High-speed drilling system for micro-via pattern formation, and resulting structure

• US 6,040,552 A
• Filed: 01/30/1997
• Issued: 03/21/2000
• Est. Priority Date: 01/30/1997
• Status: Expired due to Term

• Current Assignee: Anvik Corporation
• Original Assignee: Anvik Corporation
• Inventors: Jain, Kanti, Farmiga, Nestor O., Dunn, Thomas J., Kling, Carl C., Weisbecker, Carl
• Primary Examiner(s): Evans, Geoffrey S.
• Application Number:
  US08/794,217
• Time in Patent Office: 1,146 Days
• Field of Search: 219/121.73, 219/121.77, 219/121.74, 219/121.75, 219/121.7, 219/121.71, 359/629
• US Class Current: 219/121.7
• CPC Class Codes: B23K 26/066 by using masks
• CPC Class Codes: B23K 26/067 Dividing the beam into multiple beams, e.g. multifocusing
• CPC Class Codes: B23K 26/0676 into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
• CPC Class Codes: B23K 26/384 of specially shaped holes
• CPC Class Codes: H05K 2203/0557 Non-printed masks
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/0026 by laser ablation
• CPC Class Codes: H05K 3/0032 of organic insulating material

Abstract

Economical production of laser-drilled high-precision, ultra-miniature multiple-via-hole patterns is accomplished by multiplexing the homogenized, shaped, nearly-collimated output of a high-power excimer laser into a modular set of condenser lens/mask/projection lens beamlines. A substrate delivery subsystem provides a continuous supply of film substrate segments as blanks during production. Functional modularization permits the building and easy retooling of a hard-tooling multiple-beamline system powered by a high-power laser. Vertical modularization permits the building of a single-beamline soft-tooling pilot system, which may be used to demonstrate a production technique, or may be used for short production runs, and which may later be incremented with additional vertical subassemblies for additional beamlines. Multiplexing of the laser output beam into the set of beamlines is accomplished by an illumination module, which may be implemented as a single 100%-reflective fold mirror for a single-beamline pilot system, and can also be implemented as a single-block echelon mirror, or implemented as a multi-beamsplitter set of decreasing-reflectivity mirrors as mirror position approaches the beam source. The resulting product is a film blank with a via-pattern of precise micro-vias, useful as an aerosol nozzle or filter.

Claims

1. A multiple-via-hole via-pattern drilling system, having a substrate delivery subsystem for presenting a set of substrate segments at a processing station, and for carrying away each substrate segment set after processing, characterized by:

a) a laser module (1) arranged generally in operational proximity to said processing station, being operational to produce a powerful beam output of pulses;

b) a beam processing module (3) arranged to accept the beam output of said laser module (1) and forward a shaped beam with the selected numerical aperture;

c) a homogenizing and recollimating module (4) arranged to accept the beam output of said beam processing module (3) and forward a shaped, uniform, and nearly collimated beam;

d) an illumination module (6) arranged to accept the beam output of said homogenizing and recollimating module (4) and to reconfigure the beam output into a set of sub-beams of predetermined characteristics in an operational pattern;

e) a condenser module (7) having a set of one or more condenser lens assemblies arranged each to accept a related sub-beam from said illumination module (6) and to illuminate a set of via-hole patterns;

f) a mask module (9), having said via-hole patterns arranged to accept the sub-beam outputs of said condensermodule (7); and

g) a projection module (11) arranged to accept the sub-beam via-pattern outputs of said mask module (9) to provide a set of said related mask-patterned Imaging sub-beams for via-drilling a substrate currently presented at said processing station.

2. A multiple-via-hole via-pattern drilling system according to claim 1, wherein said illumination module (6) comprises an increasing-reflectivity set of mirrors 1 . . . n, to provide a set of sub-beams of predetermined characteristics, one sub-beam at each beamline of a set of beamlines, permitting a single laser of sufficient power to be multiplexed for the simultaneous drilling of a via-pattern of via-holes of predetermined characteristics in each beamline of said set of beamlines, according to the respective sub-beam characteristics and respective mask via-pattern, in the respective substrate blank.

