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Wafer cleaning system

  • US 6,039,059 A
  • Filed: 09/30/1996
  • Issued: 03/21/2000
  • Est. Priority Date: 09/30/1996
  • Status: Expired due to Term
First Claim
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1. A cleaning apparatus comprising:

  • a probe having a solid, elongated forward portion with a substantially constant cross section, and a rear portion with a cross-sectional area larger than the cross-sectional area of said forward portion, said probe being made of a material which efficiently transmits megasonic vibration energy;

    a heat transfer member made of material which is a better heat conductor than that of the probe having one end phase coupled to an end phase of said probe rear portion;

    a container for receiving a cleaning fluid and a wafer to be cleaned, said probe being supported so that said forward portion of the probe is positioned in the container while the probe rear portion is positioned outside of the container; and

    a vibrator coupled to an opposite end face of said member for megasonically vibrating said probe with energy transmitted through the member to produce substantial lateral vibration along the length of the probe so as to dislodge particles on a flat surface of the wafer when said probe forward portion is positioned close to and parallel to the flat surface and the cleaning fluid is applied to the flat surface and said probe forward portion to create a miniscus of fluid between the probe and the flat surface.

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