Structure for mounting a wiring board

• US 6,027,791 A
• Filed: 09/29/1997
• Issued: 02/22/2000
• Est. Priority Date: 09/30/1996
• Status: Expired due to Term

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Higashi, Masahiko, Yamaguchi, Kouichi, Nagae, Kenichi, Hamada, Noriaki, Shinozaki, Michio, Kokubu, Masanari, Kumatabara, Hitoshi, Tami, Yasuhide
• Primary Examiner(s): Jones, Deborah
• Assistant Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US08/939,563
• Time in Patent Office: 876 Days
• Field of Search: 428/210, 428/209, 257/780, 257/781, 257/693, 257/720
• US Class Current: 428/209
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H05K 1/0271 Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/068 wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/09472 Recessed pad for surface mounting; Recessed electrode of component
• CPC Class Codes: H05K 2201/10992 Using different connection materials, e.g. different solders, for the same connection
• CPC Class Codes: H05K 2203/041 Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

A structure for mounting a wiring board in which the wiring board including a ceramics insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, is placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein a value F1 defined by the following formula (1):

F1=L×Δα/H.sup.2                          (1)

wherein L is a distance (mm) between the two connection terminals which are most separated away from each other among a plurality of connection terminals mounted on said insulating board, Δα is a difference in the coefficient of thermal expansion (ppm/° C.) between the insulating board of said wiring board and said mother board at 40 to 400° C., and H is a height (mm) of brazing between said wiring board and said mother board.

is not larger than 2000. This structure effectively loosens a difference in the thermal expansion between the wiring board and the mother board, and maintains favorable electric connection between the two for extended periods of time.

Claims

1. A structure for mounting a wiring board in which the wiring board includes a ceramic insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, the wiring board placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein parameters L, Δ

α and

H that define a thermal stress value F1 between the wiring board and the mother board are chosen so that F1 which is defined by the following formula (1);

space="preserve" listing-type="equation">F1=L×

Δ

α

/H.sup.2 (

     1)

wherein

L is a distance (mm) between the two connection terminals which are most separated away from each other among a plurality of connection terminals mounted on said insulating board,

Δ

α

is a difference in the coefficient of thermal expansion (ppm/°

C.) between the insulating board of said wiring board and said mother board at 40 to 400°

C., and

H is a height (mm) of brazing between said wiring board and said mother board, is not larger than 2000.

2. A structure for mounting a wiring board according to claim 1, wherein the distance L is not smaller than 6 mm.

3. A structure for mounting a wiring board according to claim 1, wherein said insulating board has a coefficient of thermal expansion of from 8 to 25 ppm/°

C. at 40 to 400°

C.

4. A structure for mounting a wiring board according to claim 3, wherein said insulating board is composed of a sintered product of glass ceramics.

5. A structure for mounting a wiring board according to claim 4, wherein said insulating board is obtained by molding and firing a mixture which comprises 20 to 80% by volume of a lithium silicate glass containing 5 to 30% by weight of Li₂ O and 80 to 20% by volume of at least one selected from the group consisting of forsterite, cristobalite and quartz.

6. A structure for mounting a wiring board according to claim 1, wherein said mother board has a coefficient of thermal expansion of from 8 to 28 ppm/°

C. at 40 to 400°

C.

7. A structure for mounting a wiring board according to claim 1, wherein a semiconductor element having electrodes for connection is placed on the surface of the insulating board of said wiring board, said electrodes for connection are secured to said metallized wiring layer by brazing, a filler containing a thermosetting resin is poured into between said wiring board and said semiconductor element and is cured, said insulating board has a coefficient of thermal expansion of from 8 to 25 ppm/°

C. at 40 to 400°

C., and the filler that is cured has a coefficient of thermal expansion of from 20 to 50 ppm/°

C. at 40 to 400°

C. and a Young'"'"'s modulus of from 5 to 10 GPa over the same temperature range.

8. A structure for mounting a wiring board according to claim 7, wherein said thermosetting resin is a phenol novolak epoxy resin or a cresol novolak epoxy resin.

9. A structure for mounting a wiring board in which the wiring board includes a ceramic insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, the wiring board placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein parameters L, Δ

α

, t and E that define a thermal stress value F2 between the wiring board and the mother board are chosen so that F2 which is defined by the following formula (2);

space="preserve" listing-type="equation">F2=L×

Δ

α

×

t-[(0.025×

L.sup.3 ×

Δ

α

)/(E×

t.sup.3)] (2)

wherein

L is a distance (mm) between the two connection terminals which are most separated away from each other among a plurality of connection terminals mounted on said insulating board,

Δ

α

is a difference in the coefficient of thermal expansion (ppm/°

C.) between the insulating board of said wiring board and said mother board at 40 to 400°

C.,

t is a thickness (mm) of the wiring board, and

E is a Young'"'"'s modulus (GPa) of the wiring board, is not larger than 200.

10. A structure for mounting a wiring board according to claim 9, wherein the thickness t is not smaller than 0.3 mm, and the distance L is not smaller than 20 mm.

11. A structure for mounting a wiring board according to claim 9, wherein said insulating board has a coefficient of thermal expansion of from 8 to 25 ppm/°

C. at 40 to 400°

C.

12. A structure for mounting a wiring board according to claim 11, wherein said insulating board is composed of a sintered product of glass ceramics.

13. A structure for mounting a wiring board according to claim 12, wherein said insulating board is obtained by molding and firing a mixture which comprises 20 to 80% by volume of a lithium silicate glass containing 5 to 30% by weight of Li₂ O and 80 to 20% by volume of at least one selected from the group consisting of forsterite, cristobalite and quartz.

14. A structure for mounting a wiring board according to claim 9, wherein a semiconductor element having electrodes for connection is placed on the surface of the insulating board of said wiring board, said electrodes for connection are secured to said metallized wiring layer by brazing, a filler containing a thermosetting resin is poured into between said wiring board and said semiconductor element and is cured, said insulating board has a coefficient of thermal expansion of from 8 to 25 ppm/°

C. at 40 to 400°

C., and the filler that is cured has a coefficient of thermal expansion of from 20 to 50 ppm/°

C. at 40 to 400°

C. and a Young'"'"'s modulus of from 5 to 10 GPa over the same temperature range.

15. A structure for mounting a wiring board according to claim 9, wherein said thermosetting resin is a phenol novolak epoxy resin or a cresol novolak epoxy resin.