Semiconductor pressure sensor including reference capacitor on the same substrate

• US 6,051,853 A
• Filed: 10/03/1997
• Issued: 04/18/2000
• Est. Priority Date: 10/03/1996
• Status: Expired due to Fees

• Current Assignee: Hitachi Car Engineering Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Original Assignee: Hitachi Car Engineering Company Limited (Hitachi, Ltd.), Hitachi, Ltd.
• Inventors: Saito, Akihiko, Matsumoto, Masahiro, Miyazaki, Atsushi, Hanzawa, Keiji, Shimada, Satoshi, Suzuki, Seikou, Ichikawa, Norio, Nakazawa, Terumi
• Primary Examiner(s): Abraham, Fetsum
• Application Number:
  US08/943,205
• Time in Patent Office: 928 Days
• Field of Search: 28/248, 28/249, 28/252, 29/594, 29/595, 29/718, 29/724, 361/280, 361/283.1, 361/283.3, 361/283.4, 257/252, 257/254, 257/417
• US Class Current: 257/252
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: G01L 9/125 with temperature compensating means non electric temperature compensating means G01L19/04

Abstract

A semiconductor pressure sensor utilizing electrostatic capacitance has a plurality of pressure sensing electrostatic capacitances and a reference electrostatic capacitance formed on one side of a silicon chip. As a movable electrode, the pressure sensing electrostatic capacitances each have a diaphragm, which may have a displacement portion composed of a central area thereof, and a peripheral portion which is more deformable than the central portion.

Claims

1. A semiconductor pressure sensor comprising:

a plurality of pressure sensing electrostatic capacitances; and

a reference electrostatic capacitance;

wherein said pressure sensing electrostatic capacitances and said reference electrostatic capacitance are disposed on one side of a silicon chip.

2. A semiconductor pressure sensor according to claim 1, wherein a signal processing circuit for processing signals from said pressure sensing electrostatic capacitances and said reference electrostatic capacitance is disposed on the same side of said silicon chip on which said plurality of capacitances are disposed.

3. A semiconductor pressure sensor according to claim 1, wherein:

an absolute pressure is detected from variation of capacitance of a first one of said pressure sensing electrostatic capacitances;

an atmospheric pressure is detected from variation of capacitance of a second one of said pressure sensing electrostatic capacitances; and

a temperature is detected from variation of capacitance of said reference capacitance.

4. A semiconductor pressure sensor according to claim 3, wherein a pressure relative to atmospheric pressure is detected from a difference between the variation in capacitance of said first pressure sensing electrostatic capacitance and the variation in capacitance of said second pressure sensing electrostatic capacitance.

5. a semiconductor pressure sensor according to claim 4, wherein:

a signal processing circuit is integrally formed on the same side of the silicon chip on which said plurality of capacitances are formed; and

said signal processing circuit is air-tightly and electrostatically bonded by an electrically conductive bonding film formed in a periphery of the signal processing circuits, and with one of a glass film and a glass substrate.

6. A semiconductor pressure sensor according to claim 5, wherein electrostatic capacitance changes of the two sensors formed the same side of the silicon chip are converted into voltage signals, and relative pressure relative to atmospheric pressure is detected from a difference between the voltage signals.

7. A semiconductor pressure sensor according to claim 1, wherein said pressure sensing electrostatic capacitances comprise:

an electrostatic capacitance couple composed of a diaphragm acting as a movable electrode moved in response to a pressure, and a fixed electrode formed opposite to and separated from said diaphragm by a space formed between said diaphragm and said fixed electrode, and insulated from said diaphragm;

a glass plate common to said pressure sensing electrostatic capacitances, and having a first pressure introducing hole therein; and

a bonding film formed in a periphery of said diaphragm for air-tightly bonding said diaphragm to said glass plate.

8. A semiconductor pressure sensor according to claim 7, wherein said bonding film is made of an electrically conductive film material, and electrostatically bonds a reinforcing silicon plate having a second pressure introducing hole which communicates with said first pressure introducing hole through said glass plate.

9. A semiconductor pressure sensor according to claim 8, wherein said diaphragm is separated from an exterior of said pressure sensor by an air-tight space formed between said bonding film and said glass plate.

10. A semiconductor pressure sensor according to claim 1, wherein each of said pressure sensing electrostatic capacitances comprises:

a semiconductor chip;

a fixed electrode provided on said semiconductor chip;

a movable electrode arranged opposite said fixed electrode, and supported at a periphery thereof;

wherein said movable electrode has a displacement portion composed of a central area thereof, and a peripheral portion which is more deformable than said central portion; and

wherein said fixed electrode has a maximum planar extent which is not larger than a planar extent of said central area of said movable electrode.

11. A semiconductor pressure sensor comprising:

a plurality of pressure sensing electrostatic capacitances; and

a reference electrostatic capacitance;

wherein said pressure sensing electrostatic capacitances and said reference electrostatic capacitance are disposed on one side of a silicon chip; and

wherein said reference capacitance is a temperature sensor.

12. A semiconductor pressure sensor of electrostatic capacitance type, comprising:

a substrate;

a fixed electrode provided on said substrate;

a movable electrode arranged opposite said fixed electrode, and supported at a periphery thereof;

wherein said movable electrode has a displacement portion composed of a central area thereof, and a peripheral portion which is more deformable than said central portion; and

wherein said fixed electrode has a maximum planar extent not larger than a planar extent of said central area of said movable electrode.

