Semiconductor stacked device for implantable medical apparatus

• US 6,051,887 A
• Filed: 08/28/1998
• Issued: 04/18/2000
• Est. Priority Date: 08/28/1998
• Status: Expired due to Term

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Hubbard, Robert L.
• Primary Examiner(s): Clark, Sheila V.
• Application Number:
  US09/143,141
• Time in Patent Office: 599 Days
• Field of Search: 257/685, 257/686, 257/777, 257/778
• US Class Current: 257/777
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06586 Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/14 Integrated circuits

Abstract

A stacked semiconductor device is formed with a first mounting substrate, e.g., a single metal layer die tape, having a first semiconductor die attached thereto and a second mounting substrate, e.g., a double metal layer die tape having a second semiconductor die attached thereto. Substantially columnar solder connections, each formed from two solder balls are used to stack the first mounting substrate and the second mounting substrate such that the second semiconductor die is positioned between the mounting substrates. For example, identical memory dice may be stacked in this manner or different types of die such as a processor die and a memory die may be stacked in this manner for use in implantable medical apparatus.

Claims

1. A semiconductor stacked device for use in an implantable medical apparatus, the semiconductor stacked device comprising:

a first semiconductor die including a plurality of first die bond pads;

a first mounting substrate including one or more conductive traces on one side of the first mounting substrate for electrical connection to one or more of the plurality of first die bond pads;

a second semiconductor die including a plurality of second die bond pads;

a second mounting substrate including one or more conductive vias therethrough, one or more conductive traces on a first side of the second mounting substrate for use in electrically connecting the first mounting substrate to the second mounting substrate, and one or more conductive traces on a second side of the second mounting substrate for electrical connection to one or more of the plurality of second die bond pads;

a plurality of substantially columnar solder ball connections formed from two solder balls one on top of the other attached to said first mounting substrate and said second mounting substrate; and

said plurality of substantially columnar solder ball connections electrically connecting the conductive traces on the one side of the first mounting substrate to the conductive traces on the first side of the second mounting substrate, wherein the second semiconductor die is located between the first mounting substrate and the second mounting substrate.

2. The device of claim 1, wherein the conductive traces on the first side of the second mounting substrate extend between conductive vias and conductive pad regions proximate at least two opposing edges of the second mounting substrate, and further wherein the conductive traces on the one side of the first mounting substrate extend between die bond pads of the first semiconductor die and conductive pad regions on the one side of the first mounting substrate proximate at least two opposing edges of the first mounting substrate.

3. The device of claim 1, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between one of the conductive vias and one of the die bond pads of the second semiconductor die.

4. The device of claim 1, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between a die bond pad of the second semiconductor die and an external conductive pad region on the second side of the second mounting substrate.

5. The device of claim 1, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between a conductive via and an external conductive pad region on the second side of the second mounting substrate.

6. The device of claim 1, wherein each of the plurality of substantially columnar solder ball connections form spherical pedestals at the first and second mounting substrate with a slender column therebetween wherein one of the two solder balls is positioned in contact with a conductive pad region of the first mounting substrate and the other solder ball is positioned in contact with a corresponding conductive pad region of the second mounting substrate.

7. The device of claim 1, wherein the first and second semiconductor die are of different size.

8. The device of claim 1, wherein the first semiconductor die is a memory die and the second semiconductor die is a processor die.

9. The device of claim 1, wherein the first and second semiconductor die are identical memory dice.

10. The device of claim 9, wherein the device includes at least one conductive path from one of the die bond pads of each of the memory die to a separate corresponding external conductive pad region at the second side of the second mounting substrate.

11. The device of claim 1, wherein the first and second semiconductor die are of different size.

12. The device of claim 11, wherein the first semiconductor die is a memory die and the second semiconductor die is a processor die.

