Sensor package arrangement

• US 6,040,625 A
• Filed: 09/25/1997
• Issued: 03/21/2000
• Est. Priority Date: 09/25/1997
• Status: Expired due to Fees

• Current Assignee: I/O Sensors Incorporated
• Original Assignee: I/O Sensors Incorporated
• Inventors: Ip, Matthew W.
• Primary Examiner(s): Monin, Jr., Donald L.
• Assistant Examiner(s): DIETRICH, MICHAEL C
• Application Number:
  US08/935,093
• Time in Patent Office: 908 Days
• Field of Search: 257/785, 257/719, 257/727, 257/688, 257/689, 73/514.32
• US Class Current: 257/719
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A highly sensitive silicon micro-machined sensor package is provided for use in a micro-g environment that can also resist high shock in excess of 5000 g. The sensor is provided to measure acceleration in cooperation with associated electronics which are required to have electrical contact with sensor elements. The sensor is sealed in a high vacuum environment, and is arranged and designed to be free of temperature induced stress to the sensor. The sensor die package assembly comprises a silicon micro-machined sensor die, a ceramic package, two contact springs, a shorting clip, solder preform, a metal lid and a getter foil for ensuring a good vacuum for an extended period. The sensor die comprises a moving mass with eight supporting flexures on both sides of the proof mass. The proof mass'"'"'s movement is protected on both sides by a top and a bottom cap. Acceleration applied to the package and the die causes the proof mass to move vertically in relation with the adjacent caps. The changes in distance between the proof mass and the caps in turn generate a change in an electrical signal which corresponds to the capacitance changes between the gaps. The sensor die package arrangement provides that the sensor die be secured within an evacuated ceramic case. Electrical connections made between external contacts of the case and contacts of the sensor die within the case are made through conductive springs, thereby minimizing materials in the interior of the case which would outgass in the vacuum environment.

Claims

1. A sensor-package arrangement comprising,

a case of insulating material, said case having walls which define an internal cavity, said cavity having at least one internal surface with conductive material thereon and having a conductive channel placed in one of said walls between an external conductive contact on the exterior of said case and said conductive material of said internal surface,

a sensor die disposed between walls in said cavity of said case, said sensor die having at least one die electrical contact,

an electrically conductive spring placed between said conductive material of said internal surface and said die electrical contact,

whereby said spring resiliently forces said sensor die against at least one of said walls of said cavity and completes a conductive path which includes said conductive channel from said external conductive contact to said die electrical contact,

said case having a conductive top surface and a second conductive channel placed in one of said walls between a second external conductive contact on the exterior of said case and said conductive top surface,

said sensor die having top and bottom sides with said bottom side facing downwardly in said cavity and said top side facing upwardly, said top side having a second electrical surface,

a conductive lid to which a downwardly facing electrically conductive top spring is attached, said lid being electrically connected while being physically secured to said top surface of said case,

said conductive top spring arranged and designed to force said sensor die downwardly in said cavity while contacting said second electrical surface,

whereby said lid and said attached secured spring simultaneously close said cavity, force said sensor die into said cavity, and complete an electrically conductive path from said second external conductive contact to said second electrical surface of said die.

2. The sensor-package arrangement of claim 1 wherein,

said cavity has a bottom conductive surface, and a third conductive channel placed in said case between said bottom conductive surface and a third conductive contact on the exterior of said case,

said sensor die has a third electrical surface which contacts said bottom conductive surface of said cavity when said sensor die is placed in said cavity, and

whereby an electrical path between said third electrical path surface of said sensor die and said third conductive contact on the exterior of said case is established when said sensor die is disposed within said cavity and when said lid and said attached spring simultaneously close said cavity.

3. The sensor-package arrangement of claim 1 wherein,

said conductive lid is electrically connected and secured to said conductive top surface of said case with solder, and said conductive lid and said forms a seal about said conductive top surface.

4. The sensor-package arrangement of claim 1 wherein,

said interior of said cavity when closed by said lid is evacuated to create a vacuum therein, and

said sensor die and said springs therein are characterized of being of substantially inorganic materials whereby outgassing of molecules in said vacuum is minimized.

5. The sensor-package arrangement of claim 4 further comprises,

getter material disposed in said closed evacuated cavity for absorbing outgassing molecules within said cavity.

6. A sensor-package combination comprising,

a case (40) of insulating material having a cavity defined by a first pair of internal walls and a second pair of internal walls which are transverse to said walls of said first pair of internal walls, said cavity being arranged and designed to accept a sensor die therein, said case (40) having an electrical external contact (CM), an electrical internal contact (C'"'"') and a conductive path (66) from said external contact (CM) to said internal contact (C'"'"'),

a sensor die (22) placed within said cavity, said die (22) having a die electrical contact (29, 34), said die having a first pair of sides and a second pair of sides which are transverse to said first pair of sides,

a first spring (32, 33) which is electrically conductive and has first and second ends disposed in said cavity between said internal contact (C'"'"') of said cavity and said sensor die (22) with said first spring (32, 33) having said first end being fixedly secured to said internal contact (C'"'"') and establishing electrical contact at said second end with said die electrical contact (29, 34) solely by the force of said first spring (32, 33) pressing against said die electrical contact (29, 34) at one side of said first pair of sides of said die whereby said first spring (32) secures said die against one wall of said pair of walls of said first pair of internal walls in said cavity and simultaneously completes an electrical path from said die electrical contact to said electrical external contact, and

a second spring (35) disposed in said cavity between a side of said second pair of sides of said sensor die (22) and a first wall of said second pair of internal walls of said cavity of said case (40), whereby said second spring (35) secures said die against a second wall of said second pair of internal walls,

whereby said first (32, 33) and second (35) springs securely position said sensor die (22) into a corner of said cavity formed by said one wall of said first pair of internal walls and said second wall of said second pair of internal walls.

7. The sensor-package arrangement of claim 6 wherein said first end of said spring is spot-welded to said internal contact (C'"'"') of said case 40.

8. The sensor-package arrangement of claim 6 wherein said die electrical contact includes first and second conductive surfaces (29) of a sensor (20) and a shorting clip (34) which electrically contacts said first and second conductive surfaces (29).