Laser assisted polishing

• US 6,023,040 A
• Filed: 10/01/1998
• Issued: 02/08/2000
• Est. Priority Date: 10/06/1997
• Status: Expired due to Fees

• Current Assignee: Dov Zahavi
• Original Assignee: Dov Zahavi
• Inventors: Zahavi, Dov, Tamir, Shoshana
• Primary Examiner(s): MILLS, GREGORY L
• Application Number:
  US09/164,362
• Time in Patent Office: 495 Days
• Field of Search: 219/121.61, 219/121.62, 219/121.68, 219/121.69, 219/121.73, 219/121.8, 219/121.85, 264/400
• US Class Current: 219/121.69
• CPC Class Codes: B23K 26/3576 Diminishing rugosity, e.g. grinding; Polishing; Smoothing
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence

Abstract

A method for laser assisted polishing of a material layer to a desired surface, the method including the steps of setting up a laser beam in an XYZ coordinate system to ablate spurious material from the material layer at the desired surface and thereabove and scanning the laser beam across the material layer such that consecutive laser beam irradiate at least partially non-overlapping portions of the material layer and laser beam pulses from different directions in the XYZ coordinate system successively irradiate a given area of the material layer.

Claims

1. A method for laser assisted polishing of a material layer to a desired surface, the method comprising the steps of:

(a) setting up a laser beam to ablate spurious material from the material layer at the desired surface and thereabove;

(b) scanning the laser beam across the material layer such that consecutive laser beam pulses irradiate substantially non-overlapping portions of the material layer and laser beam pulses from substantially different directions successively irradiate a given area of the material layer; and

(c) repeating steps (a) and (b) for two or more consecutively lower altitudes above the desired surface whereupon the laser beam has an average emergent fluence substantially equal to the laser ablation threshold of the material layer, at least the lowermost altitude coinciding with the desired surface.

2. The method according to claim 1 wherein initially stronger average emergent fluences ablate spurious material at higher altitudes and progressively weaker average emergent fluences ablate spurious material at successively lower altitudes.

3. The method according to claim 1 wherein step (a) includes adjusting the power of the laser beam for determining the average emergent fluence of the laser beam at the desired surface.

4. The method according to claim 1 wherein step (a) includes adjusting the cross section area of a focal plane of the laser beam for determining the average emergent fluence at the desired surface.

5. The method according to claim 1 wherein the total area of the footprints of laser beam pulses irradiating the material layer divided by the area of the material layer lies in the range of about 1.5 to about 10 at each of said altitudes above the desired surface.

6. The method according to claim 1 wherein consecutive laser beam pulses irradiate wholly non-overlapping portions of the material layer.

7. The method according to claim 1 wherein the laser beam and the material layer are rotatable and translatable one with respect to the other and the laser beam irradiates the material layer at a low incident angle relative thereto whereby a given area of the material layer is irradiated from different directions by consecutive pulses.

8. The method according to claim 1 wherein the laser beam has a relatively large footprint of several millimeters by several millimeters whereby a given area of the material layer is irradiated from different directions by consecutive pulses.