13. The device of claim 1, wherein the first and second semiconductor die are identical memory dice.

14. A semiconductor stacked device, the device comprising:

a first semiconductor die including a plurality of first die bond pads;

a first mounting substrate including a first side and a second side, wherein the first mounting substrate includes one or more first conductive traces for electrical connection to one or more of the plurality of first die bond pads, wherein one or more of the first conductive traces terminate at conductive pad regions at the second side of the first mounting substrate, and further wherein the first semiconductor die is adjacent the first side of the first mounting substrate;

a second semiconductor die including a plurality of second die bond pads;

a second mounting substrate including a first side and a second side, wherein the second mounting substrate includes one or more conductive vias therethrough, one or more conductive traces on the first side of the second mounting substrate for electrical connection to the conductive vias, and one or more conductive traces on the second side of the second mounting substrate for electrical connection to one or more of the plurality of second die bond pads, wherein one or more of the conductive traces on the first side of the second mounting substrate terminate at conductive pad regions, and further wherein the second semiconductor die is adjacent the first side of the second mounting substrate;

a plurality of substantially columnar solder ball connections formed from two solder balls one on top of the other attached to said first mounting substrate and said second mounting substrate; and

said plurality of substantially columnar solder ball connections, each solder ball connection positioned between one of the conductive pad regions on the second side of the first mounting substrate and a corresponding one of the conductive pad regions on the first side of the second mounting substrate.

15. The device of claim 14, wherein the conductive pad regions on the first side of the second mounting substrate are proximate at least two opposing edges of the second mounting substrate, and further wherein the conductive pad regions on the second side of the first mounting substrate are proximate at least two opposing edges of the first mounting substrate wherein each of the plurality of substantially columnar solder ball connections form spherical pedestals at the first and second mounting substrate with a slender column therebetween.

16. The device of claim 14, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between one of the conductive vias and one of the second die bond pads of the second semiconductor die.

17. The device of claim 14, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between a second die bond pad of the second semiconductor die and an external conductive pad region on the second side of the second mounting substrate.

18. The device of claim 14, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between a conductive via and an external conductive pad region on the second side of the second mounting substrate.

19. The device of claim 15, wherein at least three edges of the first mounting substrate have conductive pad regions at the second side of the first mounting substrate proximate thereto, and further wherein at least three edges of the second mounting substrate have conductive pad regions at the first side of the second mounting substrate proximate thereto.

20. The device of claim 15, wherein the conductive pad regions of the first mounting substrate are proximate to and staggered along at least two opposing edges on the second side of the first mounting substrate with alternating conductive pad regions being closer to the edges than the other conductive regions, and further wherein the conductive pad regions of the second mounting substrate are proximate to and staggered along at least two opposing edges at the first side of the second mounting substrate with alternating conductive pad regions being closer to the edges than the other conductive pad regions.

21. The device of claim 14, wherein each of the substantially columnar solder ball connections is formed from two solder balls, one of the two solder balls positioned in contact with a conductive pad region of the first mounting substrate and the other solder ball positioned in contact with a corresponding conductive pad region of the second mounting substrate.

22. The device of claim 14, wherein the first and second semiconductor die are of different size.

23. The device of claim 22, wherein the first semiconductor die is a memory die and the second semiconductor die is a processor die.

24. The device of claim 14, wherein the first and second semiconductor die are identical memory dice.

25. The device of claim 24, wherein the device includes at least one conductive path from one of the die bond pads of each of the memory die to a separate corresponding external conductive pad region at the second side of the second mounting substrate.

26. A semiconductor stacked device, the stacked device comprising:

a single metal layer die tape having a first semiconductor die attached thereto;

a double metal layer die tape having a second semiconductor die attached thereto;

a plurality of substantially columnar solder ball connections formed from two solder balls one on top of the other attached to said first mounting substrate and said second mounting substrate; and

said plurality of substantially columnar solder ball connections electrically connecting the single metal layer die tape to the double metal layer die tape, wherein the second semiconductor die is located between the single metal layer die tape and the double metal layer die tape.

27. The device of claim 26, wherein the single metal layer die tape includes one or more conductive traces on one side of the single metal layer die tape for electrical connection to one or more of a plurality of first die bond pads of the first semiconductor die, wherein the double metal layer die tape includes one or more conductive vias therethrough, one or more conductive traces on a first side of the double metal layer die tape for use in electrically connecting the single metal layer die tape to the double metal layer die tape, and one or more conductive traces on a second side of the double metal layer die tape for electrical connection to one or more of a plurality of second die bond pads of the second semiconductor die, and further wherein the plurality of solder ball columns electrically connect the conductive traces on the one side of the single metal layer die tape to the conductive traces on the first side of the double metal layer die tape.

