High resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof

• US 6,049,958 A
• Filed: 11/19/1997
• Issued: 04/18/2000
• Est. Priority Date: 01/08/1997
• Status: Expired due to Term

• Current Assignee: Volcano Corporation (Koninklijke Philips N.V.)
• Original Assignee: Endosonics Corporation (JOMED NV)
• Inventors: Eberle, Michael J., Finsterwald, P. Michael
• Primary Examiner(s): Young, Lee
• Assistant Examiner(s): NGUYEN, BINH AN DUC
• Application Number:
  US08/974,677
• Time in Patent Office: 881 Days
• Field of Search: 29/25.35, 310/334, 310/336, 600/437, 600/462, 600/439, 600/459, 128/662.03, 128/661.1
• US Class Current: 29/25.35
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 8/12 in body cavities or body tracts, e.g. by using catheters catheters per se A61M25/00
• CPC Class Codes: A61B 8/445 Details of catheter construction
• CPC Class Codes: A61B 8/4488 the transducer being a phased array
• CPC Class Codes: B06B 1/0622 on one surface
• CPC Class Codes: B06B 1/0633 Cylindrical array
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

An ultrasound transducer assembly of the present invention includes a flexible circuit to which an ultrasound transducer array and integrated circuitry are attached during fabrication of the ultrasound transducer assembly. Integrated circuitry and transducer elements are attached to the flexible circuit while the flexible circuit is in a substantially flat shape. The contacts of the transducer elements are positioned on substantially the same plane such that electrical contact with signal and ground lines on the flexible circuit is established without the need for conductive bridges to physically remote electrodes. In an embodiment of the invention wherein the transducer elements are arranged in a cylindrical array, gaps are entirely filled with backing material having a relatively low acoustic impedance. Structure integrity is enhanced and a path to ground facilitated by electrically conductive disks attached to the ends of the transducer assembly.

Claims

1. A method for fabricating an ultrasound transducer assembly comprising a flexible circuit, integrated circuitry, and a set of transducer elements for facilitating providing images from within a cavity, the method comprising the steps:

fabricating the flexible circuit comprising a flexible substrate and a set of electrically conductive lines formed on an inner surface of the flexible substrate;

fabricating a transducer sheet comprising a transducer material, a signal electrode and a ground electrode, wherein a first contact on the signal electrode and a second contact on the ground electrode contact for each transducer element are arranged upon substantially a same physical plane; and

attaching the transducer sheet to the flexible circuit while the flexible circuit is in a substantially flat shape such that the first contact and second contact for each transducer element abuts corresponding pads of the electrically conductive lines on the inner surface of the flexible circuit.

2. The method of claim 1 further comprising the step of re-shaping the flexible circuit into a substantially non-flat shape after the steps of fabricating a transducer sheet and attaching the transducer sheet to the flexible circuit.

3. The method of claim 1 wherein the fabricating a transducer sheet step comprises the sub-step of creating first and second discontinuities in a continuous metal layer thereby defining the signal electrode and ground electrode for each transducer element.

4. The method of claim 3 wherein the first discontinuity is located on a surface of each transducer element primarily comprising the signal electrode and the second discontinuity is located on a surface of each transducer element primarily comprising the ground electrode.

5. The method of claim 2 wherein the re-shaping step comprises reforming the flexible circuit into a cylindrical shape.

6. The method of claim 5 further comprising the step of filling spaces within the ultrasound transducer assembly between a lumen tube, the flex circuit, the set of transducer elements and the integrated circuitry with a backing material characterized by relatively low acoustic impedance.

7. The method of claim 6 further comprising the step of fabricating a subassembly comprising the lumen tube and at least a first disc attached to the lumen tube and wherein the outer edges of the first disc abut the re-shaped flexible substrate thereby enhancing the structural integrity of the ultrasound transducer assembly.

8. The method of claim 7 wherein the first disc comprises a conductive material and wherein the first disc provides a portion of an electrically conductive path between the ground electrodes and an external ground signal.

9. The method of claim 8 wherein the first disc is positioned at an end of the transducer assembly including the set of transducer elements, and further comprising the step of attaching a second disc to the lumen tube positioned at an opposite end of the transducer assembly including the integrated circuitry, and wherein outer edges of the second disc abut the re-shaped flexible circuit.

10. The method of claim 2 wherein the ultrasound transducer assembly has a substantially cylindrical shape having suitable dimensions for providing images from within a blood vessel, and wherein the diameter of the substantially cylindrical ultrasound transducer assembly is on the order of 0.3 to 5.0 millimeters.

11. The method of claim 1 further comprising the step of dicing the transducer sheet into a set of discrete transducer elements.

12. The method of claim 1 wherein the flexible substrate provides a quarter-wave matching layer for the transducer elements.

13. The method of claim 1 wherein the flexible substrate provides an acoustic matching layer for the transducer elements.