Semiconductor chip

• US 6,051,875 A
• Filed: 03/04/1998
• Issued: 04/18/2000
• Est. Priority Date: 08/20/1997
• Status: Expired due to Term

• Current Assignee: Round Rock Research LLC
• Original Assignee: Micron Technology, Inc.
• Inventors: Dando, Ross S.
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US09/035,777
• Time in Patent Office: 776 Days
• Field of Search: 257/620, 257/787, 257/632, 257/634
• US Class Current: 257/632
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence

Abstract

A method of processing a semiconductive material wafer includes, a) providing a semiconductive material wafer having integrated circuitry fabricated within discrete die areas on the wafer, the discrete die areas having bond pads formed therewithin; b) cutting at least partially into the semiconductive material wafer about the die areas to form a series of die cuts, the cuts having edges; c) depositing an insulative material over the wafer and to within the cuts to at least partially cover the cut edges and to at least partially fill the cuts with the insulative material; d) removing the insulative material from being received over the bond pads and leaving the insulative material within the die cuts; and e) after the removing, cutting into and through the insulative material within the die cuts and through the wafer. A semiconductor chip includes an outer surface having conductive bond pads proximately associated therewith. Side edges extend from the outer surface. An insulating material layer is adhered to at least a portion of the side edges and not formed over the bond pads. The insulative material layer can be continuous and adhered to only a portion of the outer surface and adhered to at least a portion of the side edges. The insulative material preferably has a thickness of between 100 Angstroms and 100 microns.

Claims

1. A semiconductor chip comprising:

an outer surface having conductive bond pads proximately associated therewith;

side edges extending from the outer surface;

an insulating material layer adhered to at least a portion of the side edges and not formed over the bond pads; and

wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

2. A semiconductor chip comprising:

an outer surface having conductive bond pads proximately associated therewith;

side edges extending from the outer surface;

an insulating material layer adhered to at least a portion of the side edges and not formed over the bond pads; and

wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

3. A semiconductor chip comprising:

an outer surface having conductive bond pads proximately associated therewith;

side edges extending from the outer surface;

an insulating material layer adhered to at least a portion of the side edges and not formed over the bond pads; and

the semiconductor chip comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

4. A semiconductor chip comprising:

an outer insulating surface having conductive bond pads proximately associated therewith;

side edges extending from the outer insulating surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating surface and adhered to at least a portion of the side edges; and

wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

5. A semiconductor chip comprising:

an outer insulating surface having conductive bond pads proximately associated therewith;

side edges extending from the outer insulating surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating surface and adhered to at least a portion of the side edges; and

wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

6. A semiconductor chip comprising:

an outer insulating surface having conductive bond pads proximately associated therewith;

side edges extending from the outer insulating surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating surface and adhered to at least a portion of the side edges; and

the semiconductor chip comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

7. A semiconductor chip comprising:

an outer surface having conductive bond pads proximately associated therewith;

side edges extending from the outer surface; and

an insulating material layer adhered to at least a portion of the side edges and having a thickness of between 100 Angstroms and 100 microns.

8. The semiconductor chip of claim 7 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

9. The semiconductor chip of claim 7 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

10. The semiconductor chip of claim 7 wherein the insulating material layer is adhered to all portions of the side edges.

11. The semiconductor chip of claim 7 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

12. A semiconductor chip comprising:

an outer surface having conductive bond pads proximately associated therewith;

side edges extending from the outer surface; and

an insulating material layer adhered to only a portion of the side edges and not formed over the bond pads.

13. The semiconductor chip of claim 12 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

14. The semiconductor chip of claim 12 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

15. The semiconductor chip of claim 12 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

16. A semiconductor chip comprising:

an outer insulating surface having conductive bond pads proximately associated therewith;

side edges extending from the outer insulating surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating surface and adhered to only a portion of the side edges; and

wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

17. A semiconductor chip comprising:

an outer insulating surface having conductive bond pads proximately associated therewith;

side edges extending from the outer insulating surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating surface and adhered to only a portion of the side edges; and

wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

18. A semiconductor chip comprising:

an outer insulating surface having conductive bond pads proximately associated therewith;

side edges extending from the outer insulating surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating surface and adhered to only a portion of the side edges; and

the semiconductor chip comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

19. A semiconductor chip comprising:

an outer surface having conductive bond pads proximately associated therewith;

side edges extending from the outer surface; and

an insulating material layer adhered to at least a portion of the side edges and having a thickness of between 100 Angstroms and 100 microns.

