Semiconductor radiation detector with enhanced charge collection

• US 6,046,454 A
• Filed: 10/03/1997
• Issued: 04/04/2000
• Est. Priority Date: 10/13/1995
• Status: Expired due to Term

• Current Assignee: Digirad Corporation
• Original Assignee: Digirad Corporation
• Inventors: Butler, Jack F., Doty, F. Patrick, Lingren, Clinton L., Conwell, Richard L., Apotovsky, Boris, Friesenhahn, Stanley J.
• Primary Examiner(s): Hannaher, Constantine
• Assistant Examiner(s): Jiron, Darren M.
• Application Number:
  US08/943,492
• Time in Patent Office: 914 Days
• Field of Search: 250/370.13, 250/370.01, 250/385.1, 250/374
• US Class Current: 250/370.01
• CPC Class Codes: G01T 1/241 Electrode arrangements, e.g. continuous or parallel strips or the like constructional or manufacturing details H01L31/00
• CPC Class Codes: G01T 1/243 Modular detectors, e.g. arrays formed from self contained units constructional or manufacturing details H01L25/00
• CPC Class Codes: H01L 27/14603 Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
• CPC Class Codes: H01L 27/14659 Direct radiation imagers structures
• CPC Class Codes: H01L 27/14676 X-ray, gamma-ray or corpuscular radiation imagers measuring X-, gamma- or corpuscular radiation G01T1/00

Abstract

A radiation detector for detecting ionizing radiation. The detector includes a semiconductor having at least two sides. A bias electrode is formed on one side of the semiconductor. A signal electrode is formed on a side of the semiconductor and is used to detect the energy level of the ionizing radiation. A third electrode (the control electrode) is also formed on the semiconductor. The control electrode shares charges induced by the ionizing radiation with the signal electrode, shielding the signal electrode until the charge clouds are close to the signal electrode. The control electrode also alters the electric field within the semiconductor, such that the field guides the charge clouds toward the signal electrode when the clouds closely approach the signal electrode. As a result, signal loss due to trapped charge carriers (i.e., electrons or holes) is minimized, and low-energy tailing is virtually eliminated. A fourth electrode can be added to separate the charge-shielding and field shaping functions of the control electrode. More electrodes can be added to further enhance both functions. The invention can be used in several cross-strip detector configurations, in a side-entry radiation detector, and with liquid/gas ionization detectors.

Claims

1. A radiation detector, comprising:

(a) a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

(b) at least one bias electrode formed on at least one side of the semiconductor;

(c) at least one signal electrode formed on at least one side of the semiconductor;

(d) at least one focus control electrode, formed on at least one side of the semiconductor and having a first potential, for directing charge clouds resulting from ionizing events in the semiconductor towards an associated signal electrode; and

(e) at least one shield control electrode, formed on at least one side of the semiconductor near each signal electrode and having a second potential, for reducing the effect on an associated signal electrode of charge induced by trapped charges in the semiconductor.

2. The radiation detector of claim 1, wherein the shield control electrode is electrically insulated from, but capacitively coupled to, the semiconductor.

3. The radiation detector of claim 1, wherein second potential is the same as the first potential.

4. The radiation detector of claim 1, wherein second potential is different from the first potential.

5. A radiation detector, comprising:

(a) a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

(b) at least one bias electrode formed on at least one side of the semiconductor;

(c) at least one signal electrode formed on at least one side of the semiconductor;

(d) at least one focus control electrode, formed on at least one side of the semiconductor and having a first potential, for directing charge clouds resulting from ionizing events in the semiconductor towards an associated signal electrode; and

(e) at least one shield control electrode, formed on at least one side of the semiconductor near the signal electrode and having a second potential, for reducing the effect on an associated signal electrode of charge induced by trapped charges in the semiconductor; and

(f) at least one supplemental shielding control electrode, formed on at least one side of the semiconductor and having a third potential, for reducing the effect on an associated signal electrode of charge induced by trapped charges in the semiconductor.

6. The radiation detector of claim 5, wherein the shield control electrode is electrically insulated from, but capacitively coupled to, the semiconductor.

7. The radiation detector of claim 5, wherein at least one supplemental shield control electrode is electrically insulated from, but capacitively coupled to, the semiconductor.

8. The radiation detector of claim 5, wherein at least two of the first potential, second potential, and third potential are different.

9. A cross-strip radiation detector, comprising:

(a) a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

(b) at least one independent parallel strip bias electrode formed on at least one side of the semiconductor;

(c) a plurality of signal electrodes formed on at least one side of the semiconductor and intercoupled as at least two independent signal strips effectively orthogonal to the parallel strip bias electrodes, each signal strip including one or more electrically coupled signal electrodes; and

(d) at least one control electrode, formed on at least one side of the semiconductor, for performing at least one of the functions of (A) directing charge clouds resulting from ionizing events in the semiconductor towards the signal electrode and (B) substantially reducing the effect on the signal electrode of hole trapping in the semiconductor.

10. The cross-strip radiation detector of claim 9, wherein a position for an ionizing event can be determined from measuring signals on the independent signal strips and the parallel strip bias electrodes.

11. A cross-strip radiation detector, comprising:

(a) a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

(b) at least one bias electrode formed on at least one side of the semiconductor;

(c) a plurality of signal electrodes formed on at least one side of the semiconductor and intercoupled as at least two independent signal strips, each signal strip including one or more electrically coupled signal electrodes; and

(d) a plurality of independent parallel strip control electrodes, formed on at least one side of the semiconductor near the signal electrodes and effectively orthogonal to the signal strips, for performing at least one of the functions of (A) directing charge clouds resulting from ionizing events in the semiconductor towards the signal electrode and (B) substantially reducing the effect on the signal electrode of hole trapping in the semiconductor.

