Vertically stacked field programmable nonvolatile memory and method of fabrication

• US 6,034,882 A
• Filed: 11/16/1998
• Issued: 03/07/2000
• Est. Priority Date: 11/16/1998
• Status: Expired due to Term

• Current Assignee: SanDisk Technologies LLC (Western Digital Corporation)
• Original Assignee: Matrix Semiconductor, Inc. (Western Digital Corporation)
• Inventors: Cleeves, James M., Subramanian, Vivek, Lee, Thomas H., Farmwald, Paul Michael, Johnson, Mark G.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): LE, THONG QUOC
• Application Number:
  US09/192,883
• Time in Patent Office: 477 Days
• Field of Search: 257/316, 438/258, 365/145, 365/105, 365/115, 365/104, 365/51, 365/208, 365/175, 365/103, 365/63
• US Class Current: 365/103
• CPC Class Codes: G11C 11/5678 using amorphous/crystalline phase transition storage elements
• CPC Class Codes: G11C 11/5692 read-only digital stores using storage elements with more than two stable states
• CPC Class Codes: G11C 13/003 Cell access
• CPC Class Codes: G11C 17/16 using electrically-fusible links
• CPC Class Codes: G11C 2213/71 Three dimensional array
• CPC Class Codes: G11C 2213/76 Array using an access device for each cell which being not a transistor and not a diode
• CPC Class Codes: H01L 27/1021 including diodes only

Abstract

A very high density field programmable memory is disclosed. An array is formed vertically above a substrate using several layers, each layer of which includes vertically fabricated memory cells. The cell in an N level array may be formed with N+1 masking steps plus masking steps needed for contacts. Maximum use of self alignment techniques minimizes photolithographic limitations. In one embodiment the peripheral circuits are formed in a silicon substrate and an N level array is fabricated above the substrate.

Claims

1. A memory cell comprising:

a first conductor having a first width;

a second conductor having a second width;

a steering element for providing enhanced current flow in one direction through the steering element having a first end surface with first opposite edges spaced-apart by a distance equal to the first width and second opposite edges spaced-apart by a distance equal to the second width where the first opposite edges are aligned with the first conductor and where the first end surface is in continuous contact with the first conductor;

a state change element for retaining a programmed state, connected in series with the steering element having a second end surface with third opposite edges spaced-apart by a distance equal to the first width and fourth opposite edges spaced-apart by a distance equal to the second width where the fourth opposite edges are aligned with the second conductor and where the second end surface is in continuous contact with the second conductor, and;

the steering element and state change element being vertically aligned with one another.

2. The cell defined by claim 1 wherein the steering element is fabricated from polysilicon.

3. The cell defined by claim 2 wherein the polysilicon is doped so as to form a diode.

4. The cell defined by claim 1 wherein the steering element is a metal-semiconductor Schottky diode.

5. The cell defined by claim 1 wherein the steering element is a junction field-effect transistor with a gate connected to one of a source or drain region.

6. The cell defined by claim 1 wherein the steering element is a field-effect transistor having an insulated gate connected to one of a source or drain regions.

7. The cell defined by claim 1 wherein the steering element is a PN junction diode formed in amorphous semiconductor.

8. The cell defined by claim 1 wherein the steering element is a Zener diode.

9. The cell defined by claim 1 wherein the steering element is an avalanche diode.

10. The cell defined by claim 1 wherein the steering element is a tunnel diode.

11. The cell defined by claim 1 wherein the steering element is a four-layer diode (SCR).

12. The cell defined by claim 1 wherein the state change element is an antifuse.

13. The cell defined by claim 12 wherein the antifuse is formed from polysilicon.

14. The cell defined by claim 12 wherein the antifuse includes silicon dioxide.

15. The cell defined by claim 1 wherein the state change element is a dielectric-rupture antifuse.

16. The cell defined by claim 1 wherein the state change element is a polycrystalline semiconductor antifuse.

17. The cell defined by claim 1 wherein the state change element is an amorphous semiconductor antifuse.

18. The cell defined by claim 1 wherein the state change element is a metal filament electromigration fuse.

19. The cell defined by claim 1 wherein the state change element is a polysilicon resistor-fuse.

20. The cell defined by claim 1 wherein the state change element employs trap-induced hysteresis.

21. The cell defined by claim 1 wherein the state change element employs a ferroelectric capacitor.

22. The cell defined by claim 1 wherein the state change element employs a Hall effect device.

23. The cell defined by claim 1 wherein the steering element comprises a diode and the state change element comprises an antifuse, and where the diode is able to carry a sufficient current to change the state of the antifuse.

24. The cell defined by claim 1 wherein the steering element comprises a recrystallized semiconductor.

25. The cell defined by claim 1 wherein the steering element and state change element include amorphous silicon.

26. The cell defined by claim 1 wherein one of the terminals of the cell is connected to a word line.

27. The cell defined by claim 26 wherein the other of the terminals of the cell is connected to a bit line.

35. The memory cell defined by claim 1 wherein the steering element comprises a plurality of layers.

36. The memory cell defined by claims 1 or 35 wherein the state change element comprises a plurality of layers.

28. A memory cell comprising:

a first conductor;

a second conductor;

a pillar having a generally rectangular first and second opposite end surface each with first and second spaced-apart edges and having a steering element terminating at the first end surface which more readily conducts current in one direction, and a state change element terminating at the second end surface, the state change element for recording a state;

the first spaced-apart edges at the first end surface being aligned with the first conductor with the first end surface being in continuous contact with the first conductor, the second spaced-apart edges at the second end surface being aligned with the second conductor with the second end surface being in continuous contact with the second conductor.

29. The memory cell defined by claim 28 wherein the steering element comprises a diode.

30. The memory cell defined by claim 29 wherein the diode comprises polysilicon.

31. The memory cell defined by claim 28 wherein the state change element comprises a, dielectric rupture antifuse.

32. The memory cell defined by claim 31 wherein the antifuse comprises a silicon dioxide layer sandwiched between two layers of polysilicon.

33. The memory cell defined by claim 28 having a first conductor in contact with the steering element, the first conductor having a width approximately equal to one dimension of the rectangular cross-section.

34. The memory cell defined by claim 33 having a second conductor in contact with the state change element, the second conductor having a width approximately equal to the other dimension of the rectangular cross-section.

37. The memory cell defined by claim 28 wherein the steering element comprises a plurality of layers.

38. The memory cell defined by claims 28 or 37 wherein the state change element comprises a plurality of layers.