Electronic devices and methods of forming electronic devices
First Claim
1. An electronic device comprising:
- a substrate having a support surface;
a first conductor on the support surface of the substrate, the first conductor including a predetermined portion which defines a first area and a second area on the support surface;
an electrical component coupled with the first conductor; and
a second conductor comprising a conductive adhesive, the second conductor being positioned over the support surface of the substrate and across the predetermined portion of the first conductor, the conductive adhesive being substantially electrically insulated from the first conductor and configured to electrically couple the first area with the second area.
5 Assignments
0 Petitions
Accused Products
Abstract
The present invention provides electronic devices and methods of forming electronic devices. One embodiment of the present invention provides an electronic device which includes a substrate having a support surface; a first conductor over the support surface of the substrate, the first conductor including a predetermined portion which defines a first area and a second area of the support surface; at least one electrical component coupled with the first conductor; and a second conductor comprising a conductive adhesive, the second conductor being positioned over the support surface of the substrate and across the predetermined portion of the first conductor, the conductive adhesive being configured to electrically couple the first area with the second area.
31 Citations
55 Claims
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1. An electronic device comprising:
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a substrate having a support surface; a first conductor on the support surface of the substrate, the first conductor including a predetermined portion which defines a first area and a second area on the support surface; an electrical component coupled with the first conductor; and a second conductor comprising a conductive adhesive, the second conductor being positioned over the support surface of the substrate and across the predetermined portion of the first conductor, the conductive adhesive being substantially electrically insulated from the first conductor and configured to electrically couple the first area with the second area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An apparatus configured to conduct electricity comprising:
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a substrate having a support surface; a first conductor over the support surface of the substrate and the first conductor having a predetermined portion which defines a first area and a second area on the support surface; a dielectric over the predetermined portion of the first conductor intermediate the first area and the second area; and a second conductor over the dielectric and the support surface of the substrate, the second conductor comprising an adhesive configured to conduct electricity from the first area to the second area. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A wireless identification device comprising:
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a flexible substrate having a support surface; a conductive pattern over the support surface of the substrate, the conductive pattern including a plurality of conductors; an electrical component coupled with the conductive pattern; a dielectric layer over a predetermined portion of the conductive pattern; and a conductive adhesive over the dielectric layer and operable to couple plural conductors of the conductive pattern. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of forming an electronic device comprising:
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forming a first conductor over a support surface of a substrate; forming a second conductor over the support surface of the substrate, the second conductor comprising an adhesive operable to conduct electricity; defining a first area and a second area of the support surface of the substrate using the first conductor; substantially electrically insulating the second conductor from the first conductor; and conducting electricity intermediate the first area and the second area using the second conductor. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37)
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38. A method of forming a remote intelligent communication device comprising:
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providing a flexible substrate having a support surface; forming a conductive pattern over the support surface of the substrate, the conductive pattern including a plurality of conductors; coupling at least one electrical component with the conductive pattern; forming a dielectric layer over at least a predetermined portion of the conductive pattern; providing a conductive adhesive over the dielectric layer and the support surface of the substrate; and coupling plural conductors of the conductive pattern using the conductive adhesive. - View Dependent Claims (39, 40, 41, 42, 43, 44, 45)
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46. A method of conducting electricity comprising:
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providing a substrate having a support surface; forming a first conductor over the support surface of the substrate, the first conductor defining a first area adjacent a first side of the first conductor and a second area adjacent a second side of the first conductor; providing a dielectric layer over at least a portion of the first conductor; conducting electricity from the first area to the second area using a conductive adhesive; and insulating the first conductor from the conductive adhesive using the dielectric. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54)
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55. A method of forming a remote intelligent communication device comprising:
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providing a flexible substrate having a support surface; printing a conductive pattern upon the support surface of the flexible substrate, the conductive pattern comprises a polymer thick film and includes a first conductor operable to conduct electricity; defining a first area and a second area upon the flexible substrate using the first conductor; forming a dielectric layer over at least a predetermined portion of the first conductor; depositing conductive epoxy at preselected positions upon the support surface of the substrate; electrically coupling the deposited conductive epoxy with the conductive pattern; coupling a battery with the conductive pattern using the conductive epoxy; coupling an integrated circuit with the conductive pattern using the conductive epoxy, the integrated circuit including a transmitter, receiver, memory, and microprocessor in cooperation with one another; depositing conductive epoxy upon the dielectric layer to provide a second conductor; coupling the second conductor with the conductive pattern at the first area and the second area; insulating the first conductor and second conductor using the dielectric; and encapsulating the battery, the integrated circuit, the conductive pattern, the second conductor and the support surface of the substrate using an encapsulant.
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Specification