28. The device of claim 27, wherein each of one or more of the conductive traces on the first side of the double metal layer die tape extend between conductive vias and terminate at conductive pad regions proximate at least two opposing edges of the double metal layer die tape, and further wherein each of one or more of the conductive traces on the one side of the single metal layer die tape extend between die bond pads of the first semiconductor die and conductive pad regions on the second side of the single metal layer die tape proximate at least two opposing edges of the single metal layer die tape.

29. The device of claim 28, wherein each of one or more of the conductive traces on the second side of the double metal layer die tape extend between one of the conductive vias and one of the die bond pads of the second semiconductor die, extend between a die bond pad of the second semiconductor die and an external conductive pad region on the second side of the double metal layer die tape, and extend between conductive via and the external conductive pad region on the second side of the double metal layer die tape.

30. The device of claim 28, wherein each of the solder ball columns is formed from two solder balls, one of the two solder balls is positioned in contact with a conductive pad region of the single metal layer die tape and the other solder ball is positioned in contact with a corresponding conductive pad region of the double metal layer die tape.

31. A stacked memory device, the device comprising:

a first memory die including a plurality of first die bond pads;

a first mounting substrate including one or more conductive traces on one side of the first mounting substrate for electrical connection to one or more of the plurality of first die bond pads;

a second memory die including a plurality of second die bond pads;

a second mounting substrate including one or more conductive vias therethrough, one or more conductive traces on a first side of the second mounting substrate for use in electrically connecting the first mounting substrate to the second mounting substrate, and one or more conductive traces on a second side of the second mounting substrate for electrical connection to one or more of the plurality of second die bond pads;

a plurality of substantially columnar solder ball connections formed from two solder balls one on top of the other attached to said first mounting substrate and said second mounting substrate; and

said plurality of substantially columnar solder ball connections electrically connecting the conductive traces on the one side of the first mounting substrate to the conductive traces on the first side of the second mounting substrate, wherein the second memory die is located between the first mounting substrate and the second mounting substrate.

32. The device of claim 31, wherein each of one or more of the conductive traces on the first side of the second mounting substrate extend between one of the conductive vias and terminate at conductive pad regions proximate at least two opposing edges of the second mounting substrate, and further wherein each of one or more of the conductive traces on the one side of the first mounting substrate extend between a die bond pad of the first semiconductor die and conductive pad regions on the second side of the first mounting substrate proximate at least two opposing edges of the first mounting substrate.

33. The device of claim 32, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between one of the conductive vias and one of the die bond pads of the second memory die, extend between a die bond pad of the second memory die and an external conductive pad region on the second side of the second mounting substrate, and extend between a conductive via and the external conductive pad region on the second side of the second mounting substrate.

34. The device of claim 33, wherein the device includes at least one conductive path from one of the die bond pads of each of the first memory die and second memory die to a separate corresponding external conductive pad region at the second side of the second mounting substrate.

35. A stacked device, the device comprising:

a memory die including a plurality of first die bond pads;

a first mounting substrate including one or more conductive traces on one side of the first mounting substrate for electrical connection to one or more of the plurality of first die bond pads;

a processor die including a plurality of second die bond pads;

a second mounting substrate including one or more conductive vias therethrough, one or more conductive traces on a first side of the second mounting substrate for use in electrically connecting the first mounting substrate to the second mounting substrate, and one or more conductive traces on a second side of the second mounting substrate for electrical connection to one or more of the plurality of second die bond pads; and

a plurality of solder ball columns electrically connecting the conductive traces on the one side of the first mounting substrate to the conductive traces on the first side of the second mounting substrate, wherein the processor die is located between the first mounting substrate and the second mounting substrate.

36. The device of claim 35, wherein each of one or more of the conductive traces on the first side of the second mounting substrate extend between one of the conductive vias and terminate at conductive pad regions proximate at least two opposing edges of the second mounting substrate, and further wherein each of one or more of the conductive traces on the one side of the first mounting substrate extend between a die bond pad of the memory die and conductive pad regions on the second side of the first mounting substrate proximate at least two opposing edges of the first mounting substrate.

37. The device of claim 36, wherein each of one or more of the conductive traces on the second side of the second mounting substrate extend between one of the conductive vias and one of the die bond pads of the processor die, extend between a die bond pad of the processor die and an external conductive pad region on the second side of the second mounting substrate, and extend between a conductive via and the external conductive pad region on the second side of the second mounting substrate.