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Chip-scale carrier for semiconductor devices including mounted spring contacts

  • US 6,023,103 A
  • Filed: 06/30/1998
  • Issued: 02/08/2000
  • Est. Priority Date: 11/15/1994
  • Status: Expired due to Fees
First Claim
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1. Semiconductor assembly, comprising:

  • a semiconductor die having a surface and bond pads on the surface;

    a carrier substrate mounted to the surface of the semiconductor die, and having a surface and terminals on the surface;

    bond wires connecting the bond pads to the terminals; and

    spring elements extending from the terminals, away from the surface of the semiconductor die,each spring element including;

    an elongate element, of a first material, having a portion connected to a respective terminal of the substrate; and

    a second material, on the elongate element, wherein the elongate element is flexible without the second material, and the elongate element and the second material together are resilient.

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