Multilayer microelectronic circuit

• US 6,046,409 A
• Filed: 02/26/1998
• Issued: 04/04/2000
• Est. Priority Date: 02/26/1997
• Status: Expired due to Fees

• Current Assignee: NGK Spark PLUG Company Limited
• Original Assignee: NGK Spark PLUG Company Limited
• Inventors: Ishii, Tetsuya, Katagiri, Hiroshi, Shingaki, Tadashi, Takemura, Tatsuya
• Primary Examiner(s): SOUGH, HYUNG SUB
• Application Number:
  US09/031,074
• Time in Patent Office: 768 Days
• Field of Search: 174/260, 174/255, 174/261, 333/185, 333/219, 333/175, 361/790, 361/795
• US Class Current: 174/255
• CPC Class Codes: H01P 7/084 Triplate line resonators H01P7/088 takes precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 2201/09181 Notches in edge pads
• CPC Class Codes: H05K 2201/10068 Non-printed resonator
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

A multilayer microelectronic circuit to be directly mounted on a substrate and to be used, for example, as a resonator. The multilayer microelectronic circuit comprises a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, the dielectric layers and the patterned electrodes forming an electrical circuit. The laminated structure has side surfaces extending along a direction in which the dielectric layers and the patterned electrodes are laminated. An input line is formed at one of the side surfaces and connected with an input section of the electrical circuit. An output line is formed at one of the side surfaces and connected with an output section of the electrical circuit. A grounding line is formed at one of the side surfaces and connected with a grounding section of the electrical circuit. Additionally, a signal line formed at one of the side surfaces, for connecting sections of the electrical circuit. The signal line has an end positioned adjacent a mounting surface at which the multilayer microelectronic circuit is directly mounted on the substrate, in which the end of the signal line is separate from the mounting surface so as to be insulated from electrical contact with the substrate.

Claims

1. A microelectronic circuit to be directly mounted on a substrate, comprising:

a structure including an electrical circuit and having side surfaces;

an input line formed at one of said side surfaces and connected with an input section of said electrical circuit;

an output line formed at one of said side surfaces and connected with an output section of said electrical circuit;

a grounding line formed at one of said side surfaces and connected with a grounding section of said electrical circuit; and

a signal line formed at one of said side surfaces, for connecting sections of said electrical circuit, said signal line having an end positioned adjacent a mounting surface at which said microelectronic circuit is directly mounted on the substrate, the end of said signal line being separate from said mounting surface so as to be insulated from electrical contact with the substrate.

2. A microelectronic circuit as claimed in claim 1, wherein each of said input line, said output line, said grounding line, and said signal line is a metallized surface of a channel formed at one of said side surfaces, wherein said channel corresponding to said signal line is formed to be prevented from extending to a portion of said structure between the end of said signal line and the mounting surface, said portion having a surface which is flush with the side surface of said structure.

3. A multilayer microelectronic circuit to be directly mounted on a substrate, comprising:

a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, said dielectric layers and said patterned electrodes forming an electrical circuit, said laminated structure having side surfaces extending along a direction in which said dielectric layers and said patterned electrodes are laminated;

an input line formed at one of said side surfaces and connected with an input section of said electrical circuit;

an output line formed at one of said side surfaces and connected with an output section of said electrical circuit;

a grounding line formed at one of said side surfaces and connected with a grounding section of said electrical circuit; and

a signal line formed at one of said side surfaces, for connecting sections of said electrical circuit, said signal line having an end positioned adjacent a mounting surface at which said multilayer microelectronic circuit is directly mounted on the substrate, the end of said signal line being separate from said mounting surface so as to be insulated from electrical contact with the substrate.

4. A multilayer microelectronic circuit as claimed in claim 3, wherein each of said input line, said output line, said grounding line, and said signal line is a metallized surface of a channel formed at one of said side surfaces, wherein said channel corresponding to said signal line is formed to be prevented from extending to a portion of said laminated structure between the end of said signal line and the mounting surface, said portion having a surface which is flush with the side surface of said laminated structure.

5. A multilayer microelectronic circuit as claimed in claim 4, wherein said channel corresponding to said signal line is formed to be prevented from extending to a peripheral portion of said dielectric layer whose lower surface serves as the mounting surface.

6. A multilayer microelectronic circuit as claimed in claim 3, wherein each dielectric layer is formed of a dielectric ceramic material, and each patterned electrode is formed of a baked electrically conductive paste and formed on each dielectric layer.

7. A multilayer microelectronic circuit as claimed in claim 3, wherein a state in which the end of said signal line is separate from said mounting surface is established by trimming an end section of a linear arrangement which includes said signal line and extends throughout the side surface to reach said mounting surface, said end section being formed contiguous with the end and located between the end of said signal line and said mounting surface.

8. A multilayer microelectronic circuit to be directly mounted on a substrate, comprising:

a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, said dielectric layers and said patterned electrodes forming an electrical circuit, said laminated structure having side surfaces extending along a direction in which said dielectric layers and said patterned electrodes are laminated, said dielectric layers including a lower-most dielectric layer which has a mounting surface at which said multilayer microelectronic circuit is directly mounted on the substrate, said dielectric layers other than said lower-most dielectric layer being formed respectively with grooves which form a channel at one of the side surfaces, said lower-most dielectric layer being free of said groove;

an input line formed at one of said side surfaces and connected with an input section of said electrical circuit;

an output line formed at one of said side surfaces and connected with an output section of said electrical circuit;

a grounding line formed at one of said side surfaces and connected with a grounding section of said electrical circuit; and

a signal line formed at the surface of said channel, for connecting sections of said electrical circuit, said signal line having an end positioned adjacent said mounting surface, the end of said signal line being separate from said mounting surface so as to be insulated from electrical contact with the substrate.