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Low stress package assembly for silicon-backed light valves

  • US 6,049,094 A
  • Filed: 05/21/1998
  • Issued: 04/11/2000
  • Est. Priority Date: 05/21/1998
  • Status: Expired due to Term
First Claim
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1. A silicon-backed light valve package assembly comprising:

  • a matched coefficient of thermal expansion (CTE) substrate;

    a soft adhesive layer on an upper surface of the matched CTE substrate;

    a silicon-backed light valve attached to the matched CTE substrate by the soft adhesive layer;

    a flexible circuit with an opening, the flexible circuit overlaid on the matched CTE substrate so as to expose the silicon-backed light valve through the opening;

    bonding wires electrically connecting the flexible circuit to the silicon-backed light valve;

    an encapsulant dam attached to the flexible circuit, the encapsulant dam surrounding the silicon-backed light valve and thereby defining a cavity; and

    a soft encapsulant layer disposed in the cavity, the soft encapsulant layer at least partially covering the matched CTE substrate, the flexible circuit and the silicon-backed light valve, and completely covering the bonding wires.

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