Methods of making connections to a microelectronic unit

• US 6,044,548 A
• Filed: 03/10/1998
• Issued: 04/04/2000
• Est. Priority Date: 02/01/1994
• Status: Expired due to Term

• Current Assignee: Tessera, Inc. (Adeia, Inc.)
• Original Assignee: Tessera, Inc. (Adeia, Inc.)
• Inventors: Smith, John W. Jr., Distefano, Thomas H.
• Primary Examiner(s): Hughes, S. Thomas
• Assistant Examiner(s): Trinh, Minh
• Application Number:
  US09/038,366
• Time in Patent Office: 756 Days
• Field of Search: 29/840, 29/830, 29/876, 29/841, 439/66, 439/91, 439/67, 228/180.1, 228/180.21, 228/180.22
• US Class Current: 29/840
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 21/4885 Wire-like parts or pins wire ball formation B23K20/00; methods related to connecting semiconductor or other solid state bodies H01L24/00
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/10 Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01032 Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 Molybdenum [Mo]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49208 : by assembling plural parts

Abstract

A method of making connections to a microelectronic unit includes the steps of providing a connection component having a flexible dielectric top sheet, a plurality of terminals on the top sheet and a plurality of electrically conductive, elongated flexible leads connected to the terminals and extending side-by-side downwardly from the terminals away from the top sheet to bottom ends remote from the top sheet. The connection component is then engaged with a front surface of a microelectronic unit having an array of contacts thereon while subjecting the connection component and the microelectronic unit to heat and pressure so that bottom ends of the leads remote from the top sheet bond with the contacts on the microelectronic unit to form electrical connections therewith.

Claims

1. A method of making connections to a microelectronic unit comprising the steps of:

(a) providing a connection component including a flexible dielectric top sheet, a plurality of terminals on said top sheet and a plurality of electrically conductive, elongated flexible leads connected to said terminals and extending side-by-side downwardly from said terminals away from said top sheet to bottom ends remote from the top sheet; and

(b) engaging said connection component with a front surface of a microelectronic unit having an array of contacts thereon while subjecting said connection component and unit to heat and pressure and so that bottom ends of the leads remote from the top sheet bond with the contacts on the unit to form electrical connections therewith.

2. A method as claimed in claim 1 wherein said engaging step is performed so that at least some of said flexible leads are bent during said engagement step.

3. A method as claimed in claim 1 wherein a compliant support layer surrounds said leads during said engaging step.

4. A method as claimed in claim 1 further comprising the step of injecting a curable liquid material around said leads and curing said liquid material so as to form a compliant support layer surrounding said leads.

5. A method as claimed in claim 2 wherein each said lead is form from a wire between 100 microns and 1,000 microns long and less than 100 microns in diameter.

6. A method as claimed in claim 1 further comprising the step of bending said leads prior to said engagement step.