Semiconductor temperature sensor and the method of producing the same

• US 6,046,492 A
• Filed: 09/12/1996
• Issued: 04/04/2000
• Est. Priority Date: 09/12/1995
• Status: Expired due to Term

• Current Assignee: SII Semiconductor Corporation (MinebeaMitsumi Inc.)
• Original Assignee: Seiko Instruments Incorporated (Seiko Group)
• Inventors: Shimizu, Toru, Machida, Satoshi, Kawahara, Yukito, Kojima, Yoshikazu, Kuhara, Kentaro
• Primary Examiner(s): Hardy, David B.
• Application Number:
  US08/712,871
• Time in Patent Office: 1,300 Days
• Field of Search: 257/568, 257/567, 257/570, 257/467, 327/575, 327/483
• US Class Current: 257/567
• CPC Class Codes: H01L 27/0825 Combination of vertical direct transistors of the same conductivity type having different characteristics,(e.g. Darlington transistors)

Abstract

A semiconductor temperature sensor comprises independent current sources and bipolar transistors connected to form a Darlington circuit. The bipolar transistors have electrodes each connected to one of the current sources. An output voltage of the semiconductor temperature sensor is adjusted by trimming a current value of at least one of the current sources.

Claims

1. A semiconductor temperature sensor comprising:

a semiconductor substrate;

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlington circuit, the bipolar transistors having first main electrodes each connected to one of the independent current sources and second main electrodes disposed on the semiconductor substrate.

2. A semiconductor temperature sensor comprising:

a plurality of independent current sources each comprised of a field effect transistor; and

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the field effect transistors.

3. A semiconductor temperature sensor comprising:

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources, the bipolar transistors having a current-amplification factor greater than 20.

4. A semiconductor temperature sensor comprising:

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources;

wherein an impurity concentration of a base region of the bipolar transistors is less than 2×

10¹⁶ cm^-3.

5. A semiconductor temperature sensor comprising:

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlinaton circuit and having electrodes each connected to one of the current sources, each of the bipolar transistors having a base region and an bipolar transistors is formed within 6 μ

m outside from the end emitter region disposed inside the base region so that distances between side edges of the base region and the emitter region are within 6 μ

m.

6. A semiconductor temperature sensor according to claim 5;

wherein a cross-sectional shape of the base region of the bipolar transistors is the same as that of the emitter region of the bipolar transistors.

7. A semiconductor temperature sensor according to claim 5;

wherein the bipolar transistors have the same size.

8. A semiconductor temperature sensor comprising:

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources, each of the bipolar transistors having an emitter region;

wherein the emitter regions of the bipolar transistors have the same area.

9. A semiconductor temperature sensor comprising:

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources;

wherein the bipolar transistors have the same current-amplification factor.

10. A semiconductor temperature sensor comprising:

a plurality of bipolar transistors connected to form a Darlington circuit, each of the bipolar transistors having an emitter surrounded by an electrode having a MIS construction.

12. A semiconductor temperature sensor according to claim 10;

wherein an electric potential of the MIS electrode is set to an electric potential of the emitter.

11. A semiconductor temperature sensor according to claim 11;

wherein an electric potential of the MIS electrode is set to base electric potential.

13. A semiconductor temperature sensor comprising:

an integrated circuit having a plurality of bipolar transistors connected to form a Darlington circuit, each of the bipolar transistors having a base diffusion layer spaced from an edge of the integrated circuit by a distance greater than 20 μ

m.

14. A semiconductor temperature sensor comprising:

a semiconductor substrate;

an integrated circuit disposed in the semiconductor substrate and having a plurality of bipolar transistors connected to form a Darlington circuit, each of the bipolar transistors having a base diffusion layer; and

a diffusion layer having an electric conductivity type different from an electric conductivity type of the semiconductor substrate and disposed between the base diffusion layer of each of the bipolar transistors and an edge of the integrated circuit.

15. A semiconductor temperature sensor according to claim 14;

wherein when a voltage is supplied to the diffusion layer, a reverse bias is generated at a junction of the diffusion layer and the semiconductor substrate.

16. A semiconductor temperature sensor comprising:

a plurality of independent current sources;

a plurality of bipolar transistors connected to form a Darlington circuit and having main electrodes each connected to one of the current sources, each of the bipolar transistors having base electrodes some of which are each connected to respective main electrodes of another of the bipolar transistors;

an operational amplifier having an input terminal connected to the bipolar transistor main electrodes which are not connected to the bipolar transistor base electrodes; and

an output pad connected to an output terminal of the operational amplifier.

17. A semiconductor temperature sensor according to claim 16;

wherein the bipolar transistors comprise PNP bipolar transistors; and

wherein the operational amplifier comprises a plurality of operational amplifiers having a plurality of differential input portions comprised of NMOS transistors.

18. A semiconductor temperature sensor according to claim 17;

wherein a threshold voltage of the NMOS transistors is less than 0.6 V.

19. A semiconductor temperature sensor according to claim 17;

wherein the operational amplifiers comprise PMOS transistors having a threshold voltage greater than -0.6 V.

20. A semiconductor temperature sensor comprising:

a plurality of independent current sources;

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources;

a switching element having a plurality of input terminals each connected to a respective electrode of the bipolar transistors; and

an output pad connected to an output terminal of the switching element.

21. A semiconductor temperature sensor comprising:

a plurality of independent current sources;

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources;

a switching element having a plurality of input terminals each connected to a respective electrode of the bipolar transistors;

an operational amplifier having an input terminal connected to an output terminal of the switching element; and

an output pad connected to an output terminal of the operational amplifier an output terminal connected to an input terminal of an operational amplifier, and an output terminal of said operational amplifier is connected to an output pad.

22. A semiconductor temperature sensor comprising:

a plurality of independent current sources;

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources; and

a plurality of output pads each connected to a respective electrode of the bipolar transistors.

23. A semiconductor temperature sensor comprising:

a plurality of independent current sources;

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources;

a plurality of operational amplifiers having input terminals connected to respective electrodes of the bipolar transistors; and

output pads connected to respective output terminals of the operational amplifiers.

24. A semiconductor temperature sensor comprising:

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources;

wherein an output voltage or sensibility of the semiconductor temperature sensor is adjusted by trimming a current value of at least one of the current sources.

25. A semiconductor temperature sensor comprising:

a plurality of independent current sources; and

a plurality of bipolar transistors connected to form a Darlington circuit and having electrodes each connected to one of the current sources;

wherein an output voltage or sensibility of the semiconductor temperature sensor is adjusted by connecting a plurality of the current sources selectively to the electrodes of at least one of the bipolar transistors.

26. A method of producing a semiconductor temperature sensor, comprising the steps of:

forming a semiconductor temperature sensor having a semiconductor wafer, a plurality of current sources and a plurality of bipolar transistors connected to form a Darlington circuit, the bipolar transistors having a plurality of electrodes disposed on the semiconductor wafer and connected to the respective current sources in a matrix-shape;

measuring an output voltage of the semiconductor temperature sensor at a predetermined temperature; and

trimming a current value of the current sources in accordance with the measured output voltage and preselected temperature.