3. A multiple-via-hole via-pattern drilling system according to claim 2, wherein said sub-beams are matched in intensity and said increasing-reflectivity subset of mirrors have reflectivity according to the following formula:

space="preserve" listing-type="equation">Reflectivity=100%/n,

where n is the mirror position number increasing toward the radiation source.

4. A multiple-via-hole via-pattern drilling system according to claim 1, wherein said illumination module (6) comprises an echelon configured to provide a subset of sub-beams of predetermined characteristics at each of a subset of beamlines, permitting a single laser to be multiplexed for the simultaneous drilling of a subset of via-holes of predetermined characteristics according to sub-beam characteristics and mask characteristics.

5. A multiple via-hole via-pattern drilling system according to claim 4, wherein said echelon mirror is configured with a finite number of angled facets interspersed with passive flats, and said single laser output is homogenized and supplied as a rectangular-cross-section beam such that equal portions of the beam impinge on each angled facet equally.

6. A multiple via-hole via-pattern drilling system according to claim 4, wherein said illumination module (6) comprises an echelon mirror (6B) configured with a finite number of angled facets interspersed with passive flats, and said single laser output is homogenized and supplied as a rectangular-cross-section beam to impinge on each of said angled facets appropriately to supply the related beamline with the selected optical sub-beam.

7. A multiple via-hole via-pattern drilling system according to claim 1, wherein said illumination module (6) comprises a single flat mirror and said single laser output is homogenized and is configured by a set of beam-blocking apertures so as to provide a subset of sub-beams of predetermined characteristics for each of a subset of beamlines.

8. A multiple via-hole via-pattern drilling system according to claim 1, wherein the predetermined characteristics of the sub-beams produced by said illumination module (6) are identical in each beamline.

9. A multiple via-hole via-pattern drilling system according to claim 1, wherein the predetermined characteristics of the sub-beams produced by said illumination module (6) differ in at least one beamline.

10. A multiple via-hole via-pattern drilling system according to claim 1, wherein said homogenizer comprises a light tunnel which has a polygonal cross-section, is constructed of mirror strips with internally reflecting surfaces, serves to uniformize an input beam by multiple internal reflections and preserves the numerical aperture of the light beam.

11. A multiple via-hole via-pattern drilling system according to claim 10, wherein said homogenizer light tunnel is rectangular in cross-section.

12. A multiple via-hole via-pattern drilling system according to claim 1, wherein said mask module comprises a mask pattern made in the form of reflective regions on a transparent substrate.

13. A multiple via-hole via-pattern drilling system according to claim 1, wherein said mask module comprises a mask pattern made in the form of opaque regions on a transparent substrate.

14. A multiple via-hole via-pattern drilling system according to claim 1, wherein said mask module comprises a mask pattern made in the form of a stencil in a metal sheet.

15. A vertical condenser/mask/projection sub-subassembly, for use in any one of a set of beamline positions in a mask-patterned laser via-drilling system, comprising:

adjustable condenser lens means, for focusing an input sub-beam at a mask position despite upstream optical path length difference related to position;

mask pattern means (9) appropriately positioned for receiving a related sub-beam from a related illumination module; and

projection means (11);

which mask pattern means and projection means are arranged to provide, in combination, via-pattern drilling means for the assigned beamline.

