Smart cards having glue-positioned electronic components

• US 6,025,054 A
• Filed: 10/21/1998
• Issued: 02/15/2000
• Est. Priority Date: 09/08/1997
• Status: Expired due to Term

• Current Assignee: Cardxx Incorporated
• Original Assignee: Cardxx Incorporated
• Inventors: Tiffany, Harry J. III
• Primary Examiner(s): RAIMUND, CHRISTOPHER W
• Application Number:
  US09/176,244
• Time in Patent Office: 482 Days
• Field of Search: 235/488, 235/492, 235/487, 428/189
• US Class Current: 428/189
• CPC Class Codes: G06K 19/02 characterised by the selection of materials, e.g. to avoid wear during transport through the machine
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 428/24752 Laterally noncoextensive components

Abstract

Smart cards having high quality external surfaces can be made through the use of partially cured, low shrinkage glues to hold the smart card'"'"'s electronic elements during their immersion in a thermosetting material that becomes the core layer of said cards. Mounds of low shrinkages give serve to hold the electronic component in a given position in the core layer.

Claims

1. A smart card comprising a top layer, a core layer in which an electronic component is embedded and a bottom layer, and wherein said smart card further comprises at least two mounds of low shrinkage glue that serve to hold the electronic component in a given position in the core layer such that the electronic component is not in contact with the top layer or the bottom layer and such that a portion of a material that constitutes the core layer is under the electronic component and between the mounds of low shrinkage glue.

2. The smart card of claim 1 wherein the mound of low shrinkage glue positions the electronic component at least about 0.01 mm above the bottom layer.

3. The smart card of claim 1 that further comprises a bonding agent located between the top layer and the core layer and a bonding agent located between the bottom layer and the core layer.

4. The smart card of claim 1 that further comprises an alphanumeric/graphic information-containing film that is positioned between the top layer and the core layer.

5. The smart card of claim 1 that further comprises an opacity incr easing layer of material that is positioned between the top layer and the core layer and a thermosetting material that is provided with an opacity increasing pigment.

6. The smart card of claim 1 that further comprises alphanumerical/graphic information that is placed on a major outside surface of the smart card.

7. A smart card comprising a top layer, a core layer in which an electronic component is embedded and a bottom layer, and wherein said smart card further comprises at least two mounds of low shrinkage glue each having a volume of less than about 0.1 cc that serve to hold the electronic component in a position that is between about 0.075 and about 0.13 mm above an inside surface of the bottom layer such that a portion of a material that constitutes the core layer is under the electronic component and between the mounds of low shrinkage glue.