Methodology for improved semiconductor process monitoring using optical emission spectroscopy

• US 6,046,796 A
• Filed: 04/22/1998
• Issued: 04/04/2000
• Est. Priority Date: 04/22/1998
• Status: Expired due to Fees

• Current Assignee: Advanced Micro Devices, Inc.
• Original Assignee: Advanced Micro Devices, Inc.
• Inventors: Nauert, Chris A., Cheng, Yi, Patty, Richard B., Gatto, Michael J., Markle, Richard J.
• Primary Examiner(s): Font, Frank G.
• Assistant Examiner(s): Smith, Zandra V.
• Application Number:
  US09/064,470
• Time in Patent Office: 713 Days
• Field of Search: 356/311, 356/316, 356/318, 356/72, 216/60
• US Class Current: 356/72
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/32972 Spectral analysis
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

In a semiconductor process which utilizes a plasma within a process tool chamber, a method of using optical emission spectroscopy (OES) to monitor a particular parameter of the process is disclosed. A first wavelength present in the plasma is determined which varies highly in intensity depending on the particular parameter by observing a statistically significant sample representing variations of the particular parameter. A second wavelength of chemical significance to the process is also determined which is relatively stable in intensity over time irrespective of variations of the particular parameter, also by observing a statistically significant sample representing variations of the particular parameter. These two wavelengths may be determined from test wafers and off-line physical measurements. Then, the intensity of the first and second wavelengths present in the plasma is measured on-line during normal processing within the process tool chamber, and the ratio between the first and second wavelength'"'"'s respective intensities generates a numeric value which is correlated to the particular parameter. As an example, such a method may be used to generate a reliable alarm signal indicating the presence of etch stop conditions within a plasma oxide etcher, as well as to indicate the oxide etch rate.

Claims

1. In a semiconductor process which utilizes a plasma within a process tool chamber, a method of using optical emission spectroscopy (OES) to determine whether etch stop conditions are present within the chamber, the method comprising:

first determining a first wavelength present in the plasma which varies highly in intensity depending on whether etch stop conditions are present within the chamber, and also determining a second wavelength of chemical significance to the etching process which is relatively stable in intensity over time irrespective of whether etch stop conditions are present within the chamber, determining both wavelengths by observing a statistically significant sample representing variations of the etching process, wherein the first and the second wavelength are determined by;

first running a statistically significant sample of wafers representing variations of the etching process without etch stop conditions present within the chamber, and measuring OES data for each wafer;

periodically performing physical measurements of etching parameters;

then

running a second sample of wafers while intentionally inducing etch stop conditions within the chamber, and measuring OES data for each wafer of this second sample; and

statistically correlating the OES data against the physical measurement to determine both the first wavelength present in the plasma which varies highly in intensity depending on whether etch stop conditions are present within the chamber, and to determine the second wavelength of chemical significance to the process which is relatively stable in intensity over time irrespective of whether etch stop conditions are present within the chamber;

then

measuring the intensity of the first and second wavelengths present in the plasma on-line during normal processing within the process tool chamber; and

ratioing the first and second wavelength'"'"'s respective intensities to generate a numeric value which is correlated to the presence of etch stop conditions within the chamber.

2. A method as recited in claim 1 wherein the semiconductor process comprises a plasma-assisted etching process.

3. A method as recited in claim 2 wherein the plasma-assisted etching process comprises an oxide etching process.

4. A method as recited in claim 1 wherein the numeric value correlated to the etch stop process is used to generate an alarm signal for indicating when the etch stop process is out of specification.

5. A method as recited in claim 1 wherein the numeric value correlated to the etch stop process is used to determine a physical value of the etch stop process within a range of values.

6. A method as recited in claim 5 wherein the physical value of the etch stop process is used to control the process within the chamber.

7. A method as recited in claim 1 further comprising comparing the numeric value to a predetermined threshold value to generate an alarm signal for indicating when the etch stop process is out of specification.

8. A method as recited in claim 1 wherein:

the first wavelength is chosen which also varies highly in intensity depending on a second parameter, and the second wavelength is chosen which is also relatively stable in intensity over time irrespective of variations of the second parameter, both by observing a statistically significant sample representing variations of the second parameter; and

the numeric value is also correlated to the second parameter.

9. A method as recited in claim 8 further comprising:

comparing the numeric value to a predetermined threshold value to generate an alarm signal for indicating when the etch stop process is out of specification; and

using the numeric value to determine a physical value of the second parameter and to monitor variations of the second parameter.

10. A method as recited in claim 9 wherein the second parameter comprises an etch rate within the chamber.

11. A method as recited in claim 3 wherein the first wavelength is chosen to be approximately 517.6 nm, and the second wavelength is chosen to be approximately 581.2 nm.

12. A method as recited in claim 3 wherein the first wavelength is chosen to be approximately 440.8 nm, and the second wavelength is chosen to be approximately 581.2 nm.