16. A method of drilling micro-vias in a substrate according to a set of related masks, characterized by the following steps:

(Step

     1) Allocating a laser module (1) having sufficient power to perform simultaneous via-hole-drilling of a large number of via-holes;

(Step

     2) Arranging a beam processing module (3) to accept the beam output of said (1) and forward a shaped beam with the selected numerical aperture;

(Step

     3) Arranging a homogenizing and recollimatina module (4) to accept the beam output of said beam processing module (3) and forward a shaped, collimated beam;

(Step

     4) Arranging an illumination module (6) to accept the beam output of said homogenizing and recollimating module (4) and to reconfigure the beam output into a set of one or more sub-beams in an operational pattern;

(Step

     5) Arranging a condenser module (7) having a set of one or more beamlines, each to accept a related sub-beam from said illumination module (6) and to provide a masked subset of said related sub-beams for drilling a substrate blank presented to a processing station;

(Step

     6) Arranging a mask module (9) to accept the sub-beam outputs of said illumination module (6) and to pattern the sub-beam outputs into a set of one or more sub-beam via-patterns according to a set of masks; and

(Step

     7) Arranging a projection module (11) to accept the sub-beam via-pattern outputs of said mask module (9) to provide a set of said related mask-patterned sub-beams for via-drilling a substrate currently presented at a processing station.

17. An aerosol nozzle structure produced by a process of drilling micro-vias in a substrate according to a set of related masks, characterized by the following steps:

(Step

     1) Allocating a laser module (1) having sufficient power to perform simultaneous via-hole-drilling of a large number of via-holes;

(Step

     2) Arranging a beam processing module (3) to accept the beam output of said laser module (1) and forward a shaped beam with the selected numerical aperture;

(Step

     3) Arranging a homogenizing and recollimating module (4) to accept the beam output of said beam processing module (3) and forward a shaped, collimated beam;

(Step

     4) Arranging an illumination module (6) to accept the beam output of said homogenizing and recollimating module (4) and to reconfigure the beam output into a set of one or more sub-beams in an operational pattern;

(Step

     5) Arranging a condenser module (7) having a set of one or more beamlines, each to accept a related sub-beam from said illumination module (6) and to provide a masked subset of said related sub-beams for drilling a substrate blank presented to a processing station;

(Step

     6) Arranging a mask module (9) to accept the sub-beam outputs of said illumination module (6) and to pattern the sub-beam outputs into a set of sub-beam via-patterns according to a set of masks; and

(Step

     7) Arranging a projection module (11) to accept the sub-beam via-pattern outputs of said mask module (9) to provide a set of said related mask-patterned sub-beams for via-drilling a substrate currently presented at a processing station.

18. A via-patterned structure produced by a process of drilling micro-vias in a substrate according to a set of related masks, characterized by the following steps:

(Step

     1) Allocating a laser module (1) having sufficient power to perform simultaneous via-hole-drilling of a large number of via-holes;

(Step

     2) Arranging a beam processing module (3) to accept the beam output of said laser module (1) and forward a shaped beam with the selected numerical aperture;

(Step

     3) Arranging a homogenizing and recollimating module (4) to accept the beam output of said beam processing module (3) and forward a shaped, collimated beam;

(Step

     4) Arranging an illumination module (6) to accept the beam output of said homogenizing and recollimating module (4) and to reconfigure the beam output into a set of sub-beams in an operational pattern;

(Step

     5) Arranging a condenser module (7) having a set of one or more beamlines, each to accept a related sub-beam from said illumination module (6) and to provide a masked subset of said related sub-beams for drilling a substrate blank presented to a processing station;

(Step

     6) Arranging a mask module (9) to accept the sub-beam outputs of said illumination module (6) and to pattern the sub-beam outputs into a set of one or more sub-beam via-patterns according to a set of masks; and

(Step

     7) Arranging a projection module (11) to accept the sub-beam via-pattern outputs of said mask module (9) to provide a set of said related mask-patterned sub-beams for via-drilling a substrate currently presented at a processing station.

