Method for making non-planar radio frequency device and device produced thereby

• US 6,020,862 A
• Filed: 04/09/1998
• Issued: 02/01/2000
• Est. Priority Date: 04/09/1998
• Status: Expired due to Term

• Current Assignee: North South Holdings Incorporated (Spherix Incorporated)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Newton, Charles M., Killen, William D., Smyth, Thomas P.
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): Clinger, James
• Application Number:
  US09/057,676
• Time in Patent Office: 663 Days
• Field of Search: 343/872, 343/718, 343/700 MS, 29/848, 29/846, 29/849, 29/600, 174/255, 174/68.5, 174/225
• US Class Current: 343/872
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 9/0471 Non-planar, stepped or wedge-shaped patch
• CPC Class Codes: H01Q 9/27 Spiral antennas
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0347 Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
• CPC Class Codes: H05K 2201/09018 Rigid curved substrate
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49158 with molding of insulated base

Abstract

A method for making an RF device, such as an antenna, having a non-planar shape with a high degree of accuracy includes the steps of forming an electrical conductor pattern on a flexible substrate, and positioning the flexible substrate onto the mold having the non-planar shape so that the electrical conductor pattern is exposed. The method also includes forming a rigid layer on the flexible substrate so that the exposed electrical conductor pattern will be transferred to the rigid layer upon separation from the flexible substrate. The rigid layer is separated from the flexible substrate with the electrical conductor pattern remaining on the rigid layer. The method preferably further includes forming an additional thickness of conductive material onto the electrical conductor pattern remaining on the rigid layer. The electrical conductor pattern may be a metal pattern which may be printed onto the substrate. In other embodiments, the electrical conductor pattern on the flexible substrate may be replaced by a seed material that will later be receptive to metal deposition to the define the conductive portions.

Claims

1. A method for making a non-planar radio frequency (RF) device using a mold having a corresponding non-planar shape including a generally spherical portion, the method comprising the steps of:

forming an electrical conductor pattern on a flexible substrate;

positioning and stretching the flexible substrate onto the mold having the non-planar shape including the generally spherical portion so that the electrical conductor pattern is exposed;

forming a rigid layer on the flexible substrate so that at least a portion of the exposed electrical conductor pattern will be transferred to the rigid layer upon separation from the flexible substrate; and

separating the rigid layer from the flexible substrate with at least a portion of the electrical conductor pattern remaining on the rigid layer.

2. A method according to claim 1 wherein the step of positioning and stretching the flexible substrate onto the mold comprises securing the flexible substrate to the mold so that it conforms to the non-planar shape including the generally spherical portion of the mold.

3. A method according to claim 1 further comprising the step of forming an additional thickness of conductive material onto the at least a portion of the electrical conductor pattern remaining on the rigid layer.

4. A method according to claim 3 wherein the step of forming the electrical conductor pattern on the flexible substrate comprises forming a metal pattern on the flexible substrate;

and wherein the step of forming an additional thickness of conductive material comprises plating additional metal onto the metal pattern.

5. A method according to claim 1 wherein the step of forming the electrical conductor pattern on the flexible substrate comprises forming a metal pattern.

6. A method according to claim 1 further comprising the step of supporting the flexible substrate in a generally planar orientation during the step of forming the electrical conductor pattern.

7. A method according to claim 1 further comprising the step of supporting the flexible substrate on a frame.

8. A method according to claim 1 wherein the step of forming the electrical conductor pattern on the flexible substrate comprises printing a metal polymer onto the flexible substrate.

9. A method according to claim 1 wherein the flexible substrate comprises rubber.

10. A method according to claim 1 wherein the rigid layer comprises fiberglass.

11. A method according to claim 1 wherein the step of forming the rigid layer comprises the steps of forming at least one layer of hardenable material, and hardening the at least one layer.

12. A method according to claim 1 wherein the non-planar shape of the rigid layer includes a generally spherical portion.

13. A method according to claim 12 wherein the RF device is an antenna;

and wherein the at least a portion of the electrical conductor pattern is transferred to an interior of the generally spherical portion of the rigid layer of the antenna.

14. A method for making a non-planar Radio Frequency (RF) device including conductive portions using a mold having a corresponding non-planar shape including a generally spherical portion, the method comprising the steps of:

forming a pattern of a first material on a flexible substrate;

positioning and stretching the flexible substrate onto the mold having the non-planar shape including the generally spherical portion so that the pattern of the first material is exposed;

forming a rigid layer on the flexible substrate and separating the rigid layer from the flexible substrate so that at least a portion of the exposed pattern of the first material is transferred to and remains on the rigid layer upon separation from the flexible substrate; and

forming a layer of electrically conductive material on the pattern of first material remaining on the rigid layer.

