Method for electrochemical fabrication

• US 6,027,630 A
• Filed: 04/03/1998
• Issued: 02/22/2000
• Est. Priority Date: 04/04/1997
• Status: Expired due to Term

• Current Assignee: First Bank Of Brunewick
• Original Assignee: University of Southern California
• Inventors: Cohen, Adam L.
• Primary Examiner(s): Gorgos, Kathryn
• Assistant Examiner(s): SMITH HICKS, ERICA D
• Application Number:
  US09/055,183
• Time in Patent Office: 690 Days
• Field of Search: 205/135, 205/118, 205/122, 205/120
• US Class Current: 205/135
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 2201/032 LIGA process
• CPC Class Codes: C25D 1/00 Electroforming
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 17/06 Suspending or supporting devices for articles to be coated
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: C25D 5/611 Smooth layers
• CPC Class Codes: H01L 21/2885 using an external electrical current, i.e. electro-deposition
• CPC Class Codes: H05K 3/241 characterised by the electroplating method; means therefor, e.g. baths or apparatus
• CPC Class Codes: Y10T 428/12486 Laterally noncoextensive components [e.g., embedded, etc.]
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.

Claims

1. A method of electrically patterning an object, comprising:

obtaining a supported mask which is separate from the object, having a first support portion, and a second patterned portion, said second patterned portion having a first surface connected to said first support portion, and a second surface which is conformable and can change in shape when pressed against said object to conform to a surface of said object;

pressing said mask against said object in an electrically active bath; and

after said pressing, passing a current through said electrically active bath, to pattern said object only at locations where said second patterned portion is not pressed against said object.

2. A method as in claim 1, wherein said second surface is formed from an elastomer.

3. A method as in claim 1, wherein said support comprises an electrode forming one terminal for said current.

4. A method as in claim 3, wherein said support is formed at least in part of a material that is soluble and erodes during said passing a current.

5. A method as in claim 4, further comprising replenishing soluble material in said support portion by reversing its polarity, and depositing material back onto the support.

6. A method as in claim 1, wherein said patterning comprises forming features of a first material, and further comprising forming features of a second material between said features of said first material.

7. A method as in claim 6, further comprising processing said first and second materials to form a smoother surface.

8. A method as in claim 6, further comprising obtaining a second mask and using said second mask to form additional features over said first and second materials.

9. A method as in claim 6, further comprising using said mask to form additional features over said first and second materials.

10. A method as in claim 1, wherein said obtaining a mask comprises obtaining a porous medium, and forming said patterned portion on said porous medium.

11. A method as in claim 1, wherein said obtaining a mask comprises forming a resist on said support, patterning said resist to correspond to a negative feature of the mask, forming said patterned portion only in places where said resist is no longer present, and removing the resist to leave only the patterned portions intact.

12. A method as in claim 1, wherein said pressing and said passing is repeated multiple times with the mask re-mated in the precise position it was mated previously.

13. A method as in claim 1, wherein said patterning comprises electrodeposition.

14. A method as in claim 1, wherein said obtaining, said pressing, and said passing produces an incomplete pattern, further comprising repeating said pressing and said passing at least once to produce different incomplete patterns which together produce a complete pattern.

15. A method as in claim 14, wherein said incomplete patterns overlap to provide continuity of the complete pattern.