Package with reticulated bond shelf
First Claim
1. A component comprising:
- a case with a bond shelf, the bond shelf being characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge, the reticulation inward edge being co-linear with the bond shelf inward edge; and
a conductive layer formed on the bond shelf, the conductive layer including a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation.
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Accused Products
Abstract
A component package includes a case with a bond shelf and a conductive layer formed on the bond shelf. The bond shelf is characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge. The reticulation inward edge is co-linear with the bond shelf inward edge. The conductive layer includes a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation. The component package further includes a chip transistor mounted on a first mounting pad and a chip resistor mounted in a first reticulation. A semiconductor circuit mounted in the component package includes a bonding pad connected to a pad on the chip transistor and one end of the chip resistor.
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Citations
20 Claims
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1. A component comprising:
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a case with a bond shelf, the bond shelf being characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge, the reticulation inward edge being co-linear with the bond shelf inward edge; and a conductive layer formed on the bond shelf, the conductive layer including a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a component comprising steps of:
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forming a case with a bond shelf, the bond shelf being characterized by an inward edge and an outward edge and at least one reticulation, each reticulation being characterized by an outward edge and an inward edge, the reticulation inward edge being co-linear with the bond shelf inward edge; and forming a conductive layer on the bond shelf, the conductive layer including a mounting pad for each reticulation and a serpentine conductor connecting the mounting pads, the mounting pad being disposed between the inward edge of the reticulation and the outward edge of the reticulation. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification