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Apparatus for forming transparent conductive film by sputtering and method therefor

  • US 6,054,024 A
  • Filed: 09/10/1997
  • Issued: 04/25/2000
  • Est. Priority Date: 09/12/1996
  • Status: Expired due to Term
First Claim
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1. An apparatus for forming, by sputtering, a transparent conductive film on to a semiconductor junction layer, said semiconductor junction layer being provided on a conductive substrate which bears at least said transparent conductive film thereon, comprising:

  • means for electrically insulating said conductive substrate; and

    means for maintaining a self bias voltage Vself of said conductive substrate within a range of -50 V≦

    Vself<

    0 V.

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