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Direct connect interconnect for testing semiconductor dice and wafers

  • US 6,025,730 A
  • Filed: 03/17/1997
  • Issued: 02/15/2000
  • Est. Priority Date: 03/17/1997
  • Status: Expired due to Term
First Claim
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1. In a test system for testing a semiconductor die including testing circuitry for applying test signals to the die and an electrical connector in electrical communication with the testing circuitry, an interconnect for establishing temporary electrical communication between the die and the testing circuitry comprising:

  • a substrate;

    a contact member on the substrate configured to electrically contact a contact location on the die;

    a cavity in the substrate configured to retain the electrical connector; and

    a conductor on the substrate in electrical communication with the contact member and extending into the cavity, the conductor configured to form a non-bonded electrical connection with the electrical connector retained in the cavity, and provide a direct electrical path from the electrical connector to the contact member.

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