Electronic device cooling apparatus

• US 6,032,476 A
• Filed: 12/01/1998
• Issued: 03/07/2000
• Est. Priority Date: 09/20/1995
• Status: Expired due to Term

• Current Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Original Assignee: Sun Microsystems Incorporated (Oracle Corporation)
• Inventors: Pfister, Dennis M., Byrd, Charles M.
• Primary Examiner(s): DOERRLER, WILLIAM CHARLES
• Application Number:
  US09/203,156
• Time in Patent Office: 462 Days
• Field of Search: 62/259.2, 62/480, 62/497, 62/476, 62/101, 62/515, 62/516, 361/695, 361/700
• US Class Current: 62/259.2
• CPC Class Codes: F25B 17/08 the absorbent or adsorbent being a solid, e.g. salt F25B17/12 takes precedence
• CPC Class Codes: F25B 2333/005 the generator or boiler uses electromagnetic energy in the form of microwaves for desorbing the sorbate from the sorbate/sorbent compound
• CPC Class Codes: F25B 35/04 using a solid as sorbent
• CPC Class Codes: F25B 39/026 specially adapted for sorption type systems
• CPC Class Codes: F25B 49/046 Operating intermittently
• CPC Class Codes: F25D 23/12 Arrangements of compartments additional to cooling compartments; Combinations of refrigerators with other equipment, e.g. stove
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05B 6/701 using microwave applicators
• CPC Class Codes: H05B 6/802 for heating fluids methods of heating fluids in conventional microwave ovens H05B6/687
• CPC Class Codes: H05B 6/808 Microwave heating adapted for vending machines
• CPC Class Codes: H05K 7/20363 Refrigerating circuit comprising a sorber

Abstract

An apparatus for cooling an electrical component is disclosed which comprises a sorber containing a sorbent; a condenser in fluid communication with the sorber; an evaporator in fluid communication with both the sorber and the condenser and connected in heatexchange relation to the electrical component; wherein a sorbate which has been condensed in the condenser is evaporated in the evaporator, thereby absorbing heat from the electrical component, and then adsorbed onto the sorbent; an electromagnetic wave generator; a waveguide coupler for directing the electromagnetic waves to the sorbent; wherein the sorbate is desorbed from the sorbent by the electromagnetic waves and condensed in the condenser; and wherein the desorption of the sorbate from the sorbent is substantially isothermal.

Claims

1. An evaporator for use in an apparatus for cooling an electrical component, the evaporator comprising:

an evaporator housing having a depending shroud adapted to be positioned over the electrical component;

a manifold located in the evaporator housing above the shroud;

a plurality of holes connecting the manifold with a space encompassed by the shroud;

an inlet for providing fluid communication between the manifold and the exterior of the evaporator housing; and

an outlet for providing fluid communication between the space and the exterior of the evaporator housing.

2. The apparatus of claim 1, wherein the manifold comprises a plurality of interconnecting branches.

3. The apparatus of claim 1, wherein the holes are preferably approximately 0.004 to 0.030 inch in diameter.