Printed circuit substrate with solder formed on pad-on-via and pad-off-via contacts thereof
First Claim
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1. A printed circuit substrate, comprising:
- a multilayer substrate;
at least one pad-on-via contact on the multilayer substrate;
at least one pad-off-via contact on the multilayer substrate, wherein said pad-on-via contact is at a lower height from the bottom of the substrate than said pad-off-via contact;
a first solder bump formed on said pad-on-via contact, said first solder bump having a first exposed surface on a side thereof opposing said pad-on-via contact; and
a second solder bump formed on said pad-off-via contact, said second solder bump having a second exposed surface on a side thereof opposing said pad-off-via contact, the first and second exposed surfaces being at substantially the same height from the bottom of the substrate so as to be capable of establishing a solder connection with an electronic device having contacts at the same height.
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Abstract
A printed circuit substrate having solder bumps formed on pad-on-via contacts and pad-off-via contacts. The printed circuit substrate has at least one pad-on-via contact and at least one pad-off-via contact. A first solder bump is on the pad-on-via contact and a second solder bump is on the pad-off-via contact. The first and second solder bumps are substantially the same height as measured above a horizontal plane that is substantially co-planar to the pad-off-via contact.
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Citations
4 Claims
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1. A printed circuit substrate, comprising:
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a multilayer substrate; at least one pad-on-via contact on the multilayer substrate; at least one pad-off-via contact on the multilayer substrate, wherein said pad-on-via contact is at a lower height from the bottom of the substrate than said pad-off-via contact; a first solder bump formed on said pad-on-via contact, said first solder bump having a first exposed surface on a side thereof opposing said pad-on-via contact; and a second solder bump formed on said pad-off-via contact, said second solder bump having a second exposed surface on a side thereof opposing said pad-off-via contact, the first and second exposed surfaces being at substantially the same height from the bottom of the substrate so as to be capable of establishing a solder connection with an electronic device having contacts at the same height. - View Dependent Claims (2, 3, 4)
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Specification