Three-dimension inductor structure in integrated circuit technology

• US 6,037,649 A
• Filed: 04/01/1999
• Issued: 03/14/2000
• Est. Priority Date: 04/01/1999
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Winbond Electronics Corporation
• Inventors: Liou, Ping
• Primary Examiner(s): Ngo, Ngan V.
• Application Number:
  US09/285,029
• Time in Patent Office: 348 Days
• Field of Search: 257/531, 336/69, 336/84 R, 336/84 C, 336/84 M, 336/139, 336/149, 336/180, 336/189, 336/200, 336/223, 336/225
• US Class Current: 257/531
• CPC Class Codes: H01F 2017/0046 with a conductive path having a bridge
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A three-dimension inductor structure formed in a conventional integrated circuit technology has a direction of magnetic field perpendicular to the normal direction of the substrate of an applied integrated circuit. Due to the direction of the magnetic field, the electromagnetic interference induced by the three-dimension inductor structure affects other components in the same integrated circuit slightly. The three-dimension inductor structure includes an N-turn coil. Each turn coil in the N-turn coil includes a first-level metal line, a second-level metal line and third-level metal line. The three levels of metal lines are separated from one another by isolating layers. Two nearby levels of metal lines are connected through via plugs in the isolating layers between them. The integral coil is accomplished by connecting the second-level metal line of the Nth turn coil to the third-level metal line of the (N+1)th turn coil. Using the three-dimension structure, an integrated circuit of the radio frequency application can achieve a well integration. The three-dimension inductor structure also has the advantages of high quality factor and high inductance.

Claims

1. A three-dimension inductor structure formed over a substrate having an N-turn coil, the N being a nature number, a first isolating layer being disposed over said substrate, a normal direction being defined on said substrate, said inductor structure having a direction of magnetic field perpendicular to the normal direction of said substrate, each turn coil in the N-turn coil comprising:

a first-level metal line formed on the first isolating layer, said first-level metal line having a first end and a second end;

a second-level metal line, said second-level metal line being separated from said first-level metal line by a second isolating layer, the second isolating layer having via plugs for providing connection for said first-level metal line, said second-level metal line having a first part and a second part respectively connected to the first and second ends of said first-level metal line through the via plugs in the second isolating layer;

a third-level metal line, said third-level metal line being separated from said second-level metal line by a third isolating layer, the third isolating layer having via plugs for providing connection for said second-level metal line, said third-level metal line having a first end and a second end, the first end of said third-level metal line being connected to the first part of said second-level metal line through the via plugs in the third isolating layer.

2. The inductor structure of claim 1, wherein said second-level metal line in each turn coil includes an extending body at the second part thereof, said third-level metal line in each turn coil includes an extending body at the second end thereof, the extending body of said second-level metal line in the Nth turn coil is connected to the extending body of said third-level metal line in the (N+1)th turn coil through the via plugs in the third isolating layer.

3. The inductor structure of claim 2, further comprising a first pad and a second pad respectively connected to the first turn coil and the last turn coil of the N-turn coil for providing connection with external circuits.

4. A three-dimension helical inductor structure formed over a substrate having an N-turn coil and a metal shielding ring surrounding the N-turn coil, the N is a nature number, a first isolating layer being disposed over said substrate, each turn coil in the N-turn coil comprising:

a first-level metal line formed on the first isolating layer, said first-level metal line having a first end and a second end;

a second-level metal line, said second-level metal line being separated from said first-level metal line by a second isolating layer, the second isolating layer having via plugs for providing connection for said first-level metal line, said second-level metal line having a first part and a second part respectively connected to the first and second ends of said first-level metal line through the via plugs in the second isolating layer;

a third-level metal line, said third-level metal line being separated from said second-level metal line by a third isolating layer, the third isolating layer having via plugs for providing connection for said second-level metal line, said third-level metal line having a first end and a second end, the first end of said third-level metal line being connected to first part of said second-level metal line through the via plugs in the third isolating layer.

5. The inductor structure of claim 4, wherein said second-level metal line in each turn coil includes an extending body at the second part thereof, said third-level metal line in each turn coil includes an extending body at the second end thereof, the extending body of said second-level metal line in the Nth turn coil is connected to the extending body of said third-level metal line in the (N+1)th turn coil through the via plugs in the third isolating layer.

6. The inductor structure of claim 4, wherein said metal shielding ring comprises three levels of metal rings respectively formed at the same levels as the metal lines in said coil, the three levels of metal rings are separated from one another by said second and third isolating layers, and nearby levels of metal rings are interconnected through via plugs in the second and third isolating layers respectively.

7. The inductor structure of claim 4, further comprising a first pad and a second pad respectively connected to the first turn coil and the last turn coil of the N-turn coil for providing connection with external circuits.

8. A method for manufacturing a three-dimension inductor structure formed over a substrate, said inductor structure having an N-turn coil, the N is a nature number, each turn coil in the N-turn coil comprising a first-level metal line having a first end and a second end, a second-level metal line having a first part and second part, and a third-level metal line having a first end and a second end, the first and second parts of said second-level metal line in each turn coil being respectively connected to the first and second ends of said first-level metal line in the same turn coil, the first end of said third-level metal line in each turn coil being connected to the first part of said second-level metal line in the same turn coil, the second end of said third-level metal line in the (N+1)th turn coil being connected to the second part of said second-level metal line in the Nth turn coil, said method comprising the steps of:

forming a first isolating layer disposed over said substrate;

forming said first-level metal line of each turn coil on the first isolating layer;

forming a second isolating layer overlaying all first-level metal lines;

forming via plugs in the second isolating layer for providing connection for all first-level metal lines;

forming said second-level metal line of each turn coil on the second isolating layer, and connecting the first and second parts of said second-level metal line of each turn coil to the first and second ends of said first-level metal line of the same turn coil respectively through the via plugs in the second isolating layer;

forming a third isolating layer overlaying all second-level metal lines;

forming via plugs in the third isolating layer for providing connection for all second-level metal lines;

forming said third-level metal line of each turn coil on the third isolating layer, and connecting the first end of said third-level metal line of the Nth turn coil to the first part of said second-level metal line of the Nth turn coil and the other end to the second part of said second-level metal line of the (N+1)th turn coil through the via plugs in the third isolating layer.

9. The method of claim 8, wherein said inductor structure further comprises a first pad and a second pad respectively connected to the first turn coil and the last turn coil of the N-turn coil for providing connection with external circuits.