Microelectronic assembly including an antenna element embedded within a polymeric card, and method for forming same

• US 6,049,463 A
• Filed: 07/25/1997
• Issued: 04/11/2000
• Est. Priority Date: 07/25/1997
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Thompson, Lillian C., Carson, George Amos, O'Malley, Grace M., Turlik, Iwona
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): FOSTER, DAVID A
• Application Number:
  US08/900,403
• Time in Patent Office: 991 Days
• Field of Search: 361/760, 361/761, 361/764, 361/737, 361/220, 361/212, 361/777, 174/35 R, 174/35 GC, 174/255, 235/380, 235/439, 235/492, 235/451, 235/488, 235/487, 235/486, 257/679
• US Class Current: 361/760
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases

Abstract

A microelectronic assembly (10) includes a polymeric card (12) that includes a substantially planar major surface (18). An integrated circuit component (14) is embedded in the polymeric card (12) and has a first contact (20) and a second contact (22). An antenna element (16) is formed of a singular metallic strip and includes a first terminal (26) electrically connected to the first contact (20), a second terminal (28) electrically connected to the second contact (22), and a loop (30) intermediate the first terminal (26) and the second terminal (28). The first terminal (26) includes a first outer surface (32) and the second terminal (28) includes a second outer surface (34). The first outer surface (32) and the second outer surface (34) are exposed at the major surface (18) and are coextensive therewith. The loop (30) is embedded within the polymeric card (12) and spaced apart from the major surface (18).

Claims

1. A microelectronic assembly comprising:

a polymeric card including a planar major surface and formed of a singular injection molded polymeric body;

an integrated circuit component embedded in the polymeric card and having a first contact and a second contact;

an antenna element formed of a singular metallic strip and comprising a loop, a first terminal, a first antenna segment integrally connecting the first terminal and the loop disposed at a non-parallel angle relative to the planar major surface, a second terminal, a second antenna segment integrally connecting the second terminal and the loop and disposed at a non-parallel angle relative to the planar major surface, said first segment and said second segment positioning the loop such that the loop is spaced apart from the planar major surface and such that the polymeric card encircles the loop, the first terminal and the second terminal having outer surfaces exposed at the planar major surface and coextensive therewith;

a first connection connecting the first contact and the first terminal; and

a second connection connecting the second contact and the second terminal.

2. A microelectronic assembly in accordance with claim 1, wherein the first connection is composed of a wire bond.

3. A microelectronic assembly in accordance with claim 1, wherein the first connection is composed of a solder bump interconnection.

4. A microelectronic assembly in accordance with claim 1, wherein the loop is spaced apart from the planar major surface by a predetermined distance.

5. A microelectronic assembly in accordance with claim 4, wherein the predetermined distance is between about 125 and 1125 microns.

6. A method for forming a microelectronic assembly comprising an integrated circuit component and a metallic strip antenna encapsulated within a polymeric card having a planar major surface, said method comprising:

forming a singular metallic strip, said metallic strip including an antenna element comprising a first terminal, a second terminal, and a loop therebetween;

attaching an integrated circuit component to the metallic strip to form a preassembly, said integrated circuit component including a first contact attached to the first terminal and a second contact attached to the second terminal;

deforming the singular metallic strip to form a first segment intermediate the first terminal and the loop and a second segment intermediate the second terminal and the loop, the metallic strip being bent such that said first segment and said second segment are disposed at a non-parallel angle relative to the planar major surface of the polymeric card;

disposing a mold about the preassembly, said mold enclosing the loop and the integrated circuit component; and

injecting a polymeric material into the mold, said polymeric material encapsulating the integrated circuit component and the loop to form a molded card.

7. A method for forming a microelectronic assembly in accordance with claim 6, wherein the step of deforming the singular metallic lead is done before the step of attaching an integrated circuit component.

8. A method for forming a microelectronic assembly in accordance with claim 6, wherein the step of deforming the singular metallic lead is done after the step of attaching an integrated circuit component.

9. A method for forming a microelectronic assembly in accordance with claim 6, wherein the step of injecting comprises injecting a liquid thermoplastic material into the mold.

10. A method for forming a microelectronic assembly in accordance with claim 6, wherein the step of injecting comprises injecting a polymeric precursor into the mold.