Method and apparatus for immersion cleaning of semiconductor devices
First Claim
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1. Apparatus for processing a workpiece, comprising:
- a treatment chamber defining a cavity for receiving the workpiece and a device opening through which said workpiece is passed into and out of the cavity;
an osmotic membrane degasifier defining a degasifier cavity, a membrane dividing the degasifier cavity into first and second parts, an aqueous solution inlet and an aqueous solution outlet associated with said first part to direct aqueous solution into contact with one side of the membrane, and a carrier fluid inlet and a carrier fluid outlet associated with said second part to direct carrier fluid into contact with the other side of the membrane; and
the aqueous solution outlet coupled to the treatment chamber.
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Abstract
Method and apparatus for cleaning semiconductor devices and other workpieces using an aqueous rinse solution which is de-oxygenated by passing the aqueous rinse solution and a carrier gas through an osmotic membrane degasifier. A cleaning chamber is also disclosed for carrying out the cleaning method.
118 Citations
35 Claims
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1. Apparatus for processing a workpiece, comprising:
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a treatment chamber defining a cavity for receiving the workpiece and a device opening through which said workpiece is passed into and out of the cavity; an osmotic membrane degasifier defining a degasifier cavity, a membrane dividing the degasifier cavity into first and second parts, an aqueous solution inlet and an aqueous solution outlet associated with said first part to direct aqueous solution into contact with one side of the membrane, and a carrier fluid inlet and a carrier fluid outlet associated with said second part to direct carrier fluid into contact with the other side of the membrane; and the aqueous solution outlet coupled to the treatment chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. Apparatus for processing a semiconductor device, comprising:
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a treatment chamber defining a cavity for receiving the semiconductor device with a device opening through which said semiconductor device is passed into and out of the cavity; a plenum coupled to the treatment chamber and defining a mixing chamber including a aqueous solution inlet opening for introducing aqueous solution into the mixing chamber and a nonaqueous solvent opening for introducing a nonaqueous solvent into the mixing chamber; and an osmotic membrane degasifier defining a degasifier cavity, a membrane dividing the degasifier cavity into first and second parts, an aqueous solution inlet and a aqueous solution outlet associated with said first part, and a carrier fluid inlet and a carrier fluid outlet associated with said second part, with the aqueous solution outlet coupled to the aqueous solution inlet opening of said plenum. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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Specification