Method of reducing agglomerate particles in a polishing slurry

• US 6,024,829 A
• Filed: 05/21/1998
• Issued: 02/15/2000
• Est. Priority Date: 05/21/1998
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Easter, William G., Maze, John A.
• Primary Examiner(s): Breneman, Bruce
• Assistant Examiner(s): Powell, Alva C
• Application Number:
  US09/083,072
• Time in Patent Office: 635 Days
• Field of Search: 438/692, 438/693, 438/746, 438/747, 216/88, 216/89, 216/90, 451/41, 451/289, 156/345 LP
• US Class Current: 156/345.12
• CPC Class Codes: B24B 1/04 subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency polishing or abrading surfaces on work by means of tumbling apparatus B24B31/00, involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

The present invention, in one embodiment, provides a method for eliminating agglomerate particles in a polishing slurry. In this particular embodiment, the method includes transferring a slurry that has a design particle size from a slurry source to an energy source. In many instances, the slurry forms an agglomerate that has an agglomerated particle size, which is substantially larger than the design particle size. This larger particle size is highly undesirable because it can damage the semiconductor wafer surface as it is polished. The method further includes subjecting the agglomerate to energy, such as an ultra sonic wave emanating from the energy source, and transferring energy from the energy source to the slurry to reduce the agglomerated particle size to substantially the design particle size.

Claims

1. A method for reducing agglomerate particles in a polishing slurry having a design particle size that is to be dispensed by a slurry dispensing system, comprising:

transferring said polishing slurry by said slurry dispensing system from a slurry source to an energy source coupled to said slurry dispensing system, said slurry forming an agglomerate within said slurry dispensing system, said agglomerate having an agglomerated particle size substantially larger than said design particle size;

subjecting said agglomerate to energy emanating from said energy source; and

transferring energy from said energy source to said agglomerate to reduce said agglomerated particle size to substantially said design particle size.

2. The method as recited in claim 1 wherein said energy source is an ultrasonic transducer and said transferring includes transferring energy from said energy source to said agglomerate by an ultrasonic wave.

3. The method as recited in claim 1 wherein said design particle size ranges from about 1.5 μ

m to about to about 0.012 μ

m.

4. The method as recited in claim 3 wherein said design particle size ranges from about 0.025 μ

m to about 0.050 μ

m.

5. The method as recited in claim 1 wherein said subjecting includes generating said energy from a radio frequency generator.

6. The method as recited in claim 5 wherein generating includes producing an energy wave having a frequency ranging from about 1 mega Hertz to about 15 mega Hertz.

7. The method as recited in claim 6 wherein producing said energy wave includes producing an energy wave having a power of 20 watts.

8. The method as recited in claim 1 wherein said agglomerated particle size ranges from about 0.1 μ

m to about 30 μ

m.

9. The method as recited in claim 1 wherein said slurry is a metal slurry having an abrasive with a design particle size ranging from about 0.12 μ

m to about 1.50 μ

m.

10. The method as recited in claim 1 wherein said slurry is an oxide slurry having an abrasive with a design particle size ranging from about 0.05 μ

m to about 0.012 μ

m.

11. A system for reducing agglomerate particles in a polishing slurry having a design particle size that is to be dispensed, comprising:

a chemical/mechanical polishing apparatus having a polishing surface associated therewith;

a slurry source containing said polishing slurry;

a slurry dispensing system having a slurry dispensing end and configured to transfer said polishing slurry from said slurry source to said polishing surface positioned near said slurry dispensing end, said polishing slurry forming an agglomerate within said slurry dispensing system, said agglomerate having an agglomerated particle size substantially larger than said design particle size; and

an energy source coupled to said dispensing end and configured to transfer energy to said agglomerate to reduce said agglomerated particle size to substantially said design particle size.

12. The system as recited in claim 11 wherein said energy source is an ultrasonic transducer configured to radiate an ultrasonic energy wave.

13. The system as recited in claim 11 wherein said design particle size ranges from about 1.5 μ

m to about to about 0.012 μ

m.

14. The system as recited in claim 13 wherein said design particle size ranges from about 0.025 μ

m to about 0.050 μ

m.

15. The system as recited in claim 11 wherein said energy source comprises a radio frequency generator configured to generate an energy wave having a frequency ranging from about 1 mega Hertz to about 15 mega Hertz.

16. The system as recited in claim 15 wherein said energy source further comprises a 24 volt power source, an energy wave guide and an ultrasonic dispenser nozzle.

17. The system as recited in claim 11 wherein said slurry dispensing system further includes a main slurry loop having a dispensing end located near said polishing surface, said dispensing end coupled to said energy source, a slurry pump connected to said main slurry loop and configured to pump said slurry to said polishing surface, and a valve system configured to route said slurry through said slurry dispensing system.

18. The system as recited in claim 11 wherein said agglomerated particle size ranges from about 0.1 μ

m to about 30 μ

m.

19. The system as recited in claim 11 wherein said slurry is a metal slurry having an abrasive with a design particle size ranging from about 0.12 μ

m to about 1.50 μ

m.

20. The system as recited in claim 11 wherein said slurry is an oxide slurry having an abrasive with a design particle size ranging from about 0.05 μ

m to about 0.012 μ

m.

21. A method for polishing a semiconductor wafer, comprising:

positioning a surface of said semiconductor wafer against a polishing surface;

transferring a slurry having a design particle size from a slurry source of a slurry dispensing system to an energy source coupled to said slurry dispensing system, said slurry forming an agglomerate within said slurry dispensing system, said agglomerate having an agglomerated particle size substantially larger than said design particle size;

subjecting said agglomerate to energy emanating from said energy source;

transferring energy from said energy source to said agglomerate to reduce said agglomerated particle size to substantially said design particle size;

transferring said slurry to said polishing surface subsequent to a reduction in said agglomerated particle size; and

polishing said surface of said semiconductor wafer.

22. The method as recited in claim 21 wherein said energy source is an ultrasonic transducer and said transferring includes transferring energy from said energy source to said agglomerate by an ultrasonic wave.

23. The method as recited in claim 21 wherein said design particle size ranges from about 1.5 μ

m to about 0.012 μ

m.

24. The method as recited in claim 21 wherein said subjecting includes generating said energy from a radio frequency generator having a frequency ranging from about 1 mega Hertz to about 15 mega Hertz.

25. The method as recited in claim 21 wherein said agglomerated particle size ranges from about 0.1 μ

m to about 30 μ

m.

26. A method for polishing a semiconductor wafer, comprising:

positioning a surface of said semiconductor wafer against a polishing surface;

transferring a slurry having a design particle size from a slurry source to a predispensing location prior to being dispensed on said polishing surface, said slurry forming an agglomerate;

subjecting said slurry to energy emanating from an energy source prior to dispensing said slurry on said polishing surface to reduce said agglomerated particle size; and

transferring said slurry to said polishing surface and polishing said surface of said semiconductor wafer.