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Enhanced collimated sputtering apparatus and its method of use

  • US 6,036,821 A
  • Filed: 01/29/1998
  • Issued: 03/14/2000
  • Est. Priority Date: 01/29/1998
  • Status: Expired due to Fees
First Claim
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1. A sputtering apparatus for sputtering a thin film on a substrate, the substrate having a surface, the apparatus comprising:

  • a target and a sputter processing region between the substrate and said target;

    a collimator having a first portion and a second portion connected to said first portion, said first portion located in said sputter processing region, said second portion located outside said sputter processing region, wherein said collimator includes passageways oriented substantially perpendicular to said substrate surface; and

    drive means to induce lateral displacement of said collimator in a direction parallel to the substrate surface, the drive means being sufficient to move said entire first portion of said collimator out of said sputter processing region and to move said second portion into said sputter processing region.

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