12. The cross-strip radiation detector of claim 11, wherein a position for an ionizing event can be determined from measuring signals on the independent signal strips and the independent parallel strip control electrodes.

13. The cross-strip radiation detector of claim 11, wherein a radiation detection measurement signal is taken from the independent parallel strip control electrodes.

14. A cross-strip radiation detector, comprising:

(a) a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

(b) at least one independent parallel strip bias electrode formed on at least one side of the semiconductor;

(c) a plurality of independent parallel strip signal electrodes formed on at least one side of the semiconductor effectively orthogonal to the parallel strip bias electrodes; and

(d) a plurality of parallel strip control electrodes, formed on at least one side of the semiconductor near and interdigitated with the parallel strip signal electrodes, for performing at least one of the functions of (A) directing charge clouds resulting from ionizing events in the semiconductor towards the signal electrode and (B) substantially reducing the effect on the signal electrode of hole trapping in the semiconductor.

15. The cross-strip radiation detector of claim 14, wherein a position for an ionizing event can be determined from measuring signals on the independent parallel signal strips and the independent parallel strip bias electrodes.

16. A radiation detector, comprising:

(a) a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

(b) at least one bias electrode formed on at least one side of the semiconductor;

(c) a plurality of signal electrodes formed on at least one side of the semiconductor and interconnected as at least two independent signal elements, each signal element including one or more electrically coupled signal electrodes; and

(d) at least one control electrode, formed on at least one side of the semiconductor near the signal electrodes, for directing charge clouds resulting from ionizing events in the semiconductor towards the signal electrodes and for substantially reducing the effect on the signal electrodes of hole trapping in the semiconductor.

17. The radiation detector of claim 16, further including means for varying the number and effective size of each independent signal element by varying the number of interconnected signal electrodes included in each independent signal element, wherein the spatial resolution and efficiency of the radiation detector is a function of the number and size of the independent signal elements.

18. A radiation detector, comprising:

(a) a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation, the semiconductor having a radiation illumination surface;

(b) at least one bias electrode formed on at least one side of the semiconductor orthogonal to the illumination surface;

(c) at least one signal electrode formed on at least one side of the semiconductor orthogonal to the illumination surface; and

(d) at least one control electrode, formed on at least one side of the semiconductor, for performing at least one of the functions of (A) directing charge clouds resulting from ionizing events in the semiconductor towards the signal electrode and (B) substantially reducing the effect on the signal electrode of hole trapping in the semiconductor.

19. The radiation detector of claim 18, further including means for determining the depth of interaction of ionizing events in the semiconductor.

20. The radiation detector of claim 18, further including means for determining the position of interaction of ionizing events in the semiconductor.

21. An ionization chamber, comprising:

(a) a chamber enclosing a radiation interaction material comprising one of a liquid or a gas, the chamber having a plurality of sides;

(b) at least one bias electrode formed on at least one side of the chamber;

(c) at least one a signal electrode formed on at least one side of the chamber; and

(d) at least one control electrode, formed on at least one side of the chamber, for directing charge resulting from ionizing events in the radiation interaction material towards the signal electrode and for substantially reducing the effect on the signal electrode of non-collected ions of an opposite polarity to such charge.

22. A method for determining timing information for a radiation detector having a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

at least one bias electrode formed on at least one side of the semiconductor;

at least one signal electrode formed on at least one side of the semiconductor; and

at least one control electrode, formed on at least one side of the semiconductor for performing at least one of the functions of (A) directing charge clouds resulting from ionizing events in the semiconductor towards at least one signal electrode and (B) substantially reducing the effect on at least one signal electrode of hole trapping in the semiconductor, the method including the steps of;

(a) determining a first time measurement indicating when a signal measured from at least one of the bias electrodes or the control electrodes exceeds a first selected threshold;

(b) determining a second time measurement indicating when a signal on at least one signal electrode exceeds a second selected threshold;

(c) determining the difference between the first time measurement and the second time measurement.

23. The method of claim 22, further including the step of determining the depth of interaction of an ionizing event in the semiconductor from the determined difference between the first time measurement and the second time measurement.

24. A method for determining depth of interaction of an ionizing event in a radiation detector having a semiconductor having a plurality of sides and of sufficient thickness to interact with ionizing radiation;

at least one bias electrode formed on at least one side of the semiconductor;

at least one signal electrode formed on at least one side of the semiconductor; and

at least one control electrode, formed on at least one side of the semiconductor for performing at least one of the functions of (A) directing charge clouds resulting from ionizing events in the semiconductor towards at least one signal electrode and (B) substantially reducing the effect on at least one signal electrode of hole trapping in the semiconductor, the method including the steps of;

(a) measuring a magnitude of charge signal, resulting from ionizing events in the semiconductor, on at least one of the bias electrodes, the control electrodes, or the signal electrodes; and

(b) determining a relationship between depth of interaction of the ionizing event and a combination of the magnitudes of the measured charge signals.

25. A method as in claim 24, further comprising measuring another charge signal from another electrode different from the signal electrode and using a combination of the measured charge signal and another charge signal to determine the relationship.

26. A method as in claim 24, wherein the charge signal is measured from one of the bias electrodes.