Semiconductor device manufacturing system having means for reducing a pressure difference between loadlock and processing chambers

• US 6,039,770 A
• Filed: 06/05/1998
• Issued: 03/21/2000
• Est. Priority Date: 06/25/1997
• Status: Expired due to Term

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Chae, Seung-ki, Yang, Yun-sik, Cha, Hun
• Primary Examiner(s): Graybill, David E.
• Application Number:
  US09/090,862
• Time in Patent Office: 655 Days
• Field of Search: 29/25.01, 204/298.25, 204/298.26, 204/298.35, 438/908, 118/719, 118/50
• US Class Current: 29/25.01
• CPC Class Codes: C23C 14/566 using a load-lock chamber
• CPC Class Codes: H01L 21/67017 Apparatus for fluid treatment H01L21/67126, H01L21/6715 take precedence

Abstract

A semiconductor manufacturing system includes a loadlock chamber, a low level vacuum pump connected to said loadlock chamber so as to create a low level vacuum in the loadlock chamber, a processing chamber in which a semiconductor manufacturing process is carried out while the processing chamber is maintained at a high level vacuum, a gate valve interposed between and connecting the loadlock chamber and the processing chamber, and a pressure relieving device for reducing the pressure difference between the low level vacuum of the loadlock chamber and the high level vacuum of the processing chamber at the time the gate valve is opened. The pressure relieving device is a high level vacuum pump which can be dedicated to the loadlock chamber or which can be the same pump as that used to evacuate the processing chamber. The high level vacuum pump is connected to the loadlock chamber by an air valve. The system is operated under a method in which air is fed to both the air valve and with a certain delay thereafter to the gate valve. The air valve opens first, and the high level vacuum pump evacuates the loadlock chamber before the fed air opens the gate valve. In this way, particles in the loadlock chamber are prevented from being induced into the processing chamber at the time of transfer of objects from the loadlock chamber to the processing chamber through the gate valve.

Claims

1. A semiconductor manufacturing system comprising:

a loadlock chamber;

a low level vacuum pump connected to said loadlock chamber so as to create a low level vacuum in said loadlock chamber;

a processing chamber in which a semiconductor manufacturing process is carried out while the processing chamber is maintained at a high level vacuum of a pressure that is less than that of said low level vacuum;

a gate valve interposed between and connecting said loadlock chamber and said processing chamber, said gate valve being movable between a closed position at which said processing chamber is isolated from said loadlock chamber and an open position at which said chambers are open to each other so as to facilitate the transfer of objects from said loadlock chamber to said processing chamber; and

pressure relieving means for reducing the pressure difference between the low level vacuum of said loadlock chamber and the high level vacuum of said processing chamber when the gate valve is moved from said closed to said open position thereof.

2. The semiconductor manufacturing system as claimed in claim 1, wherein said pressure relieving means comprises a high level vacuum pump, and a high level vacuum line connecting said high level vacuum pump to said loadlock chamber so as to produce a high level vacuum in said loadlock chamber.

3. The semiconductor manufacturing system as claimed in claim 2, wherein said high level vacuum pump is also connected to said processing chamber.

4. The semiconductor manufacturing system as claimed in claim 2, further comprising opening/closing means, disposed in said high level vacuum line, for opening and closing said high level vacuum line between said high level vacuum pump and said loadlock chamber.

5. The semiconductor manufacturing system as claimed in claim 4, further comprising a filter disposed in said high level vacuum line between said loadlock chamber and said opening/closing means.

6. The semiconductor manufacturing system as claimed in claim 5, further comprising a manual valve disposed in said high level vacuum line between said loadlock

chamber and said filter.

