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Method and apparatus for immersion cleaning of semiconductor devices

  • US 6,021,791 A
  • Filed: 06/29/1998
  • Issued: 02/08/2000
  • Est. Priority Date: 06/29/1998
  • Status: Expired due to Fees
First Claim
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1. Apparatus for processing a workpiece, comprising:

  • a treatment chamber defining a cavity for receiving the workpiece and a device opening through which said workpiece is passed into and out of the cavity;

    an osmotic membrane degasifier defining a degasifier cavity, a membrane dividing the degasifier cavity into first and second parts, an aqueous solution inlet and an aqueous solution outlet associated with said first part to direct aqueous solution into contact with one side of the membrane, and a carrier fluid inlet and a carrier fluid outlet associated with said second part to direct carrier fluid into contact with the other side of the membrane; and

    the aqueous solution outlet coupled to the treatment chamber.

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