IC card and method of manufacturing the same

• US 6,031,724 A
• Filed: 11/28/1995
• Issued: 02/29/2000
• Est. Priority Date: 11/29/1994
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Takahashi, Takuya
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Gandhi, Jayprakash N.
• Application Number:
  US08/563,278
• Time in Patent Office: 1,554 Days
• Field of Search: 361/736, 361/737, 361/740-742, 361/745, 361/747-749, 361/752-754, 361/756, 361/758-759, 361/770, 361/801-803, 361/820, 235/380, 235/492, 235/441, 235/435, 235/487, 257/679, 439/946
• US Class Current: 361/737
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

An IC card includes a card-like substrate, an IC module, and an adhesive. The substrate is made of synthetic resin and has in one surface a hole for fixing the IC module. The IC module has a circuit board on which an IC chip is mounted and sealed with resin. The back side of the circuit board is provided with external connecting terminals which are electrically connected to the IC chip and exposed from the card-like substrate. The IC module is fitted into the hole of the card-like substrate such that an IC chip mounting section of the IC module is located inside the IC card. Using the adhesive, the IC module is fixed onto part of the inner surface of the hole of the card-like substrate without causing the chip mounting section to contact the inner surface of the hole.

Claims

1. An IC card comprising:

a card-like substrate having a first surface and a second surface opposite thereto, and a hole in the first surface, said hole including a first hole portion having a first area and a first bottom of a first depth and a second hole portion having a second area which is smaller than the first area and a second bottom of a second depth which is greater than the first depth;

an IC module including a circuit board and an IC chip mounting section formed on one side of the circuit board, said IC chip mounting section having an IC chip sealed with synthetic resin and having a shape suitable for the second hole portion of the hole of said card-like substrate, said IC module being fitted into the hole of said card-like substrate such that the IC chip mounting section is located inside the IC card, thereby producing a gap between an end portion of the circuit board and an inner surface of the first hole portion; and

a sheet-like adhesive provided on the first bottom of the first hole portion of said card-like substrate excluding the second hole portion, for fixing said IC module to said card-like substrate, an end portion of said adhesive contacting the inner surface of the first hole portion.

2. The IC card according to claim 1, wherein said IC chip has a first surface and a second surface opposite thereto, a plurality of electrodes being formed on the first surface of said IC chip, and said circuit board having a first surface and a second surface opposite thereto, the first surface of said circuit board being fixed onto the second surface of said IC chip, and the second surface of said circuit board being provided with a plurality of external connecting terminals electrically connected to a plurality of electrodes formed on the first surface of said IC chip.

3. The IC card according to claim 1, wherein said IC module has a convex section.

4. The IC card according to claim 1, wherein said adhesive is a thermo-compression bonding adhesive.

5. The IC card according to claim 1 wherein said card-like substrate is made of synthetic resin.