Thick film elements

• US 6,043,467 A
• Filed: 05/09/1997
• Issued: 03/28/2000
• Est. Priority Date: 11/26/1994
• Status: Expired due to Fees

• Current Assignee: Pifco Limited (Spectrum Brands Holdings, Inc.)
• Original Assignee: Otter Controls Limited
• Inventors: Little, Peter James
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): ROBINSON, DANIEL LEON
• Application Number:
  US08/836,998
• Time in Patent Office: 1,054 Days
• Field of Search: 219/203, 219/522, 219/542, 219/543, 219/547, 219/464, 219/465, 219/528, 219/466, 219/468, 219/449, 219/438, 219/441, 219/544, 338/13, 338/22 R, 338/225 D, 338/306-309, 392/444, 392/441, 337/303-309
• US Class Current: 219/542
• CPC Class Codes: H05B 1/0269 For heating of fluids
• CPC Class Codes: H05B 2203/013 Heaters using resistive films or coatings
• CPC Class Codes: H05B 2203/017 Manufacturing methods or apparatus for heaters
• CPC Class Codes: H05B 2213/04 Heating plates with overheat protection means
• CPC Class Codes: H05B 3/262 the insulating base being an insulated metal plate
• CPC Class Codes: H05B 3/746 Protection, e.g. overheat cutoff, hot plate indicator

Abstract

A thick film resistive heating element having a thick film resistive track applied to the surface of an electrically insulative substrate. An encapsulating insulating layer is applied over the track to protect it while an area of the element is left uncovered by the encapsulating layer so as to define a window. A portion of a temperature sensitive control device is then placed in direct contact with the track and/or the electrically insulative substrate through the window. The window in the element is located in that area of the element which will be uncovered by the liquid prior to the rest of the element as the liquid boils away or is evacatuated from the vessel.

Claims

1. A thick film resistive heating element comprising:

an electrically insulative substrate;

a thick film resistive track applied to a surface of said electrically insulative substrate and terminating in respective electrical contact portions, said resistive track having a thickness; and

an encapsulating insulating layer applied to said thick film resistive track but not over said electrical contact portions, said encapsulating insulating layer applied over at least a portion of said surface of said electrically insulative substrate in order to protect said thick film resistive track, an area of said surface of said electrically insulative substrate and of said thick film resistive track being uncovered by said encapsulating insulating layer so as to define a window adapted such that a temperature sensitive controller can be placed in direct contact with at least one of a portion of said thick film resistive track and a portion of said electrically insulative substrate, the resistive track within the window comprises a plurality of tracks which are thinner than the thickness of the resistive track outside the window.

2. The element as claimed in claim 1 wherein a power density of the track is increased in said window over an average power density of a remainder of the track.

3. The element as claimed in claim 1, wherein the plurality of tracks have balanced lengths within the window so that adjacent tracks within the window are substantially at equipotential.

4. The element as claimed in claim 3, wherein the plurality of tracks within the window are arranged so that at least two tracks loop around opposite sides of and in close proximity to a portion of said substrate wherein there is no resistive track.

5. The element as claimed in claim 1 wherein the thick film resistive track outside of said window has a portion thereof extending in close proximity to said window.

6. The element as claimed in claim 1 wherein said substrate has a peripheral edge, said window being positioned adjacent to said peripheral edge.