Method and apparatus for cooling an electronic device

• US 6,050,326 A
• Filed: 05/12/1998
• Issued: 04/18/2000
• Est. Priority Date: 05/12/1998
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Gardell, David L., Evans, Richard J., Palagonia, Anthony M.
• Primary Examiner(s): LEO, LEONARD R
• Application Number:
  US09/076,270
• Time in Patent Office: 707 Days
• Field of Search: 165/80.2, 165/86, 165/185, 361/704, 361/714, 361/715
• US Class Current: 165/80.2
• CPC Class Codes: F28D 19/04 using rigid bodies, e.g. mounted on a movable carrier
• CPC Class Codes: F28D 2021/0028 for cooling heat generating elements, e.g. for cooling electronic components or electric devices
• CPC Class Codes: F28F 2215/14 in the form of movable or loose fins
• CPC Class Codes: F28F 5/00 Elements specially adapted for movement
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation apparatus for cooling one or more electronic devices. The apparatus utilizes a moving heat sink a portion of which is in contact with the device to be cooled. The moving heat sink may be in the form of a rotating disk, moving belt or strip. The heat sink may be made from various materials such as metals or plastics.

Claims

1. A heat transfer system for cooling an electronic device having an outer surface comprising:

a heat transfer element having a first surface, said first surface having an area larger than the outer surface of the electronic device;

a first means for pressing a portion of said first surface of heat transfer element in thermal contact with the outer surface of the electronic device; and

a second means for moving the heat transfer element relative to the outer surface of the electronic device so as to continuously bring different portions of the first surface of the heat transfer element in slipping contact with the outer surface of the electronic device.

2. The system of claim 1 wherein the second means imparts rotational motion.

3. The system of claim 1 wherein the heat transfer element is in the form of a disk.

4. The system of claim 3 wherein the heat transfer element is comprises metal, plastic or rubber.

5. The system of claim 1 wherein the second means imparts linear translational motion.

6. The system of claim 5 wherein the heat transfer element is in the form of a continuous belt.

7. The system of claim 6 includes a belt guide having a first surface in slipping contact with one surface of said belt and a second surface in contact with the outer surface of the electronic device.

8. The system of claim 1 wherein said second means imparts reciprocating translational motion.

9. The system of claim 8 wherein the heat transfer element is in the form of a strip.

10. The system of claim 1 wherein the first means comprises a spring pressing against a pressure plate wherein the surface of the plate is in slipping contact with a portion of the heat transfer element which is in contact with the outer surface of the electronic device.

11. The system of claim 1 wherein the first means comprises a roller pressing against a portion of the heat transfer element which is in contact with the outer surface of the electronic device.

12. The system of claim 11 wherein the rollers are segmented into individually rotatable disks.

13. The system of claim 1 includes a third means for controlling the speed of motion of the heat transfer element based on cooling requirements of the electronic device.

14. A method of dissipating heat from an electronic device having an outer surface comprising:

pressing a portion of at least one surface of a heat transfer element which is larger than the outer surface of the electronic device, against the outer surface of the electronic device in slipping contact; and

moving the heat transfer element relative to the outer surface of the electronic device so as to continuously bring different portions of the surface of the heat transfer element in slipping contact with the outer surface of the electronic device.

15. The method of claim 14 wherein the heat transfer element is in the form of a rotatable disk.

16. The method of claim 14 wherein the heat transfer element has a high thermal conductivity between 0.1 and 50 W/m°

C.

17. The method of claim 14 wherein the heat transfer element is in the form of a continuous belt moveable in a linear direction.

18. The method of claim 14 wherein the heat transfer element is in the form of a strip capable of reciprocating motion in a linear direction.

19. The method of claim 14 further comprising controlling the speed of moving the heat transfer element relative to the electronic device such that the speed is based on cooling requirements of the electronic device.

20. A method of keeping a plurality of electronic devices at a reduced operating temperature, each device having an outer surface comprising;

pressing a portion of one surface which is larger than the combined outer surfaces of said plurality of electronic devices of a moveable heat transfer element against each outer surface of the plurality of electronic devices in slipping contact so as to be able to continuously bring different portions of the surface of the heat transfer element into slipping contact with each outer surface of the plurality of electronic devices; and

moving the heat transfer element until the temperature of each of the plurality of devices reaches a first preset limit, at which time the movement of the heat transfer element is stopped, and later resuming movement of the heat transfer element when the temperature difference between any of the plurality of devices exceeds a second preset limit.

21. The method of claim 20 wherein the heat transfer element is in the form of a rotatable disk.

22. The method of claim 20 wherein the heat transfer element comprises metal, plastic or rubber.

23. The method of claim 20 wherein the heat transfer element is in the form a continuous belt moveable in a linear direction.

24. The method of claim 20 wherein the heat transfer element is in the form of a strip capable of reciprocating motion in a linear direction.