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Semiconductor chip

  • US 6,051,875 A
  • Filed: 03/04/1998
  • Issued: 04/18/2000
  • Est. Priority Date: 08/20/1997
  • Status: Expired due to Term
First Claim
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1. A semiconductor chip comprising:

  • an outer surface having conductive bond pads proximately associated therewith;

    side edges extending from the outer surface;

    an insulating material layer adhered to at least a portion of the side edges and not formed over the bond pads; and

    wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

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  • 4 Assignments
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