Method of producing a smart card

• US 6,049,055 A
• Filed: 11/26/1997
• Issued: 04/11/2000
• Est. Priority Date: 02/23/1996
• Status: Expired due to Term

• Current Assignee: Atlantic Zeiser GmbH (Orell Füssli AG)
• Original Assignee: ORGA Kartensysteme GmbH (Sagem Défense Sécurité SAS)
• Inventors: Truggelmann, Uwe, Fannash, Lothar
• Primary Examiner(s): MILLS, GREGORY L
• Application Number:
  US08/952,318
• Time in Patent Office: 867 Days
• Field of Search: 219/121.64, 219/121.66, 219/121.69, 219/121.85, 219/121.61, 148/525, 427/556, 427/597
• US Class Current: 219/121.66
• CPC Class Codes: G06K 1/126 by photographic or thermographic registration recording apparatus for measuring instruments G01D15/00
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 1/02 Details
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/11 Printed elements for providing electric connections to or between printed circuits
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/161 Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
• CPC Class Codes: H05K 3/244 Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473

Abstract

The invention is a method of producing a chip module for use with a smart card. The chip module is mounted in the smart card and has contacts for communicating with external appliances. The contacts of the chip module include at least two layers which are acted upon by a laser beam to fuse the at least two layers forming an alloy. The alloy forms a pattern of visible information on the contacts.

Claims

1. A method for producing a chip module for a smart card having contacts for communication with external appliances, comprising the steps of:

forming the chip module by applying at least first and second metal layers on a substrate;

applying a laser beam to the contacts for fusing two of the at least first and second metal layers wherein the fused two of the at least first and second form an alloy, the alloy forming a pattern of visual information on the contacts of the chip module, the pattern of visual information including at least one segment that extends continuously from a first contact to a second contact across an insulating, metal-free interspace therebetween; and

minimizing the application of the laser beam to the insulating, metal-free interspace between the first contact and the second contact to prevent damage thereto when the laser beam is guided over the interspace between the first contact and the second contact while forming the at least one segment of the pattern that extends continuously from the first contact to the second contact.

2. The method of claim 1, wherein said step of applying a laser beam comprises guiding the laser beam over the contacts using one of a raster and a vector method.

3. The method of claim 2, wherein said step of guiding the laser beam comprises selecting a speed of the laser beam such that a local dwell time and a local radiative energy input associated therewith are effective for formation of the alloy.

4. The method of claim 1, wherein said step of applying a laser beam comprises selecting a speed at which said laser beam is guided over the contacts such that a local dwell time and a local radiative energy input associated therewith are effective for fusing at least three layers of the at least first and second metal layers for formation of the alloy.

5. The method of claim 1, wherein said step of applying a laser beam comprises varying at least one of a size and a shape of the laser beam while guiding the laser beam across the contacts.

6. The method of claim 1, wherein said step of minimizing the application of the laser beam to the insulating, metal-free interspace between the first and second contacts comprises one of switching off, swivelling, dimming, and attenuating the laser beam when the laser beam is guided over the interspace between the first and second contacts.

7. The method of claim 1, wherein said step of applying a laser beam further comprises applying the laser beam to the contacts through a mask designed in accordance with the visual information to be applied to the contacts.

8. The method of claim 7, wherein said step of minimizing the application of the laser beam to the insulating, metal-free interspace between the first and second contacts comprises at least partially blocking the laser beam from reaching the interspace between the first and second contacts with the mask.

9. The method of claim 7, wherein said step of applying the laser beam comprises selecting a speed of the laser beam such that a local dwell time of the laser beam on the contacts and a local radiative energy input associated therewith are effective for the formation of the alloy.

10. The method of claim 7, wherein said step of applying a laser beam comprises selecting a speed at which said laser beam is guided over said contacts such that a local dwell time and a local radiative energy input associated therewith are effective for fusing at least three layers of the at least first and second metal layers for the formation of the alloy.

11. The method of claim 1, wherein said step of applying a laser comprises using a neodymium YAG laser.

12. The method of claim 1, wherein said step of applying a laser comprises using a excimer laser.

13. The method of claim 1, wherein said step of applying a laser comprises using a CO₂ laser.

14. The method of claim 1, wherein said step of applying a laser comprises using a pulsed operation laser.

15. The method of claim 1, wherein said step of applying a laser comprises using a continuous mode laser.

16. The method of claim 1, further comprising the step of positioning a smart card with a chip module mounted therein in a laser inscription system before the step of applying a laser.

17. The method of claim 1, wherein the step of applying a laser beam comprises applying the laser beam to the contacts when the chip module is mounted on an intermediate product which comprises a plurality of chip modules for a plurality of smart cards.

18. The method of claim 1, wherein said step of forming the contacts comprises the step of forming a plurality of chip modules on an intermediate product, each of the chip modules containing contacts for receiving a chip and insertable in the smart card;

and

said step of forming an alloy comprises applying the laser to each of the plurality of chip modules.

19. The method of claim 1, wherein said step of forming the chip module includes forming a layered structure comprising a copper layer, a nickel layer, and at least one noble-metal layer.

20. The method of claim 1, wherein said step of forming the chip module includes forming a layered structure comprising a copper layer, a nickel layer, and gold layer.

21. The method of claim 1, wherein said step of forming the chip module includes forming a layered structure comprising a copper layer, a nickel layer, and silver layer.

22. The method of claim 1, wherein said step of forming the chip module includes forming a layered structure comprising a copper layer, a nickel layer, and palladium layer.

23. The method of claim 1, wherein said step of forming the chip module includes forming a layered structure comprising a copper layer, a nickel layer, a palladium layer, and a gold layer.

24. The method of claim 1, wherein said step of forming the chip module includes forming a layered structure comprising a copper layer and a noble-metal layer.

25. The method of claim 1, wherein said step of forming the chip module includes forming a layered structure comprising a bronze layer and a noble-metal layer.

26. A method for producing a chip module for a smart card having contacts for communication with external appliances, comprising the steps of:

forming the chip module by applying at least first and second metal layers on a substrate;

applying a laser beam to the contacts for fusing two of the at least first and second metal layers wherein the fused two of the at least first and second form an alloy, the alloy forming a pattern of visual information on the contacts of the chip module; and

varying an intensity of the laser beam while guiding the laser beam over the contacts for forming different types of alloys from the at least first and second layers along the path of the laser beam.