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Bottom lead semiconductor chip package

  • US 6,043,430 A
  • Filed: 02/13/1998
  • Issued: 03/28/2000
  • Est. Priority Date: 03/14/1997
  • Status: Expired due to Term
First Claim
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1. A chip package, comprising:

  • a chip;

    a plurality of lower leads that are attached to a lower side of the chip;

    a plurality of upper leads that are attached to an upper side of the chip and that are connected to corresponding ones of the lower leads;

    a plurality of conductive media that couple ones of the upper and lower leads with corresponding ones of a plurality of chip pads formed on the chip; and

    a molding section packaging the chip, the conductive media and the upper and lower leads such that upper and lower surfaces of the upper and lower leads, respectively, are externally exposed.

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