Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges

• US 6,046,905 A
• Filed: 02/17/1998
• Issued: 04/04/2000
• Est. Priority Date: 09/30/1996
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Nelson, Daryl J., Stark, Michael, Rutigliano, Michael, Topic, Lee, Thurston, Mark, Chung, Yoke
• Primary Examiner(s): THOMPSON, GREGORY D
• Application Number:
  US09/024,539
• Time in Patent Office: 777 Days
• Field of Search: 165/80.2, 165/185, 174/16.3, 257/718, 257/719, 257/728, 257/727, 361/704, 361/707, 361/709-710, 361/714-721, 361/737, 361/753, 361/759
• US Class Current: 361/704
• CPC Class Codes: G06F 1/184 Mounting of motherboards
• CPC Class Codes: G06F 1/185 Mounting of expansion boards
• CPC Class Codes: G06F 1/186 Securing of expansion boards in correspondence to slots provided at the computer enclosure
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/4093 Snap-on arrangements, e.g. clips
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 7/1431 Retention mechanisms for CPU modules
• CPC Class Codes: H05K 7/20 Modifications to facilitate cooling, ventilating, or heating
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing

Abstract

An electronic cartridge that includes a pair of spring clips which attach a thermal element to an integrated circuit or an integrated circuit package. The integrated circuit/package is mounted to a substrate. The substrate may be a printed circuit board. The cartridge may have a plurality of pins that extend from the thermal element and through the substrate. Each spring clip may have a pair of bent portions that are attached to the pins of the thermal element. The spring clip exerts a pull force that pulls the thermal element into the integrated circuit/package. The bent ports can be deflected so that at least a minimum pull force is always exerted onto the thermal element even with dimensional variations in the parts of the cartridge. The bent portions can therefore accommodate for tolerances in the cartridge while clamping the thermal element to the integrated circuit/package.

Claims

1. An electronic cartridge, comprising:

a substrate;

an integrated circuit package mounted to said substrate;

a thermal element adjacent to said integrated circuit package, said thermal element having a hole that extends from an inner surface to an outer surface of said thermal element;

a plastic bushing that is pressed into said hole of said thermal element;

a pin that has a first end which extends from said thermal element and through said substrate and a second end that is pressed into said plastic bushing; and

,

a spring clip attached to said pin.

2. The cartridge as recited in claim 1, wherein said spring clip has a bent portion which exerts a force that pulls said thermal element toward said integrated circuit package.

3. The cartridge as recited in claim 1, wherein said pin is inserted through a slot of said spring clip.

4. The cartridge as recited in claim 3, wherein said first end of said pin has a head portion and a groove that capture said spring clip.

5. The cartridge as recited in claim 1, further comprising a thermal grease located between said thermal element and said integrated circuit package.

6. The cartridge as recited in claim 1, wherein said second end of said pin has a stud portion that extends from a shoulder of said pin, said stud portion being inserted into said thermal element.