Method and apparatus providing an optical input/output bus through the back side of an integrated circuit die

• US 6,052,498 A
• Filed: 12/19/1997
• Issued: 04/18/2000
• Est. Priority Date: 12/19/1997
• Status: Expired due to Term

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Paniccia, Mario J.
• Primary Examiner(s): Lee, John D.
• Assistant Examiner(s): Stahl, Michael J.
• Application Number:
  US08/994,980
• Time in Patent Office: 851 Days
• Field of Search: 385/14
• US Class Current: 385/14
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

A method and an apparatus providing an optical input/output bus in an integrated circuit by optically routing input/output signals between integrated circuit nodes. In one embodiment, input/output signals are optically routed back and forth through the back side semiconductor substrate of a flip chip packaged integrated circuit die. An optical assembly used to generate and direct the light beams of the optical bus may be included within a heat sink thermally coupled to the back side silicon substrate of the integrated circuit die. Alternatively, the optical assembly may be embedded into the back side silicon substrate of the integrated circuit die. In operation, a light beam is directed through the back side semiconductor substrate onto an optical modulator. The optical modulator modulates and deflects the light beam. The deflected light beam is routed to a deflector that directs the modulated and deflected light beam through the back side semiconductor substrate onto an optical demodulator.

Claims

1. An optical bus, comprising:

an optical unit that generates a plurality of light beams, each one of the plurality of light beams corresponding to one bit line of the optical bus; and

an optical assembly that directs each one of the plurality of light beams through a back side of an integrated circuit die onto a corresponding one of a plurality of optical output devices disposed within a semiconductor substrate of the integrated circuit die, the optical assembly to direct each one of a plurality of deflected light beams deflected from the plurality of optical output devices onto a corresponding one of a plurality of optical input devices disposed within the semiconductor substrate of the integrated circuit die, the integrated circuit die having a front side and the back side, the back side including the semiconductor substrate of the integrated circuit die.

2. The optical bus of claim 1 wherein the optical unit comprises:

a light source that generates the plurality of light beams; and

a lens that focuses and collimates the plurality of light beams, the lens optically coupled between the light source and the optical assembly.

3. The optical bus of claim 1 wherein the optical unit and the optical assembly are disposed within a thermal conductor to be thermally coupled to the back side of the integrated circuit die.

4. The optical bus of claim 1 wherein the optical output devices comprise optical modulators and the optical input devices comprise optical demodulators.

5. The optical bus of claim 1 wherein the plurality of light beams and the plurality of deflected light beams comprise infrared light and wherein the semiconductor substrate comprises silicon.

6. The optical bus of claim 1 wherein the optical assembly comprises:

a first beam splitter/deflector that directs at least one of the plurality of light beams to at least one of the plurality of optical output devices, the first beam splitter/deflector optically coupled between the optical unit and the plurality of optical output devices; and

a second beam deflector that directs at least one of the plurality of deflected light beams to at least one of the optical input devices, the second beam deflector optically coupled to receive the at least one of the plurality of deflected light beams from the first beam splitter/deflector.

7. The optical bus of claim 1 wherein the integrated circuit die comprises a flip chip packaged integrated circuit die.

8. The optical bus of claim 1 wherein the optical unit and the optical assembly are disposed within the back side of the integrated circuit die.

9. The optical bus of claim 1 wherein the optical unit comprises:

a light source that generates an individual light beam; and

a diffractive element that splits the individual light beam into the plurality of light beams.

10. An optical bus, comprising:

an infrared light source that generates a plurality of light beams, the light source embedded into a back side of a semiconductor substrate of an integrated circuit die, the integrated circuit die having a front side and the back side, the back side including the semiconductor substrate of the integrated circuit die;

a first beam splitter/deflector that directs at least one of the plurality of light beams through the back side of the semiconductor substrate onto a corresponding one of a plurality of optical output devices disposed within the semiconductor substrate, the first beam splitter/deflector embedded into the back side of the semiconductor substrate; and

a second beam deflector that directs the at least one of the plurality of light beams through the back side of the semiconductor substrate onto an optical input device disposed within the semiconductor substrate, the second beam deflector embedded into the back side of the semiconductor substrate, the second beam deflector optically coupled to receive the at least one of the plurality of light beams from the first beam splitter/deflector.

11. The optical bus of claim 10 wherein the semiconductor substrate includes a first channel disposed between the light source and the first beam splitter/deflector such that the light source and the first beam splitter/deflector are optically coupled with the at least one of the plurality of light beams passing through the first channel and without passing through the semiconductor substrate.

12. The optical bus of claim 11 wherein the semiconductor substrate includes a second channel disposed between the first beam splitter/deflector and the second beam deflector such that the at least one of the plurality of light beams is directed from the first beam splitter/deflector through the second channel to the second beam deflector without passing through the semiconductor substrate.

13. The optical bus of claim 10 wherein power and control are coupled to the light source through the semiconductor substrate from the front side of the integrated circuit die.

14. The optical bus of claim 10 wherein power is coupled to the light source from a power source external to the integrated circuit die.

15. The optical bus of claim 10 wherein the first beam splitter/deflector and the second beam deflector are fabricated into a back side surface of the semiconductor substrate.

16. The optical bus of claim 15 wherein the first beam splitter/deflector and the second beam deflector include a reflective material deposited over respective angled surfaces disposed on the back side surface of the semiconductor substrate.

