing the electrically-insulating layer of dielectric material to render parts of the insulating layer removable, followed by developing with a developer solution to remove said parts to form the array of apertures. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for producing a microelectrode, which method comprises:
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(a) providing a non-conducting polymeric plastic substrate; (b) depositing on said plastic substrate an electrically-conducting layer; (c) applying on the electrically-conducting layer an electrically insulating photoimageable resist layer, and (d) before or after application of the electrically insulating layer on the electrically-conducting layer, forming an array of apertures in the electrically insulating photoimageable resist layer, for exposing the electrically-conducting layer on the plastic substrate, by image-wise exposure of said resist layer to a light source through a patterned mask to render portions of said resist layer removable by a developer and thereafter contacting the resist layer with developer to remove said removable portions of the resist layer.
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Specification