Direct connect interconnect for testing semiconductor dice and wafers
First Claim
1. In a test system for testing a semiconductor die including testing circuitry for applying test signals to the die and an electrical connector in electrical communication with the testing circuitry, an interconnect for establishing temporary electrical communication between the die and the testing circuitry comprising:
- a substrate;
a contact member on the substrate configured to electrically contact a contact location on the die;
a cavity in the substrate configured to retain the electrical connector; and
a conductor on the substrate in electrical communication with the contact member and extending into the cavity, the conductor configured to form a non-bonded electrical connection with the electrical connector retained in the cavity, and provide a direct electrical path from the electrical connector to the contact member.
6 Assignments
0 Petitions
Accused Products
Abstract
An interconnect and system for testing semiconductor dice, and a test method using the interconnect are provided. The interconnect includes a substrate having patterns of contact members for electrically contacting the dice. The interconnect also includes patterns of conductors for providing electrical paths to the contact members. In addition, the interconnect includes contact receiving cavities configured to retain electrical connectors of a testing apparatus in electrical communication with the conductors. A die level test system includes the interconnect mounted to a temporary package for a singulated die. In the die level test system, the interconnect provides direct electrical access from testing circuitry to the die. A wafer level test system includes the interconnect mounted to a probe card fixture of a wafer probe handler. In the wafer level test system, the contact receiving cavities can be configured to support and align the interconnect to the probe card fixture.
197 Citations
22 Claims
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1. In a test system for testing a semiconductor die including testing circuitry for applying test signals to the die and an electrical connector in electrical communication with the testing circuitry, an interconnect for establishing temporary electrical communication between the die and the testing circuitry comprising:
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a substrate; a contact member on the substrate configured to electrically contact a contact location on the die; a cavity in the substrate configured to retain the electrical connector; and a conductor on the substrate in electrical communication with the contact member and extending into the cavity, the conductor configured to form a non-bonded electrical connection with the electrical connector retained in the cavity, and provide a direct electrical path from the electrical connector to the contact member. - View Dependent Claims (2, 3, 4, 5, 7, 8)
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6. In a test system for testing a semiconductor die including testing circuitry for applying test signals to the die and an electrical connector in electrical communication with the testing circuitry, an interconnect for establishing temporary electrical communication between the die and the testing circuitry comprising:
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a substrate; a contact member on the substrate configured to electrically engage a contact location on the die; a cavity in the substrate sized and shaped to retain a tip portion of the electrical connectors and a conductor on the substrate in electrical communication with the contact member, the conductor comprising a portion within the cavity configured to electrically engage the tip portion of the electrical connector and provide a direct electrical path to the contact member.
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9. An interconnect for testing a semiconductor die comprising:
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a substrate; a contact member on the substrate comprising a conductive layer configured to electrically engage a contact location on the die; a conductor on the substrate in electrical communication with the conductive layer; and a cavity in the substrate at least partially covered by the conductor and configured to retain an electrical connector of a testing apparatus, the conductor configured to form a non-bonded electrical connection with the electrical connector retained in the cavity to provide a direct electrical path from the electrical connector to the contact member. - View Dependent Claims (10, 11, 12, 13)
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14. In a temporary package configured to house a semiconductor die for testing, an interconnect on the temporary package configured to form temporary electrical connections between the die and testing circuitry, the interconnect comprising:
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a substrate; a plurality of contact members on the substrate configured to electrically engage a plurality of contact locations on the die; a plurality of conductors on the substrate in electrical communication with the contact members; and a cavity in the substrate configured to retain a plurality of electrical connectors in electrical communication with the testing circuitry; the conductors comprising portions within the cavity configured to form non-bonded electrical connections with the electrical connectors retained in the cavities, to provide direct electrical paths from the electrical connectors to the conductors and the contact members. - View Dependent Claims (15, 16, 17, 18, 19)
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20. In a temporary package configured to house a semiconductor die for testing, an interconnect on the temporary package configured to form temporary electrical connections between the die and testing circuitry, the interconnect comprising:
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a substrate; a contact member on the substrate at least partially covered with a conductive layer configured to electrically engage a contact location on the die; a cavity in the substrate sized and shaped to retain an electrical connector in electrical communication with the testing circuitry; and a conductor on the substrate in electrical communication with the conductive layer and extending into the cavity, the conductor configured to form a non-bonded electrical connection with the electrical connector retained in the cavity to provide a direct electrical path from the electrical connector to the contact member. - View Dependent Claims (21, 22)
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Specification