17. The optical bus of claim 12 wherein the first and second channels include first and second grooves, respectively, disposed in a back side surface of the semiconductor substrate.

18. An optical bus, comprising:

an optical unit that generates a plurality of light beams, each one of the plurality of light beams corresponding to one bit line of the optical bus; and

an optical assembly that directs each one of the plurality of light beams through a back side of a first integrated circuit die onto a corresponding one of a plurality of optical output devices disposed within a semiconductor substrate of the first integrated circuit die, the first integrated circuit die having a front side and the back side, the back side of the first integrated circuit die including the semiconductor substrate of the first integrated circuit die, the optical assembly to direct each one of a plurality of deflected light beams deflected from the plurality of optical output devices onto a corresponding one of a plurality of optical input devices disposed within a semiconductor substrate of a second integrated circuit die, the second integrated circuit die having a front side and a back side, the back side of the second integrated circuit die including the semiconductor substrate of the integrated circuit die.

19. The optical bus of claim 18 wherein the optical unit and the optical assembly are disposed within a thermal conductor to be thermally coupled to the back sides of the first and second integrated circuit dice.

20. The optical bus of claim 18 wherein the plurality of optical output devices comprise optical modulators and the plurality of optical input devices comprise optical demodulators.

21. The optical bus of claim 18 wherein the plurality of light beams and the plurality of deflected light beams comprise infrared light and wherein the semiconductor substrates of the first and second integrated circuit dice comprise silicon.

22. The optical bus of claim 18 wherein the optical assembly comprises:

a first beam splitter/deflector that directs at least one of the plurality of light beams to at least one of the plurality of optical output devices, the first beam splitter/deflector optically coupled between the optical unit and the plurality of optical output devices; and

a second beam deflector that directs each one of the plurality of light beams to at least one of the optical input devices, the second beam deflector optically coupled to receive the at least one of the plurality of light beams from the first beam splitter/deflector.

23. The optical bus of claim 18 wherein the first integrated circuit die comprises a processor and the second integrated circuit die comprises an off chip cache.

24. A method of providing an optical bus, comprising:

directing a plurality of light beams through a back side of a semiconductor substrate of an integrated circuit die onto corresponding ones of a plurality of optical output devices disposed within the semiconductor substrate of the integrated circuit die, the integrated circuit die having a front side and the back side, the back side including the semiconductor substrate of the integrated circuit die;

deflecting the plurality of light beams from the plurality of optical output devices such that a plurality of deflected light beams are directed through the back side of the integrated circuit die to an optical assembly;

deflecting the plurality of deflected light beams through the back side of the semiconductor substrate of the integrated circuit onto corresponding ones of a plurality of optical input devices disposed within the semiconductor substrate of the integrated circuit die.

25. The method of claim 24 wherein directing the plurality of light beams through the back side of the semiconductor substrate of the integrated circuit die onto the corresponding ones of the plurality of optical output devices includes focusing and collimating the plurality of light beams.

26. A method of providing an optical bus, comprising:

embedding a light source that generates a plurality of light beams within a back side of a semiconductor substrate of an integrated circuit die, the integrated circuit die having a front side and the back side, the back side including the semiconductor substrate of the integrated circuit die;

embedding a first beam splitter/deflector within the back side of the semiconductor substrate that directs the plurality of light beams through the back side of the semiconductor substrate of the integrated circuit die onto corresponding first optical input devices disposed within the semiconductor substrate of the integrated circuit die; and

embedding a second beam deflector that directs the plurality of light beams through the back side of the semiconductor substrate of the integrated circuit die onto corresponding second optical input devices disposed within the semiconductor substrate of the integrated circuit die.

27. The method of claim 26 further comprising:

forming a first channel in the semiconductor substrate between the light source and the first beam splitter/deflector; and

forming a second channel in the semiconductor substrate between the first beam splitter/deflector and the second beam deflector, such that at least one of the plurality of light beams is directed through the first channel and the second channel, wherein the light source, the first beam splitter/deflector and the second beam deflector are optically coupled without the at least one of the plurality of light beams passing through the semiconductor substrate.

28. The method of claim 27 wherein directing the at least one of the plurality of light beams with the first beam splitter/deflector and directing the at least one of the plurality of light beams with the second beam deflector comprise:

forming a first angled surface on the back side surface of the semiconductor substrate to form the first beam splitter/deflector; and

forming a second angled surface on the back side surface of the semiconductor substrate to form the second beam deflector.

29. The method of claim 28 further comprising depositing a reflective material over the first and second angled surfaces to form the first beam splitter/deflector and second beam deflector, respectively.

30. A method of providing an optical bus, comprising:

directing a plurality of light beams through a back side of a semiconductor substrate of an integrated circuit die onto corresponding optical output devices disposed within the semiconductor substrate of the integrated circuit die, the integrated circuit die having a front side and the back side, the back side including the semiconductor substrate of the integrated circuit die; and

directing the plurality of light beams deflected from the optical output devices through the back side of the semiconductor substrate of the integrated circuit onto corresponding optical input devices disposed within the semiconductor substrate of the integrated circuit die.

31. The method of claim 30 wherein directing the plurality of light beams through the back side of the semiconductor substrate of the integrated circuit die onto the corresponding optical output devices includes focusing and collimating the plurality of light beams.