Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same
First Claim
1. A microelectronic assembly comprising:
- a polymeric card including a planar major surface and formed of a singular injection molded polymeric body;
an integrated circuit component embedded in the polymeric card and having a first contact and a second contact;
an antenna element formed of a singular metallic strip and comprising a loop, a first terminal, a first antenna segment integrally connecting the first terminal and the loop disposed at a non-parallel angle relative to the planar major surface, a second terminal, a second antenna segment integrally connecting the second terminal and the loop and disposed at a non-parallel angle relative to the planar major surface, said first segment and said second segment positioning the loop such that the loop is spaced apart from the planar major surface and such that the polymeric card encircles the loop, the first terminal and the second terminal having outer surfaces exposed at the planar major surface and coextensive therewith;
a first connection connecting the first contact and the first terminal; and
a second connection connecting the second contact and the second terminal.
1 Assignment
0 Petitions
Accused Products
Abstract
A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12) and has a first contact (20) and a second contact (22). An antenna element (16) is formed of a singular metallic strip and includes a first terminal (26) electrically connected to the first contact (20), a second terminal (28) electrically connected to the second contact (22), and a loop (30) intermediate the first terminal (26) and the second terminal (28). The first terminal (26) includes a first outer surface (32) and the second terminal (28) includes a second outer surface (34). The first outer surface (32) and the second outer surface (34) are exposed at the major surface (18) and are coextensive therewith. The loop (30) is embedded within the polymeric card (12) and spaced apart from the major surface (18).
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Citations
10 Claims
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1. A microelectronic assembly comprising:
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a polymeric card including a planar major surface and formed of a singular injection molded polymeric body; an integrated circuit component embedded in the polymeric card and having a first contact and a second contact; an antenna element formed of a singular metallic strip and comprising a loop, a first terminal, a first antenna segment integrally connecting the first terminal and the loop disposed at a non-parallel angle relative to the planar major surface, a second terminal, a second antenna segment integrally connecting the second terminal and the loop and disposed at a non-parallel angle relative to the planar major surface, said first segment and said second segment positioning the loop such that the loop is spaced apart from the planar major surface and such that the polymeric card encircles the loop, the first terminal and the second terminal having outer surfaces exposed at the planar major surface and coextensive therewith; a first connection connecting the first contact and the first terminal; and a second connection connecting the second contact and the second terminal. - View Dependent Claims (2, 3, 4, 5)
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6. A method for forming a microelectronic assembly comprising an integrated circuit component and a metallic strip antenna encapsulated within a polymeric card having a planar major surface, said method comprising:
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forming a singular metallic strip, said metallic strip including an antenna element comprising a first terminal, a second terminal, and a loop therebetween; attaching an integrated circuit component to the metallic strip to form a preassembly, said integrated circuit component including a first contact attached to the first terminal and a second contact attached to the second terminal; deforming the singular metallic strip to form a first segment intermediate the first terminal and the loop and a second segment intermediate the second terminal and the loop, the metallic strip being bent such that said first segment and said second segment are disposed at a non-parallel angle relative to the planar major surface of the polymeric card; disposing a mold about the preassembly, said mold enclosing the loop and the integrated circuit component; and injecting a polymeric material into the mold, said polymeric material encapsulating the integrated circuit component and the loop to form a molded card. - View Dependent Claims (7, 8, 9, 10)
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Specification