Thin profile battery bonding method and method of conductively interconnecting electronic components

• US 6,030,423 A
• Filed: 02/12/1998
• Issued: 02/29/2000
• Est. Priority Date: 02/12/1998
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Lake, Rickie C.
• Primary Examiner(s): Nuzzolillo, Maria
• Assistant Examiner(s): DOVE, TRACY MAE
• Application Number:
  US09/022,812
• Time in Patent Office: 747 Days
• Field of Search: 29/623.4, 429/156, 429/157, 429/186, 429/152
• US Class Current: 29/623.4
• CPC Class Codes: H01M 50/216 adapted for button or coin cells
• CPC Class Codes: H05K 2201/0162 Silicon containing polymer, e.g. silicone
• CPC Class Codes: H05K 2201/10037 Printed or non-printed battery
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10S 257/924 with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
• CPC Class Codes: Y10T 29/49114 including adhesively bonding
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A curable adhesive composition is provided which comprises an epoxy terminated silane. A thin profile battery and a substrate to which the thin profile battery is to be conductively connected are also provided. The curable adhesive composition is interposed between the thin profile battery and the substrate. It is cured into an electrically conductive bond electrically interconnecting the battery and the substrate. In another aspect, the invention includes a method of conductively interconnecting electronic components using a curable adhesive composition which comprises an epoxy terminated silane. The invention in another aspect includes interposing a curable epoxy composition between first and second electrically conductive components to be electrically interconnected. At least one of the components comprises a metal surface with which the curable epoxy is to electrically connect. The epoxy is cured into an electrically conductive bond electrically interconnecting the first and second components. The epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.3 ohm-cm².

Claims

1. A thin profile battery bonding method comprising:

providing a conductively curable adhesive composition comprising an epoxy terminated silane;

providing a thin profile battery and a substrate to which the thin profile battery is to be conductively connected;

interposing the conductively curable adhesive composition between the thin profile battery and the substrate; and

curing the adhesive into an electrically conductive bond which electrically interconnects the battery and the substrate.

2. The method of claim 1 wherein the epoxy terminated silane comprises a glycidoxy methoxy silane.

3. The method of claim 1 wherein the epoxy terminated silane comprises a glycidoxyproplytrimethoxysilane.

4. The method of claim 1 wherein the epoxy terminated silane is present in the curable adhesive composition at less than or equal to about 2% by weight.

5. The method of claim 1 wherein the epoxy terminated silane is present in the curable adhesive composition at less than or equal to about 1% by weight.

6. The method of claim 1 wherein the thin profile battery comprises an outer nickel clad stainless steel surface over which the curable adhesive composition is received.

7. The method of claim 1 wherein the thin profile battery is a button type battery having a terminal housing member comprising an outer nickel clad stainless steel surface over which the curable adhesive composition is received.

8. The method of claim 1 wherein the thin profile battery is a button type battery having a terminal housing member comprising an outer nickel clad stainless steel surface over which the curable adhesive composition is received, and the substrate comprises conductive printed thick film ink over which the curable adhesive composition is received.

9. A thin profile battery bonding method comprising:

interposing a curable epoxy composition between a thin profile battery and a substrate to which the thin profile battery is to be conductively connected, at least one of the battery and substrate comprising a metal surface with which the curable epoxy is to electrically connect; and

curing the epoxy into an electrically conductive bond electrically interconnecting the battery and the substrate, the epoxy having an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a contact resistance through said metal surface of less than or equal to about 0.3 ohm-cm².

10. The method of claim 9 wherein the epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.16 ohm-cm².

11. The method of claim 9 wherein the epoxy has an effective metal surface wetting concentration of silane to form a cured electrical interconnection having a resistance through said metal surface of less than or equal to about 0.032 ohm-cm².

12. The method of claim 9 wherein the metal surface wetting concentration of silane in the curable adhesive composition is less than or equal to about 2% by weight.

13. The method of claim 9 wherein the metal surface wetting concentration of silane in the curable adhesive composition is less than or equal to about 1% by weight.

14. The method of claim 9 wherein the thin profile battery has the metal surface and which comprises nickel clad stainless steel over which the curable adhesive composition is received.

15. The method of claim 9 wherein the thin profile battery has the metal surface and is a button type battery having a terminal housing member comprising nickel clad stainless steel over which the curable adhesive composition is received.

16. The method of claim 9 wherein the epoxy terminated silane comprises a glycidoxy methoxy silane.