19. A vertical beam-splitter, condenser, mask and projection subassembly (22) for use in a mask-patterned laser via-drilling system, for installation optically downstream from a source of uniformized, shaped laser radiation, in an assigned beamline position in a set of beamline positions, for imaging a via-drilling pattern onto a substrate segment, characterized by:

partially reflective beam splitter mirror means, for dividing an input beam into a sub-beam at an assigned subassembly position, having upstream optical path reflectivity reductions related to upstream subassembly positions;

condenser lens means, for accepting said sub-beam from said beam splitter mirror means for the assigned position, and focusing said sub-beam, having focal length correction for upstream optical path length differences related to position, forward onto a mask position;

mask pattern means (9) appropriately positioned for receiving the said related sub-beam from said related condenser lens means; and

projection means (11) appropriately positioned for receiving the said related sub-beam from said related mask pattern means, and imaging said related sub-beam, patterned by said related mask pattern means (9), onto a segment of the substrate at the imaging position of said substrate handling module;

whereby the vertical subassembly provides, for the assigned beamline, a via-drilling pattern to the substrate according to said mask pattern means.

20. A multiple-via-hole via-pattern drilling system, in which a substrate is temporarily presented for processing at a processing station, characterized by:

A) radiation delivery means (1-4) arranged in operational proximity to said processing station, being operational to produce a powerful beam output of pulses in the form of a shaped, uniformized beam of nearly collimated radiation with a selected numerical aperture;

B) multiplexing condenser means (6-8) arranged to accept the beam output of said radiation delivery means (14) and to reconfigure the beam output into a set of sub-beams, of predetermined characteristics, into a related set of at least one operational pattern sub-beam;

C) mask pattern means (9), arranged to accept the operational pattern sub-beam output of said multiplexing condenser means (6-8) and to modify such operational pattern sub-beam into a related mask-patterned sub-beam projection via-pattern; and

D) projection means (11) arranged to accept said mask-patterned sub-beam projection via-pattern output of said mask pattern means (9) to provide a set of at least one related mask-patterned imaging sub-beam for via-drilling a substrate contemporaneously presented at said processing station.

21. A multiple-via-hole via-pattern drilling system, in which a substrate is temporarily presented for processing at a processing station, according to claim 20, further characterized in that:

said mask pattern means (9) and said projection means (11) are configured together as a vertical mask/projection sub-subassembly, for use in a mask-patterned laser via-drilling system, for use in any one of a set of beamline positions, comprising;

mask pattern means (9) appropriately positioned for receiving a related sub-beam from a related illumination module; and

projection means (11);

which mask pattern means and projection means are arranged to provide a via-pattern for drilling along the assigned beamline.

22. A multiple-via-hole via-pattern drilling system according to claim 20, further characterized in that:

said radiation delivery means (1-4) is arranged for multiplexing by elements in a downstream optical path; and

said downstream optical path comprises said multiplexing condenser means (6-8);

said mask pattern means (9); and

said projection means (11);

which means are arranged to provide a set of separate vertical subassemblies forming a finite number of beamlines each with condensing, mask-pattern, and projection functions, to provide a set of related mask-patterned imaging sub-beams for via-drilling a related set of substrate segments currently presented at said processing station.

23. A multiple-via-hole via-pattern drilling system according to claim 20, further characterized in that:

said radiation delivery means (1-4) is arranged for multiplexing by elements in a downstream optical path; and

said downstream optical path comprises a set of vertical subassemblies, one vertical subassembly for each set of one or more beamlines, each comprising for the related beamline set;

said condenser means (6-8);

said mask pattern means (9); and

said projection means (11), which means are arranged to provide a set of separate vertical subassemblies forming a finite number of beamlines each with condensing, mask-pattern, and projection functions, to provide a set of related mask-patterned imaging sub-beams for via-drilling a related set of substrate segments contemporaneously presented at said processing station, the placement characteristics and focal length characteristics of said condenser means varying as a function of radiation path length so as to have proper mask-pattern illumination at the processing station, for each beamline.

