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Electronic component package with posts on the active side of the substrate

  • US 6,051,489 A
  • Filed: 05/13/1997
  • Issued: 04/18/2000
  • Est. Priority Date: 05/13/1997
  • Status: Expired due to Term
First Claim
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1. A method of making an electronic component package of an electronic component having a plurality of contact areas on an active side of a substrate, the method comprising the steps of:

  • forming a plurality of posts on the active side of the substrate;

    depositing a conductive layer electrically coupling each one of the plurality of contact areas with its respective one of the plurality of posts, thereby forming a packaged electronic component, the conductive layer further for contacting traces on a printed circuit board.

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