Thermoelectrically cooled low noise amplifier and method

• US 6,052,559 A
• Filed: 05/02/1997
• Issued: 04/18/2000
• Est. Priority Date: 05/02/1997
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Buer, Kenneth Vern, Torkington, Richard Scott, Corman, David Warren
• Primary Examiner(s): Hunter, Daniel S.
• Assistant Examiner(s): Woldetatios, Yemane
• Application Number:
  US08/850,540
• Time in Patent Office: 1,082 Days
• Field of Search: 455/427, 455/12.1, 455/13.4, 455/347, 455/349, 455/128, 455/351, 455/217, 455/341, 455/431, 455/343
• US Class Current: 455/12.1
• CPC Class Codes: H03F 1/02 Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
• CPC Class Codes: H03F 1/26 Modifications of amplifiers to reduce influence of noise generated by amplifying elements
• CPC Class Codes: H03F 2200/294 the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/372 Noise reduction and elimination in amplifier
• CPC Class Codes: H04B 1/036 Cooling arrangements

Abstract

A space-based communication system (30), includes a transmission terminal having a transmission antenna (42) and a power amplifier (40) to power the transmission antenna, the power amplifier to generate a power output sufficient to generate an RF signal through the transmission antenna (42), a receive terminal including a receive antenna (45) to receive the RF signal from the transmission terminal and a low noise amplifier (43) to amplify the RF signal channeled through the receive antenna, and a thermoelectric cooler (62) for cooling the low noise amplifier (43) to a predetermined temperature for increasing the sensitivity of the low noise amplifier to minimize the power output generated by the power amplifier required to generate the RF signal thereby minimizing the overall power requirements of the spaced-based communication system (30).

Claims

1. A method of reducing the overall power consumption in a spaced-based microwave communication system, said method comprising the steps of:

providing in a first satellite a transmission terminal including a transmission antenna powered by a power amplifier, the power amplifier to generate a power output sufficient to generate an RF signal through the transmission antenna and sufficient to be directly received at a second satellite;

providing in said second satellite a receive terminal including a receive antenna to receive the RF signal and a low noise amplifier to amplify the RF signal channeled through the receive antenna, said low noise amplifier being fabricated on an Monolithic Microwave Integrated Circuit (MMIC);

cooling the MMIC to a predetermined temperature thereby increasing sensitivity of the low noise amplifier; and

responsive to said cooling step, reducing the power output generated by the power amplifier in the first satellite, thereby reducing the overall power requirements of the spaced-based microwave communication system.

2. The method of claim 1, wherein said step of cooling the MMIC further includes the step of cooling the MMIC with a thermoelectric cooler.

3. The method of claim 2, wherein the RF signal is a frequency division multiplexed RF signal, and wherein said step of cooling the MMIC further includes the steps of:

providing the thermoelectric cooler; and

coupling the thermoelectric cooler directly to the MMIC,

and wherein the method further comprises the steps of;

providing a housing including an upstream end having a first RF connector and a downstream end having a second RF connector;

providing an interconnect substrate carried by said housing in electrical communication with the first RF connector and the second RF connector; and

providing the MMIC electrically coupled to said interconnect substrate and located in a hole of said substrate, the hole being intermediate said a RF connector and a second RF connector, the MMIC being substantially planar with the interconnect substrate;

providing the thermoelectric cooler in a recess in said housing, said recess being adjacent to said hole and coupled to a heat spreader.

4. A method of reducing the overall power consumption in a spaced-based microwave communication system, said method comprising the steps of:

providing a transmission terminal in a first satellite including,

providing a transmission antenna, and

providing a power amplifier to power the transmission antenna, the power amplifier to generate a power output sufficient to generate an RF signal through the transmission antenna and sufficient to be directly received at a second satellite;

providing a receive terminal in said second satellite including,

providing a receive antenna to directly receive the RF signal from the first satellite, and

providing a low noise amplifier to amplify the RF signal channeled through the receive antenna, said low noise amplifier being fabricated on an Monolithic Microwave Integrated Circuit (MMIC);

cooling the MMIC to a predetermined temperature thereby increasing sensitivity of the low noise amplifier; and

responsive to said cooling step, reducing the power output generated by said power amplifier in the first satellite, thereby reducing the overall power requirements of the spaced-based microwave communication system.

5. The method of claim 4, wherein said step of providing a low noise amplifier further includes the steps of:

providing a housing including an upstream end having a first RF connector and a downstream end having a second RF connector;

providing an interconnect substrate carried by said housing in electrical communication with the first RF connector and the second RF connector; and

providing the MMIC electrically coupled to said interconnect substrate and located in a hole of said substrate, the hole being intermediate said first RF connector and said second RF connector, the MMIC being substantially planar with the interconnect substrate;

providing the thermoelectric cooler in a recess in said housing, said recess being adjacent to said hole and coupled to a heat spreader.

6. The method of claim 5, wherein the RF signal is a frequency division multiplexed RF signal, and wherein said step of cooling the MMIC further includes the steps of:

providing a thermoelectric cooler; and

coupling the thermoelectric cooler directly to the MMIC, the thermoelectric cooler for cooling the MMIC to increase said sensitivity of the low noise amplifier.

7. A spaced-based microwave communication system comprising:

a first satellite transmission terminal including a transmission antenna powered by a power amplifier;

a second satellite receive terminal wherein the power amplifier generates a power output sufficient to generate an RF signal through the transmission antenna and sufficient to be directly received at the second satellite, the second satellite receive terminal including a receive antenna to receive the RF signal and a low noise amplifier to amplify the RF signal channeled through the receive antenna, said low noise amplifier being fabricated on an Monolithic Microwave Integrated Circuit (MMIC); and

a thermoelectric cooling device for cooling the MMIC to a predetermined temperature thereby increasing sensitivity of the low noise amplifier,

wherein the power output generated by the power amplifier in the first satellite is reduce in response to the cooling thereby reducing the overall power requirements of the spaced-based microwave communication system.

8. The space-based microwave communication system as claimed in claim 7 wherein the RF signal is a frequency division multiplexed RF signal, and wherein said thermoelectric cooling device further comprises:

a housing including an upstream end having a first RF connector and a downstream end having a second RF connector; and

an interconnect substrate carried by said housing in electrical communication with the first RF connector and the second RF connector,

wherein the MMIC is electrically coupled to said interconnect substrate and located in a hole of said substrate, the hole being intermediate said a RF connector and a second RF connector, the MMIC being substantially planar with the interconnect substrate, and

wherein the thermoelectric cooler is located in a recess in said housing, said recess being adjacent to said hole and coupled to a heat spreader.