Semiconductor package using terminals formed on a conductive layer of a circuit board
First Claim
Patent Images
1. A package including:
- a circuit board;
an set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and
packaging material surrounding the set of circuit elements and part of the circuit board,wherein one side of the circuit board includes a set of terminals that are visible from the side of the package, the set of terminals being positioned away from the edge of the circuit board, andwherein the package is a flash EEPROM package.
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Accused Products
Abstract
A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.
359 Citations
26 Claims
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1. A package including:
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a circuit board; an set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are visible from the side of the package, the set of terminals being positioned away from the edge of the circuit board, and wherein the package is a flash EEPROM package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A package including:
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a circuit board; at least one integrated circuit on the circuit board; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board is exposed, the exposed side of the circuit board including a set of terminals connected to the remainder of the circuit board by vias; and wherein the package is a flash EEPROM package. - View Dependent Claims (11, 12, 13, 14)
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15. A package including:
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a circuit board; a set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and a plastic material encasing the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are accessible from the side of the package, the set of terminals being positioned away from the edge of the circuit board; and wherein the package is a flash EEPROM package. - View Dependent Claims (16, 17, 18, 19, 20)
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21. A completed non-volatile memory package for use with a host device, comprising:
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a circuit board; at least one IC attached to the circuit board, including an array of flash EEPROM cells; terminals which are included in a side of the circuit board and positioned away from an edge of the circuit board; and packaging material surrounding the at least one IC, and part of the circuit board, but not the terminals, whereby the terminals are exposed in the completed package. - View Dependent Claims (22, 23)
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24. A completed non-volatile memory package for use with a host device, comprising:
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a circuit board having a first side and a second side; a row of terminals provided on the first side of the circuit board; an IC electrically connected with the terminals, the IC being provided on the second side of the circuit board; and packaging material encapsulating the IC and part of the second side of the circuit board, wherein the IC includes an array of flash EEPROM cells. - View Dependent Claims (25, 26)
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Specification