Failure analyzer with distributed data processing network and method used therein
First Claim
1. A failure analyzer for analyzing pieces of test data information having pieces of appearance test data information and pieces of electric test data information, comprising:
- a test system including a visual inspection sub-system carrying out an appearance test for a semiconductor wafer so as to produce said pieces of appearance test data information, and an electric characteristic inspection sub-system carrying out electric tests for integrated circuit devices fabricated on said semiconductor wafer for producing said pieces of electric test data information; and
a data analyzing system connected to said test system for analyzing said pieces of test data information, and implemented by using a client-server network technology.
1 Assignment
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Accused Products
Abstract
A failure analyzer has an electric characteristic inspection system for producing pieces of electric test data information for integrated circuit devices fabricated on a semiconductor wafer, a visual inspection system for producing pieces of appearance test data information for the semiconductor wafer and a data analyzing system for producing a failure analysis report from the pieces of electric test data information and the pieces of appearance test data information, and the data analyzing system is implemented by using a client-server network technology so as to increase a data processing capability depending upon the amount of data to be analyzed.
34 Citations
8 Claims
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1. A failure analyzer for analyzing pieces of test data information having pieces of appearance test data information and pieces of electric test data information, comprising:
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a test system including a visual inspection sub-system carrying out an appearance test for a semiconductor wafer so as to produce said pieces of appearance test data information, and an electric characteristic inspection sub-system carrying out electric tests for integrated circuit devices fabricated on said semiconductor wafer for producing said pieces of electric test data information; and a data analyzing system connected to said test system for analyzing said pieces of test data information, and implemented by using a client-server network technology. - View Dependent Claims (2, 3, 4)
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5. A method for analyzing pieces of data information obtained from an integrated circuit fabricated on a semiconductor wafer, comprising the steps of:
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a) carrying out electric tests for electric components of said integrated circuit and an appearance test for an area of said semiconductor wafer so as to produce pieces of electric test data information each representative of a first diagnosis or a second diagnosis of one of said electric components and a piece of appearance test data information representative of a diagnosis of said area, and b) making said pieces of electric test data information representative of either first or second diagnosis depending upon the ratio of the electric components diagnosed to be said first diagnosis to the electric components diagnosed to be said second diagnosis. - View Dependent Claims (6)
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7. A method for analyzing pieces of data information obtained from an integrated circuit fabricated on a semiconductor wafer, comprising the steps of:
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a) carrying out electric tests for electric components of said integrated circuit and an appearance test for an area of said semiconductor wafer so as to produce pieces of electric test data information each representative of a first diagnosis or a second diagnosis of one of said electric components and a piece of appearance test data information representative of a diagnosis of said area; and b) making said pieces of electric test data information representative of either first or second diagnosis depending upon the ratio of the electric components diagnosed to be said first diagnosis to the electric components diagnosed to be said second diagnosis, wherein a high level-analysis is carried out by assigning coordinates on said semiconductor wafer to each electric defect, as represented in said electric test data information, and results of said high level-analysis are used to determine a pattern of said electric defects. - View Dependent Claims (8)
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Specification