20. The semiconductor chip of claim 19 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

21. The semiconductor chip of claim 19 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

22. The semiconductor chip of claim 19 wherein the insulating material layer is adhered to all portions of the side edges.

23. The semiconductor chip of claim 19 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

24. A semiconductor chip comprising:

an outer front surface having conductive bond pads proximately associated therewith and an outer back surface;

side edges extending from the outer front surface to the outer back surface; and

an insulating material layer adhered to at least a portion of the side edges and not formed over the bond pads, the insulating material layer not being received over the outer back surface.

25. The semiconductor chip of claim 24 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

26. The semiconductor chip of claim 24 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

27. The semiconductor chip of claim 24 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

28. A semiconductor chip comprising:

an outer insulating front surface having conductive bond pads proximately associated therewith and an outer back surface;

side edges extending from the outer insulating front surface to the outer back surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating front surface and adhered to at least a portion of the side edges, the continuous layer of insulative material not being received over the outer back surface; and

wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

29. A semiconductor chip comprising:

an outer insulating front surface having conductive bond pads proximately associated therewith and an outer back surface;

side edges extending from the outer insulating front surface to the outer back surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating front surface and adhered to at least a portion of the side edges, the continuous layer of insulative material not being received over the outer back surface; and

wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

30. A semiconductor chip comprising:

an outer insulating front surface having conductive bond pads proximately associated therewith and an outer back surface;

side edges extending from the outer insulating front surface to the outer back surface;

a continuous layer of insulative material adhered to only a portion of the outer insulating front surface and adhered to at least a portion of the side edges, the continuous layer of insulative material not being received over the outer back surface; and

the semiconductor chip comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

31. A semiconductor chip comprising:

an outer front surface having conductive bond pads proximately associated therewith and an outer back surface;

side edges extending from the outer front surface to the outer back surface; and

an insulating material layer adhered to at least a portion of the side edges and having a thickness of between 100 Angstroms and 100 microns, the insulating material layer not being received over the outer back surface.

32. The semiconductor chip of claim 31 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

33. The semiconductor chip of claim 31 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

34. The semiconductor chip of claim 31 wherein the insulating material layer is adhered to all portions of the side edges.

35. The semiconductor chip of claim 31 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

36. A semiconductor chip comprising:

an outer surface having a pair of conductive bond pads proximately associated therewith, a straight line being extendable between the pair of bond pads;

side edges extending from the outer surface; and

an insulating material layer adhered to at least a portion of the side edges and not formed over the bond pads, the insulating material layer not being received over the straight line.

37. The semiconductor chip of claim 36 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

38. The semiconductor chip of claim 36 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

39. The semiconductor chip of claim 36 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

40. A semiconductor chip comprising:

an outer insulating surface having a pair of conductive bond pads proximately associated therewith, a straight line being extendable between the pair of bond pads;

side edges extending from the outer insulating surface; and

a continuous layer of insulative material adhered to only a portion of the outer insulating surface and adhered to at least a portion of the side edges, the insulating material layer not being received over the straight line.

41. The semiconductor chip of claim 40 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

42. The semiconductor chip of claim 40 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

43. The semiconductor chip of claim 40 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.

44. A semiconductor chip comprising:

an outer surface having a pair of conductive bond pads proximately associated therewith, a straight line being extendable between the pair of bond pads;

side edges extending from the outer surface; and

an insulating material layer adhered to at least a portion of the side edges and having a thickness of between 100 Angstroms and 100 microns, the insulating material layer not being received over the straight line.

45. The semiconductor chip of claim 44 wherein the insulating material layer has a thickness between about 100 Angstroms and 10 microns.

46. The semiconductor chip of claim 44 wherein the insulating material layer has a thickness between about 10 microns and 100 microns.

47. The semiconductor chip of claim 44 wherein the insulating material layer is adhered to all portions of the side edges.

48. The semiconductor chip of claim 44 comprising a flip chip having conductive material bumped over the bond pads, said conductive material being formed to a greater thickness than a thickness of the insulating material layer.