13. The sensor according to claim 12, further comprising:

a signal processor for calculating the reciprocal of electrostatic capacitance;

wherein said central area of said movable electrode has one of a larger elasticity and a greater thickness than said peripheral portion.

14. The sensor according to claim 12, wherein the central portion of said movable electrode is formed in by a process selected from the group consisting of chemical vapor deposition and gas phase epitaxial growth, and is then shaped by etching.

15. An electrostatic capacitance type sensor, comprising:

a substrate;

a fixed electrode on said substrate; and

a movable electrode having a parallel displacement portion mounted on said substrate, to be deformed by receiving an external force;

wherein a parallel component of parasitic electrostatic capacitance produced in the periphery of said sensor has a magnitude which is no greater than a base capacitance of the sensor portion.

16. The sensor according to claim 15, wherein said movable electrode has a displacement portion composed of a central area thereof, and a peripheral portion which is more deformable than said central portion, and said fixed portion has a maximum planar extent which is not larger than a maximum planar extent said central portion of said movable electrode.

17. A semiconductor pressure sensor comprising:

a substrate;

at least a first pressure sensing electrostatic capacitance which is coupled to receive and measure an ambient pressure;

at least a second pressure sensing electrostatic capacitance which is coupled to receive and measure an absolute pressure; and

a reference electrostatic capacitance which is insulated from effects of changing pressure, and is coupled to at least one of said at least a first pressure sensing electrostatic capacitance and said at least a second pressure sensing electrostatic capacitance, for sensing temperature;

wherein said first, second and reference electrostatic capacitances are formed on the same side of said substrate.

18. The pressure sensor according to claim 17 further comprising:

a first circuit for determining a difference between said first and second pressure sensing electrostatic capacitances and outputting a signal indicative thereof, said first circuit being formed on said substrate on the same side on which said electrostatic capacitances are formed.

19. The pressure sensor according to claim 18 further comprising:

a second circuit for determining a difference between said second pressure sensing electrostatic capacitance and said reference electrostatic capacitance, said second circuit being formed on said substrate on the same side on which said first circuit and said electrostatic capacitances are formed.

20. A semiconductor pressure sensor according to claim 19, wherein said pressure sensing electrostatic capacitances comprise:

an electrostatic capacitance couple composed of a diaphragm acting as a movable electrode moved in response to a pressure, and a fixed electrode formed opposite to and separated from said diaphragm by a space formed between said diaphragm and said fixed electrode, and insulated from said diaphragm;

a glass plate common to said pressure sensing electrostatic capacitances, and having a first pressure introducing hole therein; and

a bonding film formed in a periphery of said diaphragm for air-tightly bonding said diaphragm to said glass plate.

21. A semiconductor pressure sensor according to claim 20, wherein said bonding film is made of an electrically conductive film material, and electrostatically bonds a reinforcing silicon plate having a second pressure introducing hole which communicates with said first pressure introducing hole through said glass plate.

22. A semiconductor pressure sensor according to claim 17, wherein said pressure sensing electrostatic capacitances comprise:

an electrostatic capacitance couple composed of a diaphragm acting as a movable electrode moved in response to a pressure, and a fixed electrode formed opposite to and separated from said diaphragm by a space formed between said diaphragm and said fixed electrode, and insulated from said diaphragm;

a glass plate common to said pressure sensing electrostatic capacitances, and having a first pressure introducing hole therein; and

a bonding film formed in a periphery of said diaphragm for air-tightly bonding said diaphragm to said glass plate.

23. A semiconductor pressure sensor according to claim 22, wherein said bonding film is made of an electrically conductive film material, and electrostatically bonds a reinforcing silicon plate having a second pressure introducing hole which communicates with said first pressure introducing hole through said glass plate.

24. A method of making a semiconductor pressure sensor, comprising:

providing a planar substrate;

forming a plurality of pressure sensing electrostatic capacitances on a single surface of said substrate; and

forming a circuit for processing output signals from said pressure sensing electrostatic capacitances, on the same surface of said substrate on which said pressure sensing electrostatic capacitances are formed.

25. The method according to claim 24, further comprising:

forming a reference electrostatic capacitance on the same surface of said substrate on which said pressure sensing electrostatic capacitances are formed;

wherein said circuit also processes output signals from said reference electrostatic capacitance.

26. The method according to claim 25, wherein said steps of forming pressure sensing and reference electrostatic capacitances comprises:

forming fixed electrodes in a surface of said substrate;

forming an insulator film on said surface of said substrate, including said fixed electrodes,

forming a conductive film on said insulator film; and

selectively removing said insulator film in areas adjacent said fixed electrodes to form a gap between said fixed electrodes and said conductive film.

27. The method according to claim 24, wherein said step of forming pressure sensing electrostatic capacitances comprises:

forming fixed electrodes in a surface of said substrate;

forming an insulator film on said surface of said substrate, including said fixed electrodes,

forming a conductive film on said insulator film; and

selectively removing said insulator film in areas adjacent said fixed electrodes to form a gap between said fixed electrodes and said conductive film.