Semiconductor package structures using epoxy molding compound pads and a method for fabricating the epoxy molding compound pads

• US 6,025,651 A
• Filed: 06/05/1998
• Issued: 02/15/2000
• Est. Priority Date: 06/16/1997
• Status: Expired due to Term

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Nam, Shi-baek
• Primary Examiner(s): Saadat, Mahshid
• Assistant Examiner(s): Warren, Matthew E.
• Application Number:
  US09/090,861
• Time in Patent Office: 620 Days
• Field of Search: 257/788, 257/728, 257/781, 257/782, 257/784, 257/777, 257/723, 257/669, 257/778
• US Class Current: 257/788
• CPC Class Codes: H01L 21/4803 Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks H01L21/4846 takes precedence; printed circuit boards H05K1/00
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/83136 involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 23/49506 an insulative substrate being used as a diepad, e.g. ceramic, plastic H01L23/49531 takes precedence
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

A semiconductor package has a controlling IC attached to a die pad using an epoxy molding compound (EMC) pad. The EMC pad is formed so as to be slightly larger than the controlling IC. EMC pads are cut from an EMC pad pattern which is formed from a predetermined number of EMC tablets. The EMC pad pattern is molded by heating and pressing the EMC tablets into a wafer shape having a thickness of approximately 0.3 mm and a diameter of approximately 100 mm. Such a thin EMC pad is capable of providing sufficient dielectric strength, and allows for manufacturing of semiconductor packages at lower cost. In addition, conventional equipment can be used to fabricate the semiconductor packages. The packages are flexible, and even a thin package is not easily broken.

Claims

1. A semiconductor package structure comprising:

a power semiconductor chip mounted on a die pad using a conductive adhesive material;

an epoxy molded compound (EMC) pad attached to said die pad using a first insulating adhesive material; and

a controlling integrated circuit chip mounted on said EMC pad using a second insulating adhesive material,

wherein the epoxy molded compound has a predetermined resilience to protect the controlling integrated circuit chip against an external impact, and

wherein the EMC pad is a single rigid pad.

2. The semiconductor package structure according to claim 1, wherein said first semiconductor chip comprises a MOSFET.

3. The semiconductor package structure according to claim 1, wherein said first and said second insulating materials comprise an epoxy.

4. The semiconductor package structure according to claim 1, wherein said EMC pad is larger than said second semiconductor chip.

5. The semiconductor package structure according to claim 4, wherein said EMC pad is larger than said second semiconductor chip by 1 mm on all sides.