7. A semiconductor manufacturing system comprising:

a loadlock chamber;

a low level vacuum pump connected to said loadlock chamber so as to create a low level vacuum in said loadlock chamber;

a processing chamber in which a semiconductor manufacturing process is carried out while the processing chamber is maintained at a high level vacuum of a presuure that is less than that of said low level vacuum;

an air actuatable gate valve interposed between and connecting said loadlock chamber and said processing chamber, said gate valve being movable between a closed position at which said processing chamber is isolated from said loadlock chamber and an open position at which said chambers are open to each other so as to facilitate the transfer of objects from said loadlock chamber to said processing chamber;

an air supply line system connected to said gate valve and through which system air passes to move said gate valve between said open and closed positions thereof;

a high level vacuum pump;

a high level vacuum line connecting said high level vacuum pump to said loadlock chamber, whereby said loadlock chamber can also be evacuated to a high level vacuum of a pressure that is less than that of said low level vacuum; and

an air valve disposed in said high level vacuum line, said air valve being movable by air between an open position at which said high level vacuum pump is in open communication with said loadlock chamber and a closed position at which said high level vacuum line is closed between said high level vacuum pump and said loadlock chamber, said air valve being operatively connected to said air supply line system so as to be opened by air passing through said system to open said gate valve.

8. The semiconductor manufacturing system as claimed in claim 7, further comprising delay means, disposed in said air supply line system, for creating a delay in the passing of air through said air supply line system toward said gate valve.

9. The semiconductor manufacturing system as claimed in claim 8, wherein said air supply line system comprises an opening line through which air passes to open said gate valve, and a closing line through which air passes to close said gate valve, and said delay means is disposed in said opening line at a location between said gate valve and a point where said air valve is connected to said air supply line system.

10. The semiconductor manufacturing system as claimed in claim 7, wherein said high level vacuum pump is also connected to said processing chamber so as to create said high level vacuum therein.

11. The semiconductor manufacturing system as claimed in claim 7, further comprising a filter disposed in said high level vacuum line between said air valve and said loadlock chamber.

12. The semiconductor manufacturing system as claimed in claim 8, wherein said delay means is a needle valve.

13. The semiconductor manufacturing system as claimed in claim 9, wherein said delay means is a needle valve.

14. A method of operating a semiconductor system which includes a loadlock chamber, a low level vacuum pump connected to said loadlock chamber, a processing chamber, a gate valve interposed between and connecting said loadlock chamber and said processing chamber, said gate valve being movable between a closed position at which said processing chamber is isolated from said loadlock chamber and an open position at which said chambers are open to each other, a high level vacuum line connecting said high level vacuum pump to said loadlock chamber, and an air valve disposed in said high level vacuum line, said air valve being movable by air between an open position at which said high level vacuum pump is in open communication with said loadlock chamber and a closed position at which said high level vacuum line is closed between said high level vacuum pump and said loadlock chamber, said method comprising:

loading at least one object to be processed into the loadlock chamber and operating the low level vacuum pump to maintain the loadlock chamber at a constant low vacuum level;

evacuating the processing chamber until the processing chamber is maintained at a constant high vacuum level of a pressure that is less than that of said low vacuum level;

subsequently opening the air valve to place the high level vacuum pump in open communication with the loadlock chamber and operating the high level vacuum pump until the loadlock chamber assumes a constant high vacuum level of a pressure that is less than that of said low vacuum level, whereby a pressure differential between the loadlock chamber and the processing chamber is reduced;

subsequently opening the gate valve; and

subsequently transferring the at least one object from the loadlock chamber to the processing chamber through the open gate valve.

15. The method of operating a semiconductor manufacturing system as claimed in claim 14, and in which manufacturing system the high level vacuum pump is connected to said processing chamber,

wherein the step of evacuating the processing chamber comprises operating the high level vacuum pump connected thereto.

16. The method of operating a semiconductor manufacturing system as claimed in claim 14, and which manufacturing system further includes an air supply line system connected to the gate valve, and a divergence air line connecting the air supply line system to the air valve,

wherein the steps of opening the gate valve and the air valve comprise feeding air from an air source through the air supply line system toward the gate valve.

17. The method of operating a semiconductor manufacturing system as claimed in claim 15, and which manufacturing system further includes an air supply line system connected to the gate valve, and a divergence air line connecting the air supply line system to the air valve,

wherein the steps of opening the gate valve and the air valve comprise feeding air from an air source through the air supply line system toward the gate valve.