Electronic component package with posts on the active side of the substrate

• US 6,051,489 A
• Filed: 05/13/1997
• Issued: 04/18/2000
• Est. Priority Date: 05/13/1997
• Status: Expired due to Term

• Current Assignee: Chip Systems Innovations, LLC
• Original Assignee: Chipscale
• Inventors: Young, James L., Chen, Changsheng
• Primary Examiner(s): Picardat, Kevin M.
• Application Number:
  US08/855,106
• Time in Patent Office: 1,071 Days
• Field of Search: 438/612, 438/613, 438/614, 438/615, 257/737, 257/780, 257/786, 257/781
• US Class Current: 438/612
• CPC Class Codes: H01L 2224/02 Bonding areas; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/02375 Top view
• CPC Class Codes: H01L 2224/02377 Fan-in arrangement
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05169 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/0616 Random array, i.e. array with no symmetry
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/13008 Bump connector integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13566 Both on and outside the bonding interface of the bump connector
• CPC Class Codes: H01L 2224/13644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 24/02 Bonding areas on insulating substrates, e.g. chip carriers, H01L23/49816, H01L23/49838, H01L23/5389; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/10 : Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01073 : Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/12036 : PN diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A method and apparatus for an electronic component package using wafer level processing is provided. Posts are formed on the active side of the substrate of an electronic component. A conductive layer leads the contact areas of the electronic component to the tops of the posts. The conductive layer on the top of the posts acting as leads, attaching to traces on a printed circuit board.

Claims

1. A method of making an electronic component package of an electronic component having a plurality of contact areas on an active side of a substrate, the method comprising the steps of:

forming a plurality of posts on the active side of the substrate;

depositing a conductive layer electrically coupling each one of the plurality of contact areas with its respective one of the plurality of posts, thereby forming a packaged electronic component, the conductive layer further for contacting traces on a printed circuit board.

2. The method of claim 1 wherein said step of forming a plurality of posts comprises the steps of:

attaching a cap to the active side of the substrate;

patterning the cap to form a plurality of trenches, the plurality of trenches defining the plurality of posts.

3. The method of claim 2 wherein said step of attaching a cap comprises the step of coupling the cap to the active side of the substrate.

4. The method of claim 2 wherein said step of attaching a cap comprises the step of spinning on the cap made of an encapsulant material.

5. The method of claim 2 wherein said step of attaching a cap comprises the step of growing the cap on the active side of the substrate.

6. The method of claim 2 wherein said step of patterning the cap comprises the step of photo imaging the cap material.

7. The method of claim 2 wherein said step of patterning the cap comprises the step of etching the cap material.

8. The method of claim 2 wherein said step of patterning the cap comprises the step of stenciling the cap material.

9. The method of claim 2 wherein said step of forming a plurality of posts comprises the step of:

stenciling the plurality of posts on to the active side of the substrate.

10. The method of claim 1 wherein said step of forming a plurality of posts comprises the step of:

coupling a sheet of preformed material to the active side of the substrate, the sheet of material including the plurality of posts.

11. The method of claim 1 further comprising depositing a first insulating layer over the plurality of contact areas, prior forming the plurality of posts.

12. The method of claim 1 further comprising depositing a second insulating layer over the plurality of posts.

13. The method of claim 1 wherein the step of forming the plurality of posts further forms a center area.

14. The method of claim 13 wherein said step of forming the conductive layer further forms the conductive layer over a top of the center area, allowing the center area to act as a heat sink.

15. The method of claim 2 further comprising the step of thinning the cap prior to the step of patterning the cap.

16. The method of claim 15 wherein said step of thinning the cap comprises sandblasting and etching the cap.

17. The method of claim 15 wherein said step of thinning the cap comprises grinding the cap.

18. The method of claim 15 wherein said step of thinning the cap comprises thinning the cap until it is between 3-15 mils in height.

19. The method of claim 1 further comprising depositing a plurality of metal beams over said contact areas to extend said contact areas, prior to the step of forming the plurality of posts.

20. The method of claim 19 further comprising depositing a barrier layer over the contact areas prior to depositing the metal beams.

21. A method of making an electronic component package for an electronic component having a plurality of contacts, the method comprising the steps of:

depositing gold beams over the plurality of contacts, the gold beams in electrical contact with the plurality of contacts;

depositing a first insulating layer over the electronic component covering the metal beams;

coupling a cap to the electronic component covering the first insulating layer;

patterning the cap to form a plurality of trenches, the trenches defining a plurality of posts and a center area, and the trenches exposing the first insulating layer over the metal beams;

depositing a second insulating layer over the electronic component, covering the posts, and the center area;

etching all layers above the gold beams, thereby exposing at least part of the gold beams;

depositing a conductive layer over the plurality of posts, the conductive layer making electrical contact between the gold beams and the plurality of posts.

22. An electronic component package of an electronic component having a plurality of contact areas on an active side, the electronic component package comprising:

a plurality of posts on the active side of the substrate of the electronic component;

a conductive layer for electrically coupling each one of the plurality of contact areas with its respective one of the plurality of posts, the conductive layer further for contacting traces on a printed circuit board.

23. The electronic component package of claim 22 wherein said plurality of posts comprises:

a cap, the cap patterned to form a plurality of trenches; and

the plurality of trenches defining the plurality of posts.

24. The electronic component package of claim 23 wherein the cap is attached to the active side of the substrate using a glue.

25. The electronic component package of claim 22 wherein said plurality of posts is comprised of stenciled material.

26. The electronic component package of claim 22 wherein said plurality of posts comprises spun on encapsulant material.

27. The electronic component package of claim 22 wherein said plurality of posts comprises material which is grown on the active side of the substrate.

28. The electronic component package of claim 22 wherein said plurality of posts comprises photoimaged material.

29. The electronic component package of claim 22 wherein said plurality of posts is etched material.

30. The electronic component package of claim 22 wherein said plurality of posts is stenciled material.

31. The electronic component package of claim 22 wherein said plurality of posts comprise a sheet of preformed material, the sheet of preformed material including the plurality of posts.

32. The electronic component package of claim 22 further comprising a first insulating layer over the plurality of contact areas, underneath the plurality of posts.

33. The electronic component package of claim 22 further comprising a second insulating layer over the plurality of posts.

34. The electronic component package of claim 22 further comprising a center area.

35. The electronic component package of claim 34 wherein said conductive layer further overlays a top of the center area, allowing the center area to act as a heat sink.

36. The electronic component package of claim 23 wherein the cap comprises is between 3-15 mils in height.

37. The electronic component package of claim 22 further comprising a plurality of metal beams over said contact areas to extend said contact areas, underneath the plurality of posts.

38. The electronic component package of claim 37 further comprising a barrier layer over the contact areas underneath the metal beams.