15. A method according to claim 14 wherein the step of positioning and stretching the flexible substrate onto the mold comprises securing the flexible substrate to the mold so that it conforms to the non-planar shape including the generally spherical portion of the mold.

16. A method according to claim 14 wherein the step of forming the pattern of first material on the flexible substrate comprises forming a metal pattern on the flexible substrate;

and wherein the step of forming the layer of electrically conductive material comprises plating additional metal onto the metal pattern.

17. A method according to claim 14 further comprising the step of supporting the flexible substrate in a generally planar orientation during the step of forming the electrical conductor pattern.

18. A method according to claim 14 further comprising the step of supporting the flexible substrate on a frame.

19. A method according to claim 14 wherein the step of forming the pattern of the first material on the flexible substrate comprises printing a metal polymer onto the flexible substrate.

20. A method according to claim 14 wherein the step of forming the pattern of the first material on the flexible substrate comprises forming a pattern of a seed material onto the flexible substrate to selectively receive a metal layer thereon.

21. A method according to claim 14 wherein the step of forming the rigid layer comprises the steps of forming at least one layer of hardenable material, and hardening the at least one layer.

22. A method according to claim 14 wherein the non-planar shape of the rigid layer includes a generally spherical portion.

23. A method according to claim 21 wherein the RF device is an antenna;

and wherein the electrically conductive material is formed on an interior of the generally spherical portion of the rigid layer of the antenna.

24. A method for making a non-planar antenna including electrically conductive portions using a mold having a corresponding non-planar shape including a generally spherical portion, the method comprising the steps of:

forming an electrical conductor pattern on a flexible substrate;

positioning and stretching the flexible substrate onto the mold having the non-planar shape including the generally spherical portion so that the electrical conductor pattern is exposed; and

forming a rigid layer on the flexible substrate and separating the rigid layer from the flexible substrate so that at least a portion of the exposed electrical conductor pattern is transferred to and remains on the rigid layer upon separation from the flexible substrate.

25. A method according to claim 24 wherein the step of positioning and stretching the flexible substrate onto the mold comprises securing the flexible substrate to the mold so that it conforms to the non-planar shape including the generally spherical portion of the mold.

26. A method according to claim 24 further comprising the step of forming a layer of electrically conductive material on the electrical conductor pattern remaining on the rigid layer.

27. A method according to claim 26 wherein the step of forming the electrical conductor pattern on the flexible substrate comprises forming a metal pattern on the flexible substrate;

and wherein the step of forming the layer of electrically conductive material comprises plating additional metal onto the metal pattern.

28. A method according to claim 24 further comprising the step of supporting the flexible substrate in a generally planar orientation during the step of forming the electrical conductor pattern.

29. A method according to claim 24 further comprising the step of supporting the flexible substrate on a frame.

30. A method according to claim 24 wherein the step of forming the electrical conductor pattern on the flexible substrate comprises printing a metal polymer onto the flexible substrate.

31. A method according to claim 24 wherein the step of forming the rigid layer comprises the steps of forming at least one layer of hardenable material, and hardening the at least one layer.

32. A method according to claim 24 wherein the non-planar shape of the rigid layer includes a generally spherical portion for the antenna;

and wherein the electrically conductive material is formed on an interior of the generally spherical portion of the rigid layer of the antenna.

33. An antenna comprising:

a rigid body portion having a generally spherical shape;

a predetermined pattern of a first electrically conductive layer on an interior surface of said rigid body portion including the generally spherical shape; and

a second electrically conductive layer on said first electrically conductive layer.

34. An antenna according to claim 33 wherein said rigid body portion comprises fiberglass.

35. An antenna according to claim 33 wherein the first electrically conductive layer comprises copper;

and wherein said second electrically conductive material comprises at least one of gold and nickel.

36. An intermediate product used during manufacturing of an antenna and comprising:

a mold having a non-planar shape including a generally spherical portion;

a flexible substrate on said mold including the generally spherical portion;

a pattern of a first material on said flexible substrate; and

a rigid body of material on said flexible substrate with at least a portion of the pattern of first material adhering to the rigid body of material upon separation from the flexible substrate.

37. An intermediate product according to claim 36 wherein said flexible substrate comprises rubber.

38. An intermediate product according to claim 36 wherein said first material comprises a metal.

39. An intermediate product according to claim 36 wherein said body of rigid material comprises fiberglass.