24. A multiple-via-hole via-pattern drilling system according to claim 20, further characterized in that:

said radiation delivery means (1-4) is arranged for multiplexing by elements in a downstream optical path;

said downstream optical path comprises a set of one or more beamlines, each of said beamlines comprising a first vertical sub-subassembly and a second vertical sub-subassembly;

said first vertical sub-subassembly, for each of said beamlines, comprising beam-splitting condenser means (6-8) which provides for each beamline a related sub-beam appropriately corrected for focal length related to position, for providing the related sub-beam with appropriate characteristics; and

said second vertical subassembly for each of said beamlines comprising mask pattern means (9) appropriately positioned for receiving the related sub-beam from the related first vertical subassembly, and further comprising projection means (11), which mask pattern means and projection means are arranged to provide, in combination, a drilling via-pattern for the assigned beamline,

whereby separate first and second vertical sub-subassemblies in optical series form a finite number of beamlines each with appropriate condensing, mask-pattern, and projection functions, to provide a set of related mask-patterned imaging sub-beams for via-drilling a related set of substrate segments contemporaneously presented at said processing station, the mirror-reflectivity and placement characteristics and focal length characteristics of said first vertical subassemblies varying as a function of beamline position assignment and of beamline-position-related radiation path length so as to have proper imaging for drilling, at the processing station, for each beamline, and said second vertical subassemblies being of common design regardless of beamline position.

25. A vertical beam-splitter and condenser sub-subassembly (25-1;

25-2 . . . 25-n) for use in a mask-patterned laser via-drilling system, for installation optically downstream from a source of uniformized, shaped laser radiation, in an assigned beamline position 1, 2, 3 . . . n in a set of beamline positions for imaging a via-drilling pattern onto a substrate segment via, assigned to each beamline position 1-n, a first sub-subassembly and a second sub-subassembly in optical series characterized in that;

said first sub-subassembly comprises a partially reflective beam splitter mirror with graduated reflectivity increasing with assigned beamline position 1, 2, 3 . . . n, for dividing an input beam into a sub-beam at the assigned beamline position, to forward a positionally reduced sub-beam related to its own reflectivity and upstream optical path reflectivity related to upstream subassembly positions and to divert a beam of balanced intensity into its own assigned beamline; and

condenser lens means, for accepting said balanced sub-beam from said beam splitter mirror means for the assigned position, and focusing said balanced sub-beam, with focal length correction for optical path length differences related to beamline position, forward onto a mask position of a second sub-subassembly in the beamline position.

26. A vertical mask and projection sub-subassembly (26) for use in a mask-patterned laser via-drilling system, for installation optically downstream from a source of uniformized, shaped laser radiation, processed by upstream optics into a positionally-reduced sub-beam in any assigned beamline position 1, 2, 3 . . . n in a set of beamline positions 1-n, each beamline position being assigned for imaging a via-drilling pattern onto a substrate segment, as a second sub-subassembly to work downstream from any first sub-subassembly in optical series said vertical mask/projection sub-subassembly, comprising:

mask pattern means (9), positioned for receiving the said related balanced sub-beam from a first sub-subassembly mounted in the assigned beamline position, for forwarding a mask-patterned sub-beam for the beamline position; and

projection means (11) positioned for receiving the mask-patterned sub-beam for the beamline position from said related mask pattern means (9), and for imaging said mask-patterned sub-beam for the beamline position onto a receiving means.

27. A vertical condenser, mask and projection subassembly (28) for use in a mask-patterned laser via-drilling system, for installation optically downstream from a source of uniformized, shaped laser radiation, processed by upstream optics into a positionally-reduced sub-beam in any assigned beamline position 1, 2, 3 . . . n in a set of beamline positions 1-n, each beamline position being assigned for imaging a via-drilling pattern onto a substrate segment, as a sub-subassembly to work downstream from a beam divider (27) in optical series, said vertical mask/projection sub-subassembly comprising:

condenser means;

mask pattern means (9), positioned for receiving the said related balanced sub-beam from a first sub-subassembly mounted in the assigned beamline position, for forwarding a mask-patterned sub-beam for the beamline position; and

projection means (11) positioned for receiving the mask-patterned sub-beam for the beamline position from said related mask pattern means (9), and for imaging said mask-patterned sub-beam for the beamline position onto a receiving means.

28. A vertical condenser, mask and projection subassembly (28) according to claim 27, wherein said condenser means is adjustable for focus.