Cartridge for electronic devices

• US 6,025,993 A
• Filed: 05/30/1997
• Issued: 02/15/2000
• Est. Priority Date: 05/20/1992
• Status: Expired due to Term

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Primary Examiner(s): Tolin, Gerald
• Application Number:
  US08/866,195
• Time in Patent Office: 991 Days
• Field of Search: 361/684, 361/687, 361/704, 361/705, 361/709-711, 361/717-719, 361/732, 361/737, 361/753, 361/816, 361/818, 257/718, 257/719, 257/727, 365/52, 365/63, 235/380, 235/441, 235/492, 395/110, 395/114, 395/115, 174/35 R, 174/51, 439/76.1, 439/607
• US Class Current: 361/705
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

An add-on cartridge structure for electronic devices having a housing formed from upper and lower case sections. The upper case is typically made from plastic and has a conductive layer formed on inside surfaces, while the lower case is made from a metallic material such as aluminum. A wall-like mating member is disposed on an outer edge of the lower case, and mates with the sides of the upper case to form a nearly rectangular cross section housing. The double conductive layer formed by the outside surface of the mating member and the inside surface of the upper case prevents leakage of electromagnetic radiation from the cartridge. Furthermore, high frequency noise is prevented by grounding both the signal ground of the printed circuit board and the frame ground at multiple locations. The conductive layer has a surface break caused by a through-hole through which the printed circuit board plug protrudes to the outside. Such an opening tends to allow electromagnetic noise to leak outside of the casing, but by grounding the signal and frame grounds at locations near the ends and middle of the plug, harmful noise from electromagnetic radiation is reduced.

Claims

1. A cartridge for electronic devices comprising:

a housing comprising a heat conductive element;

a processor disposed in said housing in thermal communication with said heat conductive element, wherein said processor generates heat when energized, and wherein said heat conductive element dissipates heat generated by said processor to an external portion of said housing; and

a circuit board arranged in said housing and comprising a mounting area having a through opening, wherein said processor is mounted at said mounting area over said through opening;

a packing component that adheres tightly to said processor and said heat conductive member and is disposed therebetween; and

an elastic member pushing said processor in a direction toward said heat conductive member,

wherein said elastic member comprises a compressible material disposed between a bottom surface of said processor and said housing and extending through said through opening in said circuit board.

2. A cartridge of claim 1, wherein said heat conductive member comprises a metal portion.

3. A cartridge of claim 2, wherein a portion of said housing comprises plastic.

4. A cartridge, for electronic devices comprising:

a housing comprising a heat conductive element;

a processor disposed in said housing in thermal communication with said heat conductive element, wherein said processor generates heat when energized, and wherein said heat conductive element dissipates heat generated by said processor to an external portion of said housing; and

a circuit board arranged in said housing and comprising a mounting area having a through opening, wherein said processor is mounted at said mounting area over said through opening;

a packing component that adheres tightly to said processor and said heat conductive member and is disposed therebetween; and

an elastic member pushing said processor in a direction toward said heat conductive member,

wherein said elastic member comprises a compressible material disposed between a bottom surface of said processor and said housing and extending through said through opening in said circuit board;

wherein said circuit board further comprises a plurality of grounding pads formed on a surface thereof and connection means for electrically connecting said processor to an external device,

wherein said housing further comprises;

a second opening, wherein said connection means extends through said second opening for connecting said circuit board to the external device, said second opening having first and second ends, and

a conductive shielding layer arranged on at least an interior surface of said housing,

wherein first and second ones of said plurality of grounding pads are arranged at the first and second ends, respectively of said opening, and

wherein a third one of said plurality of grounding pads is arranged between the first and second ones of said plurality of grounding pads to decrease a wavelength of electromagnetic radiation emitted through the second opening, and

wherein said conductive shielding layer is in electrical connection with each of said plurality of grounding pads.