Ceramic chip antenna

• US 6,023,251 A
• Filed: 10/20/1998
• Issued: 02/08/2000
• Est. Priority Date: 06/12/1998
• Status: Expired due to Fees

• Current Assignee: Korea Electronics Technology Institute (Government of South Korea)
• Original Assignee: Korea Electronics Technology Institute (Government of South Korea)
• Inventors: Lee, Woo-Sung, Sung, Jae-Suk, Koo, Ki-Duk, Chang, Dong-Seok
• Primary Examiner(s): Wong, Don
• Assistant Examiner(s): CHEN, SHIH CHAO
• Application Number:
  US09/175,700
• Time in Patent Office: 476 Days
• Field of Search: 343/895, 343/702, 343/700 MS, 343/873
• US Class Current: 343/895
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/362 for broadside radiating helical antennas
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 21/10 Collinear arrangements of substantially straight elongated conductive units
• CPC Class Codes: H01Q 5/40 Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
• CPC Class Codes: H01Q 9/30 with feed to end of elongated active element, e.g. unipole H01Q9/44 takes precedence

Abstract

A ceramic chip antenna is provided which exhibits a small size and is capable of utilizing a plurality of bands. The ceramic chip antenna comprises a dielectric chip base, a plurality of main conductors which is spirally wound within said dielectric chip base, and a plurality of sub conductors which is spirally wound within each of said main conductors. The sub conductors are respectively separated. One ends of said main conductors are led to an outside surface of said dielectric base to form feeding terminal for applying a signal to said main conductors and one ends of said sub conductors are led to an outside surface of said dielectric base to form feeding terminal for applying a signal to said sub conductors.

Claims

1. A ceramic chip antenna comprising:

a dielectric chip base;

at least one conductor which is spirally wound within said dielectric chip base; and

at least one sub conductor which is spirally wound within said conductor such that said conductor and said sub conductor are respectively separated, and

wherein one end of said conductor is led to an outside surface of said dielectric base to form a feeding terminal for applying a signal to said conductor, and one end of said sub conductor is led to an outside surface of said dielectric base to form a feeding terminal for applying a signal to said sub conductor.

2. The ceramic chip antenna of claim 1, wherein said dielectric chip base is formed as a rectangular parallelepiped.

3. The ceramic chip antenna of claim 2, wherein a winding axis of said conductor and said sub conductor is respectively parallel to a bottom surface and a side surface of said dielectric chip base.

4. The ceramic chip antenna of claim 3, wherein a winding axis of said conductor coincides with a winding axis of each of said sub conductor within said conductor.

5. The ceramic chip antenna of claim 4, wherein a shape of the winding cross section, which is perpendicular to a winding axis of said conductor, is rectangular.

6. The ceramic chip antenna of claim 4, wherein a shape of the winding cross section, which is perpendicular to a winding axis of said sub conductor, is rectangular.

7. The ceramic chip antenna of claim 1, wherein said dielectric chip base is formed by stacking together a plurality of dielectric ceramic sheets.

8. A method of manufacturing a ceramic chip antenna comprising the steps of:

providing a plurality of dielectric ceramic sheets;

depositing conductive strip patterns on a first set of dielectric ceramic sheets, wherein the conductive strip patterns define horizontal portions of a conductor;

depositing conductive strip patterns on a second set of dielectric ceramic sheets, wherein the conductive strip patterns define horizontal portions of a sub conductor;

forming vertical holes through at least some of the dielectric ceramic sheets; and

assembling the dielectric ceramic sheets into a ceramic chip antenna, wherein said assembling step comprises;

filling the vertical holes with electrically conductive paste;

stacking the dielectric ceramic sheets on top of each other such that the conductive strip patterns and vertical holes of the dielectric ceramic sheets define a sub conductor that is spirally wound within a conductor, wherein the conductor and sub conductor are separated, and wherein one end of the conductor and one end of said sub conductor are led to an outside surface of the ceramic chip antenna to form feeding terminals for applying signals to the conductor and sub conductor; and

forming the ceramic chip antenna from the dielectric ceramic sheets.

9. A method according to claim 8 further comprising after said stacking step the step of aligning the ceramic sheets such that the vertical holes and the conductive strips are in electrical contact to thereby form the conductor and sub conductor.

10. A method according to claim 8, wherein said steps of depositing conductive strip patterns comprises depositing conductive strip patterns on the first and second sets of dielectric ceramic sheets such that when the dielectric ceramic sheets are stacked in said stacking step a winding axis of the conductor and a winding axis of the sub conductor are respectively parallel to a bottom surface and a side surface of the ceramic chip antenna.

11. A method according to claim 8, wherein said steps of depositing conductive strip patterns comprises depositing conductive strip patterns on the first and second sets of dielectric ceramic sheets such that when the dielectric ceramic sheets are stacked in said stacking step a winding axis of the conductor coincides with a winding axis of the sub conductor.

12. A method according to claim 8, wherein said step of depositing conductive strip patterns on a first set of dielectric ceramic sheets comprises depositing conductive strip patterns on a first set of dielectric ceramic sheets such that when the dielectric ceramic sheets are stacked in said stacking step, a winding cross section of the conductor is rectangular.

13. A method according to claim 8, wherein said step of depositing conductive strip patterns on a second set of dielectric ceramic sheets comprises depositing conductive strip patterns on a second set of dielectric ceramic sheets such that when the dielectric ceramic sheets are stacked in said stacking step, a winding cross section of the sub conductor is rectangular.

14. A method according to claim 8, wherein said forming step comprises the steps of compressing the dielectric sheets and cofiring the compressed dielectric sheets to form a ceramic chip antenna.